Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
ST7FOXK2T6ST7FOXK2T6STMicroelectronicsIC MCU 8BIT 8KB FLASH 32LQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
ST7
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
I2C, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
384 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
32-LQFP
829
ST7FSCR1E4M1ST7FSCR1E4M1STMicroelectronicsIC MCU 8BIT 16KB FLASH 24SOICMicrocontrollersN/AN/A0°C ~ 70°C (TA)
Core Processor:
ST7
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
SmartCard, UART/USART, USB
Peripherals:
LED, LVD, POR, WDT
Number of I/O:
4
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
4V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
24-SOIC (0.295″”, 7.50mm Width)
413
ST7FSCR1R4T1ST7FSCR1R4T1STMicroelectronicsIC MCU 8BIT 16KB FLASH 64LQFPMicrocontrollersN/AN/A0°C ~ 70°C (TA)
Core Processor:
ST7
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
SmartCard, UART/USART, USB
Peripherals:
LED, LVD, POR, WDT
Number of I/O:
35
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
4V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
64-LQFP
1,247
N/AST7LNB0V3Y0M6TRSTMicroelectronicsIC MCU 8BIT ROMLESS 16SOMicrocontrollers16-SON/A-40°C ~ 85°C (TA)
Core Processor:
ST7
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
DiSEqC
Peripherals:
LVD
Program Memory Type:
ROMless
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-SO
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
816
ST802RT1AFRST802RT1AFRSTMicroelectronicsIC TRANSCEIVER FULL 1/1 48LQFPDrivers, Receivers, Transceivers48-LQFP (7x7)3.15V ~ 3.45V-40°C ~ 105°C
Type:
Transceiver
Protocol:
Ethernet
Number of Drivers/Receivers:
1/1
Duplex:
Full
Voltage – Supply:
3.15V ~ 3.45V
Operating Temperature:
-40°C ~ 105°C
Mounting Type:
Surface Mount
Package / Case:
48-LQFP
Supplier Device Package:
48-LQFP (7×7)
778
ST802RT1BFRST802RT1BFRSTMicroelectronicsIC TRANSCEIVER FULL 1/1 48LQFPDrivers, Receivers, Transceivers48-LQFP (7x7)3.15V ~ 3.45V-40°C ~ 105°C
Type:
Transceiver
Protocol:
Ethernet
Number of Drivers/Receivers:
1/1
Duplex:
Full
Voltage – Supply:
3.15V ~ 3.45V
Operating Temperature:
-40°C ~ 105°C
Mounting Type:
Surface Mount
Package / Case:
48-LQFP
Supplier Device Package:
48-LQFP (7×7)
877
N/AST90R158Q6STMicroelectronicsIC MCU 8/16BIT ROMLESS 80PQFPMicrocontrollers80-PQFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ST9
Core Size:
8/16-Bit
Speed:
24MHz
Connectivity:
EBI/EMI, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
67
Program Memory Type:
ROMless
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-PQFP (14×20)
Package / Case:
80-BQFP
323
ST92F124R9TBST92F124R9TBSTMicroelectronicsIC MCU 8/16BIT 64KB FLASH 64LQFPMicrocontrollersN/AN/A-40°C ~ 105°C (TA)
Core Processor:
ST9
Core Size:
8/16-Bit
Speed:
24MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
48
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
64-LQFP
653
ST92F124V1QBST92F124V1QBSTMicroelectronicsIC MCU 8/16B 128KB FLASH 100PQFPMicrocontrollers100-PQFP (20x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ST9
Core Size:
8/16-Bit
Speed:
24MHz
Connectivity:
EBI/EMI, I2C, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
77
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-PQFP (20×14)
Package / Case:
100-QFP
416
ST92F124V1TBST92F124V1TBSTMicroelectronicsIC MCU 8/16B 128KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ST9
Core Size:
8/16-Bit
Speed:
24MHz
Connectivity:
EBI/EMI, I2C, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
77
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
367
ST92F150CR9TBST92F150CR9TBSTMicroelectronicsIC MCU 8BIT 64KB FLASH 64LQFPMicrocontrollersN/AN/A-40°C ~ 105°C (TA)
Core Processor:
ST9
Core Size:
8/16-Bit
Speed:
24MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
48
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
64-LQFP
189
ST92F150CV1QBST92F150CV1QBSTMicroelectronicsIC MCU 8/16BIT 128KB FLSH 100QFPMicrocontrollersN/AN/A-40°C ~ 105°C (TA)
Core Processor:
ST9
Core Size:
8/16-Bit
Speed:
24MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
77
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
759
ST92F150CV1T3ST92F150CV1T3STMicroelectronicsIC MCU 8/16BT 128KB FLSH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
ST9
Core Size:
8/16-Bit
Speed:
24MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
77
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
305
ST92F150CV1TBST92F150CV1TBSTMicroelectronicsIC MCU 8/16BIT 128KB FLSH 100QFPMicrocontrollersN/AN/A-40°C ~ 105°C (TA)
Core Processor:
ST9
Core Size:
8/16-Bit
Speed:
24MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
77
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
342
ST92F150CV9TBST92F150CV9TBSTMicroelectronicsIC MCU 8/16BIT 64KB FLASH 100QFPMicrocontrollersN/AN/A-40°C ~ 105°C (TA)
Core Processor:
ST9
Core Size:
8/16-Bit
Speed:
24MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
77
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
1,186
N/AN/AST92F150JDV1QCESTMicroelectronicsIC MCU 8/16BIT 128KB FLSH 100QFPMicrocontrollers100-PQFP (14x20)N/A-40°C ~ 125°C (TA)
Core Processor:
ST9
Core Size:
8/16-Bit
Speed:
24MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
77
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-PQFP (14×20)
Package / Case:
100-BQFP
564
N/AN/ASTA1078ELA3STMicroelectronicsIC MPU 450MHZ 256TFBGAMicroprocessors256-TFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-R4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
450MHz
Co-Processors/DSP:
ARM® Cortex®-M3
RAM Controllers:
SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, Touchscreen
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-TFBGA
Supplier Device Package:
256-TFBGA (11×11)
Additional Interfaces:
CANbus, GPIO, I2C, SSP/SPI, UART
736
N/ASTA1078EOASTMicroelectronicsIC MPU 450MHZ 256TFBGAMicroprocessors256-TFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-R4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
450MHz
Co-Processors/DSP:
ARM® Cortex®-M3
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Touchscreen
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-TFBGA
Supplier Device Package:
256-TFBGA (11×11)
Additional Interfaces:
CAN, I2C, SSP/SPI, UART
1,137
N/AN/ASTA1078EOA3STMicroelectronicsIC MPU 450MHZ 256TFBGAMicroprocessors256-TFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-R4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
450MHz
Co-Processors/DSP:
ARM® Cortex®-M3
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Touchscreen
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-TFBGA
Supplier Device Package:
256-TFBGA (11×11)
Additional Interfaces:
CANbus, GPIO, I2C, SSP/SPI, UART
8
N/ASTA1079EOASTMicroelectronicsIC MPU 450MHZ 256TFBGAMicroprocessors256-TFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-R4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
450MHz
Co-Processors/DSP:
ARM® Cortex®-M3
RAM Controllers:
SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, Touchscreen
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-TFBGA
Supplier Device Package:
256-TFBGA (11×11)
Additional Interfaces:
CAN, I2C, SSP/SPI, UART
1,258

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