Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
SPC5748GSK1MMJ6SPC5748GSK1MMJ6NXP SemiconductorsIC MCU 32BIT 6MB FLSH 256MAPPBGAMicrocontrollers256-MAPPBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit 3-Core
Speed:
80MHz, 160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, I2S, LVD/HVD, POR, WDT
Number of I/O:
178
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
EEPROM Size:
192K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPPBGA (17×17)
Package / Case:
256-LBGA
532
N/AN/ASPC5748GSK1MMJ6RNXP SemiconductorsNXP 32-BIT MCU, TRIPLE CORE, 6MBMicrocontrollers256-MAPPBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Tri-Core
Speed:
80MHz, 160MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SD/SDIO, SAI, SPI, UART/USART, USB, USB OTG
Peripherals:
DMA, LVD, I2S, POR, WDT
Number of I/O:
246
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 3.6V, 4.5V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPPBGA (17×17)
Package / Case:
256-LBGA
425
SPC5748GSK1MMN6SPC5748GSK1MMN6NXP SemiconductorsIC MCU 32BIT 6MB FLASH 324MAPBGAMicrocontrollers324-MAPBGA (19x19)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4, e200z4
Core Size:
32-Bit Tri-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
246
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
324-MAPBGA (19×19)
Package / Case:
324-LBGA
112
SPC5748GTK0AMKU6SPC5748GTK0AMKU6NXP SemiconductorsIC MCU 32BIT 6MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4, e200z4
Core Size:
32-Bit Tri-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
53
SPC5748GTK0AMMJ6N/ASPC5748GTK0AMMJ6NXP SemiconductorsIC MCU 32BIT 6MB FLSH 256MAPPBGAMicrocontrollers256-MAPPBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4, e200z4
Core Size:
32-Bit Tri-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
178
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPPBGA (17×17)
Package / Case:
256-LBGA
633
N/ASPC5748GTK0AVKU6NXP SemiconductorsIC MCU 32BIT 6MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z2, e200z4, e200z4
Core Size:
32-Bit Tri-Core
Speed:
80MHz, 160MHz, 160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 48x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
786
SPC5748GTK1MMJ6SPC5748GTK1MMJ6NXP SemiconductorsIC MCU 32BIT 6MB FLSH 256MAPPBGAMicrocontrollers256-MAPPBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4, e200z4
Core Size:
32-Bit Tri-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
178
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPPBGA (17×17)
Package / Case:
256-LBGA
1,086
SPC5748GTK1MMJ6RSPC5748GTK1MMJ6RNXP SemiconductorsIC MCU 32BIT 6MB FLSH 256MAPPBGAMicrocontrollers256-MAPPBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4, e200z4
Core Size:
32-Bit Tri-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
178
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPPBGA (17×17)
Package / Case:
256-LBGA
1,240
SPC574K72E5C6FARSPC574K72E5C6FARSTMicroelectronicsIC MCU 32BIT 2.5MB FLSH 144ETQFPMicrocontrollers144-eTQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4, e200z4
Core Size:
32-Bit Tri-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
2.5MB (2.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 12b SAR, 16b Sigma-Delta
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
144-eTQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
1,003
SPC574K72E5C6FAYSPC574K72E5C6FAYSTMicroelectronicsIC MCU 32BIT 2.5MB FLSH 144ETQFPMicrocontrollers144-eTQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4, e200z4
Core Size:
32-Bit Tri-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
2.5MB (2.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 12b SAR, 16b Sigma-Delta
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
144-eTQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
1,370
SPC574K72E7C6FARSPC574K72E7C6FARSTMicroelectronicsIC MCU 32BIT 2.5MB FLSH 176ELQFPMicrocontrollers176-eLQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4, e200z4
Core Size:
32-Bit Tri-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
2.5MB (2.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 12b SAR, 16b Sigma-Delta
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-eLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
52
SPC574K72E7C6FAYSPC574K72E7C6FAYSTMicroelectronicsIC MCU 32BIT 2.5MB FLSH 176ELQFPMicrocontrollers176-eLQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4, e200z4
Core Size:
32-Bit Tri-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
2.5MB (2.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 12b SAR, 16b Sigma-Delta
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-eLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
917
SPC574S60E3CE0ARSPC574S60E3CE0ARSTMicroelectronicsIC MCU 32BIT 1MB FLASH 100ETQFPMicrocontrollers100-eTQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
140MHz
Connectivity:
CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
64
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
3.135V ~ 5.25V
Data Converters:
A/D 32x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-eTQFP (14×14)
Package / Case:
100-TQFP Exposed Pad
5
SPC574S60E3CE0AYSPC574S60E3CE0AYSTMicroelectronicsIC MCU 32BIT 1MB FLASH 100ETQFPMicrocontrollers100-eTQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
140MHz
Connectivity:
CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
64
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
3.135V ~ 5.25V
Data Converters:
A/D 32x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-eTQFP (14×14)
Package / Case:
100-TQFP Exposed Pad
1,568
SPC574S64E3CEFARSPC574S64E3CEFARSTMicroelectronicsIC MCU 32BIT 1.5MB FLSH 100ETQFPMicrocontrollers100-eTQFP (14x14)3.135V - 5.25V-40°C – 125°C
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
140MHz
Program Memory Size:
1.5MB (1.5M x 8)
Mounting Type:
Surface Mount
208
SPC574S64E3CEFAYSPC574S64E3CEFAYSTMicroelectronicsIC MCU 32BIT 1.5MB FLSH 100ETQFPMicrocontrollers100-eTQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
140MHz
Connectivity:
CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
64
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
3.135V ~ 5.25V
Data Converters:
A/D 32x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-eTQFP (14×14)
Package / Case:
100-TQFP Exposed Pad
956
SPC5775BDK3MME2SPC5775BDK3MME2NXP SemiconductorsIC MCU 32BIT 4MB FLASH 416MAPBGAMicrocontrollers416-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Dual-Core
Speed:
220MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, Zipwire
Number of I/O:
293
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 40x12b eQADCx2
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-MAPBGA (27×27)
Package / Case:
416-BGA
1,204
N/AN/ASPC5775BDK3MME2RNXP SemiconductorsIC MCU 32BIT 4MB FLASH 416MAPBGAMicrocontrollers416-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Dual-Core
Speed:
220MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, LINbus, SPI, PSI, UART/USART
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V, 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-MAPBGA (27×27)
Package / Case:
416-BGA
30
N/AN/ASPC5775BSK3MME2NXP SemiconductorsNXP 32-BIT MCU, 4MB FLASH FCACSMicrocontrollers416-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Dual-Core
Speed:
220MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexCAN, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-MAPBGA (27×27)
Package / Case:
416-BGA
970
N/AN/ASPC5775BSK3MME2RNXP SemiconductorsNXP 32-BIT MCU, 4MB FLASH FCACSMicrocontrollers416-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Dual-Core
Speed:
220MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexCAN, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-MAPBGA (27×27)
Package / Case:
416-BGA
1,475

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