 | | SPC5668EK0VMG | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 208MAPBGA | Microcontrollers | 208-BGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 64x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-BGA (17×17) | 973 | |
 | | SPC5668EK0VMGR | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 208MAPBGA | Microcontrollers | 208-BGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 64x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-BGA (17×17) | 1,632 | |
 | N/A | SPC5668GAVMG | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 208MAPBGA | Microcontrollers | 208-BGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 36x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-BGA (17×17) | 481 | |
 | N/A | SPC5668GAVMGR | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 208MAPBGA | Microcontrollers | 208-BGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 36x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-BGA (17×17) | 1,033 | |
 | | SPC5668GF1AMMG | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 208MAPBGA | Microcontrollers | 208-BGA (17x17) | 3V - 5.5V | -40°C – 125°C | Core Size: 32-Bit Single-Core Program Memory Size: 2MB (2M x 8) Mounting Type: Surface Mount | 1,686 | |
 | | SPC5668GF1AMMGR | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 208MAPBGA | Microcontrollers | 208-BGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 36x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-BGA (17×17) | 1,130 | |
 | | SPC5668GF1AVMG | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 208MAPBGA | Microcontrollers | 208-BGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 36x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-BGA (17×17) | 167 | |
 | | SPC5668GF1AVMGR | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 208MAPBGA | Microcontrollers | 208-BGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 36x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-BGA (17×17) | 681 | |
 | | SPC5668GK0MMG | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 208MAPBGA | Microcontrollers | 208-BGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 36x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-BGA (17×17) | 1,944 | |
 | | SPC5668GK0MMGR | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 208MAPBGA | Microcontrollers | 208-BGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 36x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-BGA (17×17) | 352 | |
 | | SPC5668GK0VMG | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 208MAPBGA | Microcontrollers | 208-BGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 36x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-BGA (17×17) | 692 | |
 | | SPC5668GK0VMGR | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 208MAPBGA | Microcontrollers | 208-BGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 36x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-BGA (17×17) | 64 | |
| N/A | N/A | SPC5673FAMVR2 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 416BBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.08V ~ 5.25V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 494 | |
| N/A | N/A | SPC5673FAMVR2R | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 416BBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.08V ~ 5.25V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 163 | |
| N/A | N/A | SPC5673FAMVY2 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 516BBGA | Microcontrollers | 516-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.08V ~ 5.25V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 30 | |
| N/A | N/A | SPC5673FAMVY2R | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 516BBGA | Microcontrollers | 516-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.08V ~ 5.25V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 375 | |
 | | SPC5673FF3MVR2 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 416PBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.08V ~ 5.25V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 519 | |
 | | SPC5673FF3MVR2R | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 416PBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.08V ~ 5.25V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 1,304 | |
 | | SPC5673FF3MVR3 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 416PBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.08V ~ 5.25V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 425 | |
 | | SPC5673FF3MVY2 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 516FPBGA | Microcontrollers | 516-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.08V ~ 5.25V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 1,413 | |