Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AN/ASTA1090HOA3STMicroelectronicsIC MPU 533MHZ 361LFBGAMicroprocessors361-LFBGA (16x16)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-R4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
533MHz
Co-Processors/DSP:
ARM® Cortex®-M3
RAM Controllers:
SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, Touchscreen
USB:
USB 2.0 (2)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
JTAG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-LFBGA (16×16)
Additional Interfaces:
DMA, GPIO, I2C, I2S, MMC/SD/SDIO, UART
927
N/AN/ASTA1095ELA3STMicroelectronicsIC MPU 450MHZ 361LFBGAMicroprocessors361-LFBGA (16x16)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-R4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
450MHz
Co-Processors/DSP:
ARM® Cortex®-M3
RAM Controllers:
SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, Touchscreen
USB:
USB 2.0 (2)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
Boot Security, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-LFBGA (16×16)
Additional Interfaces:
CANbus, GPIO, I2C, I2S, MMC/SD, SSP, SPI, UART
584
N/ASTA1095EOASTMicroelectronicsIC MPU 450MHZ 361LFBGAMicroprocessors361-LFBGA (16x16)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-R4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
450MHz
Co-Processors/DSP:
ARM® Cortex®-M3
RAM Controllers:
SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, Touchscreen
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-LFBGA (16×16)
Additional Interfaces:
CAN, I2C, SSP/SPI, UART
946
N/AN/ASTA1095EOAS1STMicroelectronicsIC MPU 450MHZ 361LFBGAMicroprocessors361-LFBGA (16x16)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-R4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
450MHz
Co-Processors/DSP:
ARM® Cortex®-M3
RAM Controllers:
SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, Touchscreen
USB:
USB 2.0 (2)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
JTAG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-LFBGA (16×16)
Additional Interfaces:
CANbus, GPIO, I2C, I2S, MMC/SD, SSP, SPI, UART
399
N/AN/ASTA1095POA3STMicroelectronicsIC MPU 450MHZ 361LFBGAMicroprocessors361-LFBGA (16x16)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-R4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
450MHz
Co-Processors/DSP:
ARM® Cortex®-M3
RAM Controllers:
SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, Touchscreen
USB:
USB 2.0 (2)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
JTAG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-LFBGA (16×16)
Additional Interfaces:
CANbus, GPIO, I2C, I2S, MMC/SD, SSP, SPI, UART
746
N/AN/ASTA1385ELAS2STMicroelectronicsIC MPU AEC-Q100 600MHZ 361LFBGAMicroprocessors361-LFBGA (16x16)N/A-40°C ~ 150°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
ARM® Cortex®-M3, Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR2, SRAM
Graphics Acceleration:
No
Ethernet:
GBE (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
AES, MD5, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-LFBGA (16×16)
Additional Interfaces:
CAN, FlexRay, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, SSP, UART
991
N/AN/ASTA1385ELAS2TRSTMicroelectronicsIC MPU AEC-Q100 600MHZ 361LFBGAMicroprocessors361-LFBGA (16x16)N/A-40°C ~ 150°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
ARM® Cortex®-M3, Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR2, SRAM
Graphics Acceleration:
No
Ethernet:
GBE (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
AES, MD5, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-LFBGA (16×16)
Additional Interfaces:
CAN, FlexRay, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, SSP, UART
838
N/AN/ASTA1385EOAS1STMicroelectronicsIC MPU AEC-Q100 600MHZ 361LFBGAMicroprocessors361-LFBGA (16x16)N/A-40°C ~ 150°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
ARM® Cortex®-M3, Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR2, SRAM
Graphics Acceleration:
No
Ethernet:
GBE (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
