 | N/A | SPC5646CCK0MLU1R | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 27x10b, 5x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 698 | |
 | N/A | SPC5646CCK0VLU1 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 27x10b, 5x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 1,184 | |
 | N/A | SPC5646CCK0VLU1R | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 27x10b, 5x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 208 | |
 | N/A | SPC5646CCK0VMJ1 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 33x10b, 10x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 47 | |
 | N/A | SPC5646CCK0VMJ1R | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 33x10b, 10x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 762 | |
 | | SPC5646CF0MLT1 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 208TQFP | Microcontrollers | 208-TQFP (28x28) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 33x10b, 10x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TQFP (28×28) | 986 | |
 | | SPC5646CF0MLU1 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 27x10b, 5x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 806 | |
 | N/A | SPC5646CF0MMJ1 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 33x10b, 10x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 124 | |
 | N/A | SPC5646CF0MMJ1R | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 33x10b, 10x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 72 | |
 | N/A | SPC5646CF0VLT1 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 208TQFP | Microcontrollers | 208-TQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 33x10b, 10x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TQFP (28×28) | 791 | |
 | N/A | SPC5646CF0VLT1R | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 208TQFP | Microcontrollers | 208-TQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 33x10b, 10x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TQFP (28×28) | 1,010 | |
 | N/A | SPC5646CF0VLU1 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 27x10b, 5x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 817 | |
 | N/A | SPC5646CF0VLU1R | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 27x10b, 5x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 317 | |
 | N/A | SPC5646CF0VMJ1 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 33x10b, 10x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 499 | |
 | N/A | SPC5646CF0VMJ1R | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 33x10b, 10x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 1,971 | |
 | N/A | SPC5646CK0MMJ1 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 33x10b, 10x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 488 | |
 | N/A | SPC5646CK0MMJ1R | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 33x10b, 10x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 352 | |
 | N/A | SPC5646CK0VLU1 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 27x10b, 5x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 1,782 | |
 | N/A | SPC5646CK0VLU1R | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 27x10b, 5x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 1,353 | |
 | | SPC564A70B4CFAR | STMicroelectronics | IC MCU 32BIT 2MB FLASH 324PBGA | Microcontrollers | 324-PBGA (23x23) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 324-PBGA (23×23) | 252 | |