 | N/A | SPC5777CK2MMO3 | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 516MAPBGA | Microcontrollers | 516-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-MAPBGA (27×27) | 550 | |
 | | SPC5777CK3MME3 | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 416MAPBGA | Microcontrollers | 416-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-MAPBGA (27×27) | 1,869 | |
 | | SPC5777CK3MME3R | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 416MAPBGA | Microcontrollers | 416-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-MAPBGA (27×27) | 653 | |
 | | SPC5777CK3MMO3 | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 516MAPBGA | Microcontrollers | 516-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-MAPBGA (27×27) | 116 | |
 | | SPC5777CK3MMO3R | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 516MAPBGA | Microcontrollers | 516-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-MAPBGA (27×27) | 486 | |
 | | SPC5777CLK3MME3 | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 416MAPBGA | Microcontrollers | 416-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-MAPBGA (27×27) | 59 | |
 | N/A | SPC5777CLK3MME3R | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 416MAPBGA | Microcontrollers | 416-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-MAPBGA (27×27) | 187 | |
 | | SPC5777CLK3MMO3 | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 516MAPBGA | Microcontrollers | 516-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-MAPBGA (27×27) | 765 | |
 | | SPC5777CLK3MMO3R | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 516MAPBGA | Microcontrollers | 516-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-MAPBGA (27×27) | 421 | |
 | | SPC5777CRK3MME3 | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 416MAPBGA | Microcontrollers | 416-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-MAPBGA (27×27) | 159 | |
 | | SPC5777CRK3MMO3 | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 516MAPBGA | Microcontrollers | 516-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-MAPBGA (27×27) | 525 | |
 | | SPC5777CSK3MME3 | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 416MAPBGA | Microcontrollers | 416-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-MAPBGA (27×27) | 662 | |
 | | SPC5777CSK3MME3R | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 416MAPBGA | Microcontrollers | 416-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-MAPBGA (27×27) | 628 | |
| N/A | N/A | SPC5777CSK3MME4 | NXP Semiconductors | POWER ARCH CORES, 8MB FLASH, 300 | Microcontrollers | 416-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: CANbus, EBI/EMI, Ethernet, PSI5, SENT, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 10x16b Sigma-Delta, eQADC Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-MAPBGA (27×27) | 346 | |
| N/A | N/A | SPC5777CSK3MME4R | NXP Semiconductors | POWER ARCH CORES, 8MB FLASH, 300 | Microcontrollers | 416-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: CANbus, EBI/EMI, Ethernet, PSI5, SENT, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V, 4.5V ~ 5.5V Data Converters: A/D 10x16b Sigma-Delta, eQADC Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-MAPBGA (27×27) | 75 | |
 | | SPC5777CSK3MMO3 | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 516MAPBGA | Microcontrollers | 516-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-MAPBGA (27×27) | 1,416 | |
 | | SPC5777CSK3MMO3R | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 416MAPBGA | Microcontrollers | 416-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-MAPBGA (27×27) | 1,396 | |
| N/A | N/A | SPC5777CSK3MMO4 | NXP Semiconductors | POWER ARCH CORES, 8MB FLASH, 300 | Microcontrollers | 516-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: CANbus, EBI/EMI, Ethernet, PSI5, SENT, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 10x16b Sigma-Delta, eQADC Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-MAPBGA (27×27) | 1,239 | |
| N/A | N/A | SPC5777CSK3MMO4R | NXP Semiconductors | POWER ARCH CORES, 8MB FLASH, 300 | Microcontrollers | 516-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: CANbus, EBI/EMI, Ethernet, PSI5, SENT, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 10x16b Sigma-Delta, eQADC Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-MAPBGA (27×27) | 892 | |
 | | SPC5777MK0MVA8 | NXP Semiconductors | IC MCU 32B 8.64MB FLSH 512TEPBGA | Microcontrollers | 512-FBGA (25x25) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexRAY, I2C, LINbus, SPI, PSI, UART/USART Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8.64MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 12b SAR, 16b Sigma-Delta Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 512-FBGA (25×25) | 484 | |