Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
SPC5747CSK0AMKU6N/ASPC5747CSK0AMKU6NXP SemiconductorsIC MCU 32BIT 4MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
507
SPC5747CSK0AVMJ2SPC5747CSK0AVMJ2NXP SemiconductorsIC MCU 32BIT 4MB FLSH 256MAPPBGAMicrocontrollers256-MAPPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz, 120MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
178
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 48x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPPBGA (17×17)
Package / Case:
256-LBGA
222
SPC5747GBK1VMJ6SPC5747GBK1VMJ6NXP SemiconductorsIC MCU 32BIT 4MB FLSH 256MAPPBGAMicrocontrollers256-MAPPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z2, e200z4, e200z4
Core Size:
32-Bit Tri-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
178
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPPBGA (17×17)
Package / Case:
256-LBGA
1,527
SPC5747GK0AMMJ6SPC5747GK0AMMJ6NXP SemiconductorsIC MCU 32BIT 4MB FLSH 256MAPPBGAMicrocontrollers256-MAPPBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4, e200z4
Core Size:
32-Bit Tri-Core
Speed:
80MHz/120MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
178
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPPBGA (17×17)
Package / Case:
256-LBGA
330
N/AN/ASPC5747GK0AVKU6NXP SemiconductorsIC MCU 32BIT 4MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Tri-Core
Speed:
80MHz, 160MHz, 160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, I2S, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 3.6V, 3.15V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,069
SPC5747GK1CKU2SPC5747GK1CKU2NXP SemiconductorsIC MCU 32BIT 4MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
e200z2, e200z4, e200z4
Core Size:
32-Bit Tri-Core
Speed:
80MHz/120MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,071
SPC5747GK1CKU6SPC5747GK1CKU6NXP SemiconductorsIC MCU 32BIT 4MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
e200z2, e200z4, e200z4
Core Size:
32-Bit Tri-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
71
SPC5747GK1MKU6SPC5747GK1MKU6NXP SemiconductorsIC MCU 32BIT 4MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4, e200z4
Core Size:
32-Bit Tri-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
618
SPC5747GK1MKU6RSPC5747GK1MKU6RNXP SemiconductorsIC MCU 32BIT 4MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4, e200z4
Core Size:
32-Bit Tri-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,017
SPC5747GK1MMJ6SPC5747GK1MMJ6NXP SemiconductorsIC MCU 32BIT 4MB FLSH 256MAPPBGAMicrocontrollers256-MAPPBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4, e200z4
Core Size:
32-Bit Tri-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
178
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPPBGA (17×17)
Package / Case:
256-LBGA
292
SPC5747GK1MMJ6RSPC5747GK1MMJ6RNXP SemiconductorsIC MCU 32BIT 4MB FLSH 256MAPPBGAMicrocontrollers256-MAPPBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4, e200z4
Core Size:
32-Bit Tri-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
178
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPPBGA (17×17)
Package / Case:
256-LBGA
1,252
SPC5747GSK1MKU6SPC5747GSK1MKU6NXP SemiconductorsIC MCU 32BIT 4MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4, e200z4
Core Size:
32-Bit Tri-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
540
SPC5747GSK1MKU6RSPC5747GSK1MKU6RNXP SemiconductorsIC MCU 32BIT 4MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4, e200z4
Core Size:
32-Bit Tri-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
3
SPC5747GTK0AMKU6N/ASPC5747GTK0AMKU6NXP SemiconductorsIC MCU 32BIT 4MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4, e200z4
Core Size:
32-Bit Tri-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,644
SPC5747GTK1MKU6N/ASPC5747GTK1MKU6NXP SemiconductorsIC MCU 32BIT 4MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4, e200z4
Core Size:
32-Bit Tri-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
301
SPC5747GTK1MKU6RN/ASPC5747GTK1MKU6RNXP SemiconductorsIC MCU 32BIT 4MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4, e200z4
Core Size:
32-Bit Tri-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
556
N/ASPC5748CBK0AMKU6NXP SemiconductorsIC MCU 32BIT 6MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz, 160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 48x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
169
N/AN/ASPC5748CBK0AMMJ6NXP SemiconductorsIC MCU 32BIT 6MB FLASH 256LBGAMicrocontrollers256-MAPPBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Tri-Core
Speed:
80MHz, 160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI
Peripherals:
DMA, FlexRay, I2S, LVD, POR, WDT
Number of I/O:
178
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 64x10b, 80x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPPBGA (17×17)
Package / Case:
256-LBGA
107
SPC5748CBK0AVKU2N/ASPC5748CBK0AVKU2NXP SemiconductorsIC MCU 32BIT 6MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
168
SPC5748CBK0AVMJ6N/ASPC5748CBK0AVMJ6NXP SemiconductorsIC MCU 32BIT 6MB FLSH 256MAPPBGAMicrocontrollers256-MAPPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
178
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPPBGA (17×17)
Package / Case:
256-LBGA
1,867

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