 | | SPC5748GGK1MMJ6R | NXP Semiconductors | IC MCU 32BIT 6MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) | 133 | |
 | | SPC5748GGK1VMJ6 | NXP Semiconductors | IC MCU 32BIT 6MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) | 172 | |
 | N/A | SPC5748GHK0AMKU6 | NXP Semiconductors | IC MCU 32BIT 6MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 540 | |
 | N/A | SPC5748GHK0AMMJ6 | NXP Semiconductors | IC MCU 32BIT 6MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) | 797 | |
| N/A | N/A | SPC5748GHK0AMMN6 | NXP Semiconductors | IC MCU 32BIT 6MB FLASH 324MAPBGA | Microcontrollers | 324-MAPBGA (19x19) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 324-MAPBGA (19×19) | 270 | |
 | N/A | SPC5748GK0AMKU6 | NXP Semiconductors | IC MCU 32BIT 6MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 759 | |
 | | SPC5748GK0AMMJ6 | NXP Semiconductors | TRIPLE CORE, 6M FLASH, 768K RAM, | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz, 160MHz, 160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.08V ~ 1.32V Data Converters: A/D 80x10b, 64x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) | 1,404 | |
 | N/A | SPC5748GK0AMMJ6R | NXP Semiconductors | IC MCU 32BIT 6MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) | 893 | |
| N/A | | SPC5748GK0AVKU6 | NXP Semiconductors | IC MCU 32BIT 6MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz, 160MHz, 160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 48x10b, 16x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,008 | |
 | | SPC5748GK1MKU6 | NXP Semiconductors | IC MCU 32BIT 6MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 533 | |
 | | SPC5748GK1MKU6R | NXP Semiconductors | IC MCU 32BIT 6MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 249 | |
 | | SPC5748GK1MMJ6 | NXP Semiconductors | IC MCU 32BIT 6MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) | 539 | |
 | | SPC5748GK1MMJ6R | NXP Semiconductors | IC MCU 32BIT 6MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) | 477 | |
 | | SPC5748GK1MMN6 | NXP Semiconductors | IC MCU 32BIT 6MB FLASH 324MAPBGA | Microcontrollers | 324-MAPBGA (19x19) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 324-MAPBGA (19×19) | 68 | |
| N/A | | SPC5748GSK0AMKU6 | NXP Semiconductors | IC MCU 32BIT 6MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz, 160MHz, 160MHz Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 48x10b, 16x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 111 | |
 | N/A | SPC5748GSK0AMMJ6 | NXP Semiconductors | IC MCU 32BIT 6MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) | 851 | |
 | N/A | SPC5748GSK0AVKU2 | NXP Semiconductors | IC MCU 32BIT 6MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,047 | |
 | N/A | SPC5748GSK0AVMJ2 | NXP Semiconductors | IC MCU 32BIT 6MB FLSH 256MAPPBGA | Microcontrollers | 256-MAPPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPPBGA (17×17) | 1,252 | |
 | | SPC5748GSK1MKU6 | NXP Semiconductors | IC MCU 32BIT 6MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,160 | |
 | | SPC5748GSK1MKU6R | NXP Semiconductors | IC MCU 32BIT 6MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 80x10b, 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,082 | |