 | N/A | SPC5747CSK0AMKU6 | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 507 | |
 | | SPC5747CSK0AVMJ2 | NXP Semiconductors | IC MCU 32BIT 4MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI Peripherals: DMA, LVD, POR, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 48x10b, 16x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) | 222 | |
 | | SPC5747GBK1VMJ6 | NXP Semiconductors | IC MCU 32BIT 4MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) | 1,527 | |
 | | SPC5747GK0AMMJ6 | NXP Semiconductors | IC MCU 32BIT 4MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) | 330 | |
| N/A | N/A | SPC5747GK0AVKU6 | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz, 160MHz, 160MHz Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 3.6V, 3.15V ~ 5.5V Data Converters: A/D 80x10b, 64x12b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,069 | |
 | | SPC5747GK1CKU2 | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 85°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,071 | |
 | | SPC5747GK1CKU6 | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 85°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 71 | |
 | | SPC5747GK1MKU6 | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 618 | |
 | | SPC5747GK1MKU6R | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,017 | |
 | | SPC5747GK1MMJ6 | NXP Semiconductors | IC MCU 32BIT 4MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) | 292 | |
 | | SPC5747GK1MMJ6R | NXP Semiconductors | IC MCU 32BIT 4MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) | 1,252 | |
 | | SPC5747GSK1MKU6 | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 540 | |
 | | SPC5747GSK1MKU6R | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 3 | |
 | N/A | SPC5747GTK0AMKU6 | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,644 | |
 | N/A | SPC5747GTK1MKU6 | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 301 | |
 | N/A | SPC5747GTK1MKU6R | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 556 | |
| N/A | | SPC5748CBK0AMKU6 | NXP Semiconductors | IC MCU 32BIT 6MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 48x10b, 16x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 169 | |
| N/A | N/A | SPC5748CBK0AMMJ6 | NXP Semiconductors | IC MCU 32BIT 6MB FLASH 256LBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI Peripherals: DMA, FlexRay, I2S, LVD, POR, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 64x10b, 80x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) | 107 | |
 | N/A | SPC5748CBK0AVKU2 | NXP Semiconductors | IC MCU 32BIT 6MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 168 | |
 | N/A | SPC5748CBK0AVMJ6 | NXP Semiconductors | IC MCU 32BIT 6MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) | 1,867 | |