 | | SPC5775EDK3MME3 | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 416MAPBGA | Microcontrollers | 416-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 40x12b eQADCx2 Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-MAPBGA (27×27) | 1,124 | |
 | | SPC5775EDK3MME3R | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 416MAPBGA | Microcontrollers | 416-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 40x12b eQADCx2 Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-MAPBGA (27×27) | 1,574 | |
 | | SPC5777CAK3MME3 | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 416MAPBGA | Microcontrollers | 416-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-MAPBGA (27×27) | 1,979 | |
 | | SPC5777CAK3MME3R | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 416MAPBGA | Microcontrollers | 416-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-MAPBGA (27×27) | 1,101 | |
 | | SPC5777CAK3MMO3 | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 516MAPBGA | Microcontrollers | 516-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-MAPBGA (27×27) | 688 | |
 | | SPC5777CAK3MMO3R | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 516MAPBGA | Microcontrollers | 516-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-MAPBGA (27×27) | 1,149 | |
 | | SPC5777CCK3MME3 | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 416MAPBGA | Microcontrollers | 416-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-MAPBGA (27×27) | 384 | |
 | | SPC5777CCK3MME3R | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 416MAPBGA | Microcontrollers | 416-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-MAPBGA (27×27) | 1,753 | |
 | | SPC5777CCK3MMO3 | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 516MAPBGA | Microcontrollers | 516-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-MAPBGA (27×27) | 1,456 | |
 | | SPC5777CCK3MMO3R | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 516MAPBGA | Microcontrollers | 516-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-MAPBGA (27×27) | 796 | |
 | | SPC5777CDK3MME3 | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 416MAPBGA | Microcontrollers | 416-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-MAPBGA (27×27) | 857 | |
 | | SPC5777CDK3MME3R | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 416MAPBGA | Microcontrollers | 416-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-MAPBGA (27×27) | 104 | |
 | | SPC5777CDK3MME4 | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 416MAPBGA | Microcontrollers | 416-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-MAPBGA (27×27) | 221 | |
 | | SPC5777CDK3MME4R | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 416MAPBGA | Microcontrollers | 416-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-MAPBGA (27×27) | 452 | |
 | | SPC5777CDK3MMO3 | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 516MAPBGA | Microcontrollers | 516-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-MAPBGA (27×27) | 301 | |
 | | SPC5777CDK3MMO3R | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 516MAPBGA | Microcontrollers | 516-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-MAPBGA (27×27) | 421 | |
 | | SPC5777CDK3MMO4 | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 516MAPBGA | Microcontrollers | 516-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-MAPBGA (27×27) | 610 | |
 | | SPC5777CDK3MMO4R | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 516MAPBGA | Microcontrollers | 516-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-MAPBGA (27×27) | 710 | |
 | N/A | SPC5777CK2MME3 | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 416MAPBGA | Microcontrollers | 416-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-MAPBGA (27×27) | 248 | |
 | N/A | SPC5777CK2MME3R | NXP Semiconductors | IC MCU 32BIT 8MB FLASH 416MAPBGA | Microcontrollers | 416-MAPBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Tri-Core Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Program Memory Size: 8MB (8M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16b Sigma-Delta, eQADC Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-MAPBGA (27×27) | 1,502 | |