Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
SPC5746BSK1AMKU2SPC5746BSK1AMKU2NXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,134
SPC5746BSK1AMMH6SPC5746BSK1AMMH6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 100MAPBGAMicrocontrollers100-MAPBGA (11x11)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-MAPBGA (11×11)
Package / Case:
100-LFBGA
8
N/AN/ASPC5746BSK1AVKU2NXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
815
SPC5746BSK1MKU2SPC5746BSK1MKU2NXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,004
SPC5746BSK1MKU2RSPC5746BSK1MKU2RNXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
107
SPC5746BSK1VKU2SPC5746BSK1VKU2NXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
288
SPC5746BSK1VKU2RSPC5746BSK1VKU2RNXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
8
SPC5746BTK1AVMH6N/ASPC5746BTK1AVMH6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 100MAPBGAMicrocontrollers100-MAPBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-MAPBGA (11×11)
Package / Case:
100-LFBGA
339
SPC5746CBK1ACKU6N/ASPC5746CBK1ACKU6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz, 160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
273
SPC5746CBK1ACMH6N/ASPC5746CBK1ACMH6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 100MAPBGAMicrocontrollers100-MAPBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz, 200MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
65
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-MAPBGA (11×11)
Package / Case:
100-LFBGA
653
SPC5746CBK1AMKU6SPC5746CBK1AMKU6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
70
SPC5746CBK1AMMH6N/ASPC5746CBK1AMMH6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 100MAPBGAMicrocontrollers100-MAPBGA (11x11)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz, 160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-MAPBGA (11×11)
Package / Case:
100-LFBGA
105
SPC5746CBK1AMMJ6SPC5746CBK1AMMJ6NXP SemiconductorsIC MCU 32BIT 3MB FLSH 256MAPPBGAMicrocontrollers256-MAPPBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
178
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPPBGA (17×17)
Package / Case:
256-LBGA
30
SPC5746CBK1AVKU6SPC5746CBK1AVKU6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
186
N/AN/ASPC5746CFK1ACKU6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz, 200MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,110
SPC5746CFK1ACMH6N/ASPC5746CFK1ACMH6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 100MAPBGAMicrocontrollers100-MAPBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz, 200MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
65
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-MAPBGA (11×11)
Package / Case:
100-LFBGA
473
N/AN/ASPC5746CFK1AMKU6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz, 160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
Peripherals:
DMA, I2S, LVD/HVD, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 68x10b, 31x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
443
SPC5746CHK0AMKU6SPC5746CHK0AMKU6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
197
SPC5746CHK0AMMH6SPC5746CHK0AMMH6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 100MAPBGAMicrocontrollers100-MAPBGA (11x11)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-MAPBGA (11×11)
Package / Case:
100-LFBGA
895
SPC5746CHK0AMMJ6SPC5746CHK0AMMJ6NXP SemiconductorsIC MCU 32BIT 3MB FLSH 256MAPPBGAMicrocontrollers256-MAPPBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
178
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPPBGA (17×17)
Package / Case:
256-LBGA
758

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