 | | SPC5744PFK1AMLQ8 | NXP Semiconductors | IC MCU 32BIT 2.5MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 412 | |
 | | SPC5744PFK1AMLQ9 | NXP Semiconductors | IC MCU 32BIT 2.5MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 427 | |
 | | SPC5744PFK1AMMM8 | NXP Semiconductors | IC MCU 32B 2.5MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 484 | |
 | N/A | SPC5744PFK1MLQ5 | NXP Semiconductors | IC MCU 32BIT 2.5MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,240 | |
 | | SPC5744PGK1AMMM9 | NXP Semiconductors | IC MCU 32B 2.5MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 1,017 | |
 | | SPC5744PK1AMLQ5 | NXP Semiconductors | IC MCU 32BIT 2.5MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,615 | |
 | N/A | SPC5744PK1AMLQ5R | NXP Semiconductors | IC MCU 32BIT 2.5MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,395 | |
 | | SPC5744PK1AMLQ8 | NXP Semiconductors | IC MCU 32BIT 2.5MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,108 | |
 | | SPC5744PK1AMLQ8R | NXP Semiconductors | IC MCU 32BIT 2.5MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,050 | |
 | N/A | SPC5744PK1AMLQ9 | NXP Semiconductors | IC MCU 32BIT 2.5MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 370 | |
 | | SPC5744PK1AMMM8 | NXP Semiconductors | IC MCU 32B 2.5MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 1,716 | |
 | | SPC5744PK1AMMM9 | NXP Semiconductors | IC MCU 32B 2.5MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 1,138 | |
| N/A | N/A | SPC5744PK1AMMM9R | NXP Semiconductors | IC MCU 32B 2.5MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 36x10b, 16x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 1,599 | |
 | N/A | SPC5744PK1MLQ5 | NXP Semiconductors | IC MCU 32BIT 2.5MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 355 | |
 | N/A | SPC5744PK1MLQ5R | NXP Semiconductors | IC MCU 32BIT 2.5MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 592 | |
 | N/A | SPC5744PK1MLQ8 | NXP Semiconductors | IC MCU 32BIT 2.5MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 671 | |
 | N/A | SPC5744PK1MLQ8R | NXP Semiconductors | IC MCU 32BIT 2.5MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 505 | |
 | N/A | SPC5744PK1MLQ9 | NXP Semiconductors | IC MCU 32BIT 2.5MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 222 | |
 | N/A | SPC5744PK1MLQ9R | NXP Semiconductors | IC MCU 32BIT 2.5MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 725 | |
 | N/A | SPC5745BBK1ACKU6 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 36x10b, 16x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 735 | |