| N/A | N/A | SPC5744BFK1AVKU2 | NXP Semiconductors | IC MCU 32BIT 1.5MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 36x10b, 16x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 805 | |
 | | SPC5744BK1AMMH2 | NXP Semiconductors | IC MCU 32B 1.5MB FLASH 100MAPBGA | Microcontrollers | 100-MAPBGA (11x11) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 36x10b, 16x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-MAPBGA (11×11) | 852 | |
 | | SPC5744BK1AMMH2R | NXP Semiconductors | IC MCU 32B 1.5MB FLASH 100MAPBGA | Microcontrollers | 100-MAPBGA (11x11) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 36x10b, 16x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-MAPBGA (11×11) | 708 | |
| N/A | N/A | SPC5744BK1AVKU2 | NXP Semiconductors | IC MCU 32BIT 1.5MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 36x10b, 16x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 172 | |
 | | SPC5744BK1AVMH2 | NXP Semiconductors | IC MCU 32B 1.5MB FLASH 100MAPBGA | Microcontrollers | 100-MAPBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 36x10b, 16x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-MAPBGA (11×11) | 250 | |
 | | SPC5744BK1AVMH2R | NXP Semiconductors | IC MCU 32B 1.5MB FLASH 100MAPBGA | Microcontrollers | 100-MAPBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 36x10b, 16x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-MAPBGA (11×11) | 920 | |
 | N/A | SPC5744BK1AVMH6 | NXP Semiconductors | IC MCU 32B 1.5MB FLASH 100MAPBGA | Microcontrollers | 100-MAPBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 36x10b, 16x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-MAPBGA (11×11) | 320 | |
 | | SPC5744BK1CMH2 | NXP Semiconductors | IC MCU 32B 1.5MB FLASH 100MAPBGA | Microcontrollers | 100-MAPBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 36x10b, 16x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-MAPBGA (11×11) | 1,142 | |
 | | SPC5744BK1CMH2R | NXP Semiconductors | IC MCU 32B 1.5MB FLASH 100MAPBGA | Microcontrollers | 100-MAPBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 36x10b, 16x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-MAPBGA (11×11) | 453 | |
 | | SPC5744BSK1AMMH2 | NXP Semiconductors | IC MCU 32B 1.5MB FLASH 100MAPBGA | Microcontrollers | 100-MAPBGA (11x11) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 36x10b, 16x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-MAPBGA (11×11) | 1,027 | |
 | N/A | SPC5744BSK1AMMH6 | NXP Semiconductors | IC MCU 32B 1.5MB FLASH 100MAPBGA | Microcontrollers | 100-MAPBGA (11x11) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 36x10b, 16x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-MAPBGA (11×11) | 25 | |
 | N/A | SPC5744BSK1AVKU2 | NXP Semiconductors | IC MCU 32BIT 1.5MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 36x10b, 16x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,152 | |
| N/A | N/A | SPC5744CBK1ACKU6 | NXP Semiconductors | IC MCU 32BIT 1.5MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 85°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 36x10b, 16x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 212 | |
 | N/A | SPC5744CBK1ACMH6 | NXP Semiconductors | IC MCU 32B 1.5MB FLASH 100MAPBGA | Microcontrollers | 100-MAPBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 36x10b, 16x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-MAPBGA (11×11) | 857 | |
 | | SPC5744CBK1AVKU6 | NXP Semiconductors | IC MCU 32BIT 1.5MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 36x10b, 16x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 339 | |
| N/A | N/A | SPC5744CFK1ACKU6 | NXP Semiconductors | IC MCU 32BIT 1.5MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 85°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 36x10b, 16x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 594 | |
 | N/A | SPC5744CFK1ACMH2 | NXP Semiconductors | IC MCU 32B 1.5MB FLASH 100MAPBGA | Microcontrollers | 100-MAPBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 36x10b, 16x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-MAPBGA (11×11) | 160 | |
 | N/A | SPC5744CFK1ACMH6 | NXP Semiconductors | IC MCU 32B 1.5MB FLASH 100MAPBGA | Microcontrollers | 100-MAPBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 36x10b, 16x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-MAPBGA (11×11) | 762 | |
 | N/A | SPC5744PEK1AMMM5 | NXP Semiconductors | IC MCU 32B 2.5MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 364 | |
 | | SPC5744PFK1AKLQ8 | NXP Semiconductors | IC MCU 32BIT 2.5MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 135°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 135°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 605 | |