Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
SPC5745CFK1AMKU6SPC5745CFK1AMKU6NXP SemiconductorsIC MCU 32BIT 2MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz, 160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Number of I/O:
129
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
517
N/AN/ASPC5745CK1AVMH2NXP SemiconductorsIC MCU 32BIT 2MB FLASH 100LFBGAMicrocontrollers100-MAPBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz, 160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
Peripherals:
DMA, I2S, LVD, POR, WDT
Number of I/O:
65
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 68x10b, 31x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-MAPBGA (11×11)
Package / Case:
100-LFBGA
623
SPC5745RK1MLU3N/ASPC5745RK1MLU3NXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Tri-Core
Speed:
150MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 5.5V
Data Converters:
A/D 12b SAR, 16b Sigma-Delta
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP
782
N/AN/ASPC5745RK1MLU3RNXP SemiconductorsNXP 32-BIT MCU, TRIPLE POWER ARCMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Tri-Core
Speed:
150MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 5.5V
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP
144
N/AN/ASPC5745RK1MMT5NXP SemiconductorsIC MCU 32BIT 3MB FLASH 252MAPBGAMicrocontrollers252-MAPBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z424
Core Size:
32-Bit Tri-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
252-MAPBGA (17×17)
Package / Case:
252-LFBGA
508
SPC5746BBK1AMKU2SPC5746BBK1AMKU2NXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,087
N/AN/ASPC5746BBK1AMKU6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
908
SPC5746BBK1AMMH6N/ASPC5746BBK1AMMH6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 100MAPBGAMicrocontrollers100-MAPBGA (11x11)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-MAPBGA (11×11)
Package / Case:
100-LFBGA
493
SPC5746BFK1AVKU2SPC5746BFK1AVKU2NXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
269
SPC5746BFK1AVMH6SPC5746BFK1AVMH6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 100MAPBGAMicrocontrollers100-MAPBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-MAPBGA (11×11)
Package / Case:
100-LFBGA
992
SPC5746BHK1AMKU6SPC5746BHK1AMKU6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
794
SPC5746BHK1AMMH6N/ASPC5746BHK1AMMH6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 100MAPBGAMicrocontrollers100-MAPBGA (11x11)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
65
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-MAPBGA (11×11)
Package / Case:
100-LFBGA
77
SPC5746BK1AMKU2SPC5746BK1AMKU2NXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
528
SPC5746BK1AMMH2SPC5746BK1AMMH2NXP SemiconductorsSINGLE CORE, 3M FLASHMicrocontrollers100-MAPBGA (11x11)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-MAPBGA (11×11)
Package / Case:
100-LFBGA
306
N/AN/ASPC5746BK1AVKU2NXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,797
SPC5746BK1MKU2SPC5746BK1MKU2NXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
988
SPC5746BK1MKU2RSPC5746BK1MKU2RNXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,149
SPC5746BK1MMJ6SPC5746BK1MMJ6NXP SemiconductorsIC MCU 32BIT 3MB FLSH 256MAPPBGAMicrocontrollers256-MAPPBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Number of I/O:
178
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPPBGA (17×17)
Package / Case:
256-LBGA
1,113
SPC5746BK1MMJ6RSPC5746BK1MMJ6RNXP SemiconductorsIC MCU 32BIT 3MB FLSH 256MAPPBGAMicrocontrollers256-MAPPBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Number of I/O:
178
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPPBGA (17×17)
Package / Case:
256-LBGA
472
SPC5746BSK1ACMH2N/ASPC5746BSK1ACMH2NXP SemiconductorsIC MCU 32BIT 3MB FLASH 100MAPBGAMicrocontrollers100-MAPBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-MAPBGA (11×11)
Package / Case:
100-LFBGA
1,600

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