Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
SPC5777CK2MMO3N/ASPC5777CK2MMO3NXP SemiconductorsIC MCU 32BIT 8MB FLASH 516MAPBGAMicrocontrollers516-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
264MHz
Connectivity:
EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16b Sigma-Delta, eQADC
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-MAPBGA (27×27)
Package / Case:
516-BGA
550
SPC5777CK3MME3SPC5777CK3MME3NXP SemiconductorsIC MCU 32BIT 8MB FLASH 416MAPBGAMicrocontrollers416-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
264MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16b Sigma-Delta, eQADC
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-MAPBGA (27×27)
Package / Case:
416-BGA
1,869
SPC5777CK3MME3RSPC5777CK3MME3RNXP SemiconductorsIC MCU 32BIT 8MB FLASH 416MAPBGAMicrocontrollers416-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
264MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16b Sigma-Delta, eQADC
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-MAPBGA (27×27)
Package / Case:
416-BGA
653
SPC5777CK3MMO3SPC5777CK3MMO3NXP SemiconductorsIC MCU 32BIT 8MB FLASH 516MAPBGAMicrocontrollers516-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
264MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16b Sigma-Delta, eQADC
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-MAPBGA (27×27)
Package / Case:
516-BGA
116
SPC5777CK3MMO3RSPC5777CK3MMO3RNXP SemiconductorsIC MCU 32BIT 8MB FLASH 516MAPBGAMicrocontrollers516-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
264MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16b Sigma-Delta, eQADC
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-MAPBGA (27×27)
Package / Case:
516-BGA
486
SPC5777CLK3MME3SPC5777CLK3MME3NXP SemiconductorsIC MCU 32BIT 8MB FLASH 416MAPBGAMicrocontrollers416-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
264MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16b Sigma-Delta, eQADC
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-MAPBGA (27×27)
Package / Case:
416-BGA
59
SPC5777CLK3MME3RN/ASPC5777CLK3MME3RNXP SemiconductorsIC MCU 32BIT 8MB FLASH 416MAPBGAMicrocontrollers416-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
264MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16b Sigma-Delta, eQADC
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-MAPBGA (27×27)
Package / Case:
416-BGA
187
SPC5777CLK3MMO3SPC5777CLK3MMO3NXP SemiconductorsIC MCU 32BIT 8MB FLASH 516MAPBGAMicrocontrollers516-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
264MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16b Sigma-Delta, eQADC
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-MAPBGA (27×27)
Package / Case:
516-BGA
765
SPC5777CLK3MMO3RSPC5777CLK3MMO3RNXP SemiconductorsIC MCU 32BIT 8MB FLASH 516MAPBGAMicrocontrollers516-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
264MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16b Sigma-Delta, eQADC
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-MAPBGA (27×27)
Package / Case:
516-BGA
421
SPC5777CRK3MME3SPC5777CRK3MME3NXP SemiconductorsIC MCU 32BIT 8MB FLASH 416MAPBGAMicrocontrollers416-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
264MHz
Connectivity:
EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16b Sigma-Delta, eQADC
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-MAPBGA (27×27)
Package / Case:
416-BGA
159
SPC5777CRK3MMO3SPC5777CRK3MMO3NXP SemiconductorsIC MCU 32BIT 8MB FLASH 516MAPBGAMicrocontrollers516-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
264MHz
Connectivity:
EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16b Sigma-Delta, eQADC
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-MAPBGA (27×27)
Package / Case:
516-BGA
525
SPC5777CSK3MME3SPC5777CSK3MME3NXP SemiconductorsIC MCU 32BIT 8MB FLASH 416MAPBGAMicrocontrollers416-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
264MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16b Sigma-Delta, eQADC
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-MAPBGA (27×27)
Package / Case:
416-BGA
662
SPC5777CSK3MME3RSPC5777CSK3MME3RNXP SemiconductorsIC MCU 32BIT 8MB FLASH 416MAPBGAMicrocontrollers416-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
264MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16b Sigma-Delta, eQADC
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-MAPBGA (27×27)
Package / Case:
416-BGA
628
N/AN/ASPC5777CSK3MME4NXP SemiconductorsPOWER ARCH CORES, 8MB FLASH, 300Microcontrollers416-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
300MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, PSI5, SENT, SPI
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10x16b Sigma-Delta, eQADC
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
416-MAPBGA (27×27)
Package / Case:
416-BGA
346
N/AN/ASPC5777CSK3MME4RNXP SemiconductorsPOWER ARCH CORES, 8MB FLASH, 300Microcontrollers416-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
300MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, PSI5, SENT, SPI
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V, 4.5V ~ 5.5V
Data Converters:
A/D 10x16b Sigma-Delta, eQADC
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
416-MAPBGA (27×27)
Package / Case:
416-BGA
75
SPC5777CSK3MMO3SPC5777CSK3MMO3NXP SemiconductorsIC MCU 32BIT 8MB FLASH 516MAPBGAMicrocontrollers516-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
264MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16b Sigma-Delta, eQADC
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-MAPBGA (27×27)
Package / Case:
516-BGA
1,416
SPC5777CSK3MMO3RSPC5777CSK3MMO3RNXP SemiconductorsIC MCU 32BIT 8MB FLASH 416MAPBGAMicrocontrollers416-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
264MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16b Sigma-Delta, eQADC
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-MAPBGA (27×27)
Package / Case:
416-BGA
1,396
N/AN/ASPC5777CSK3MMO4NXP SemiconductorsPOWER ARCH CORES, 8MB FLASH, 300Microcontrollers516-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
300MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, PSI5, SENT, SPI
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10x16b Sigma-Delta, eQADC
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
516-MAPBGA (27×27)
Package / Case:
516-BGA
1,239
N/AN/ASPC5777CSK3MMO4RNXP SemiconductorsPOWER ARCH CORES, 8MB FLASH, 300Microcontrollers516-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
300MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, PSI5, SENT, SPI
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10x16b Sigma-Delta, eQADC
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
516-MAPBGA (27×27)
Package / Case:
516-BGA
892
SPC5777MK0MVA8SPC5777MK0MVA8NXP SemiconductorsIC MCU 32B 8.64MB FLSH 512TEPBGAMicrocontrollers512-FBGA (25x25)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
300MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRAY, I2C, LINbus, SPI, PSI, UART/USART
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8.64MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
404K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 12b SAR, 16b Sigma-Delta
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
512-FBGA (25×25)
Package / Case:
512-FBGA
484

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up