AES, MD5, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-LFBGA (16×16)
Additional Interfaces:
CAN, FlexRay, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, SSP, UART
680
N/AN/ASTA1385EOAS2STMicroelectronicsIC MPU AEC-Q100 600MHZ 361LFBGAMicroprocessors361-LFBGA (16x16)N/A-40°C ~ 150°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
ARM® Cortex®-M3, Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR2, SRAM
Graphics Acceleration:
No
Ethernet:
GBE (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
AES, MD5, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-LFBGA (16×16)
Additional Interfaces:
CAN, FlexRay, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, SSP, UART
216
N/AN/ASTA1385EOAS2TRSTMicroelectronicsIC MPU AEC-Q100 600MHZ 361LFBGAMicroprocessors361-LFBGA (16x16)N/A-40°C ~ 150°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
ARM® Cortex®-M3, Multimedia; NEON
RAM Controllers:
DDR3L, LPDDR2, SRAM
Graphics Acceleration:
No
Ethernet:
GBE (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Security Features:
AES, MD5, SHA-1/2, TRNG
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-LFBGA (16×16)
Additional Interfaces:
CAN, FlexRay, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, SSP, UART
1,176
N/AN/ASTE10/100ASTMicroelectronicsIC CTRLR PCI ETHERNET 128QFPControllers128-PQFP (14x20)3.14V ~ 3.46V0°C ~ 70°C
Protocol:
Ethernet
Function:
Controller
Interface:
PCI
Standards:
10/100 Base-T/TX PHY
Voltage – Supply:
3.14V ~ 3.46V
Current – Supply:
130mA
Operating Temperature:
0°C ~ 70°C
Package / Case:
128-BFQFP
Supplier Device Package:
128-PQFP (14×20)
749
N/AN/ASTG1218IQTSTMicroelectronicsIC SWITCH SPDTX4 14OHM 20QFNAnalog Switches, Multiplexers, Demultiplexers20-QFN (4x4)N/A-40°C ~ 125°C
Switch Circuit:
SPDT – Open/Closed
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
4
On-State Resistance (Max):
14Ohm
Channel-to-Channel Matching (ΔRon):
300mOhm
Voltage – Supply, Single (V+):
2.7V ~ 5.5V, 2.7V ~ 15.5V
Switch Time (Ton, Toff) (Max):
320ns, 195ns
-3db Bandwidth:
200MHz
Charge Injection:
48pC
Channel Capacitance (CS(off), CD(off)):
25pF
Current – Leakage (IS(off)) (Max):
1.5µA
Crosstalk:
-66dB @ 1MHz
Operating Temperature:
-40°C ~ 125°C
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Package / Case:
20-WFQFN Exposed Pad
Supplier Device Package:
20-QFN (4×4)
159
STG3155DTRSTG3155DTRSTMicroelectronicsIC SWITCH SPDT X 1 600MOHM 6DFNAnalog Switches, Multiplexers, Demultiplexers6-DFN (1.45x1)N/A-55°C ~ 125°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
1
On-State Resistance (Max):
600mOhm
Channel-to-Channel Matching (ΔRon):
21mOhm
Voltage – Supply, Single (V+):
1.65V ~ 4.3V
Switch Time (Ton, Toff) (Max):
55ns, 30ns
-3db Bandwidth:
70MHz
Charge Injection:
53pC
Channel Capacitance (CS(off), CD(off)):
6.6pF
Current – Leakage (IS(off)) (Max):
20nA
Crosstalk:
-72dB @ 100kHz
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
6-UFDFN
Supplier Device Package:
6-DFN (1.45×1)
249
STG3157CTRSTG3157CTRSTMicroelectronicsIC SWITCH SPDTX1 15OHM SOT323-6LAnalog Switches, Multiplexers, DemultiplexersSOT-323-6LN/A-55°C ~ 125°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
1
On-State Resistance (Max):
15Ohm
Channel-to-Channel Matching (ΔRon):
100mOhm
Voltage – Supply, Single (V+):
1.65V ~ 4.3V
Switch Time (Ton, Toff) (Max):
15ns, 10ns
-3db Bandwidth:
250MHz
Charge Injection:
23pC
Channel Capacitance (CS(off), CD(off)):
5pF
Current – Leakage (IS(off)) (Max):
100nA
Crosstalk:
-55dB @ 10MHz
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
6-TSSOP, SC-88, SOT-363
Supplier Device Package:
SOT-323-6L
725
N/ASTG3159DTRSTMicroelectronicsIC SWITCH SPDT X 1 1.1OHM 6DFNAnalog Switches, Multiplexers, Demultiplexers6-DFN (1.2x1)N/A-55°C ~ 125°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
1
On-State Resistance (Max):
1.1Ohm
Channel-to-Channel Matching (ΔRon):
50mOhm
Voltage – Supply, Single (V+):
1.65V ~ 4.3V
Switch Time (Ton, Toff) (Max):
23ns, 21ns
-3db Bandwidth:
150MHz
Charge Injection:
33pC
Channel Capacitance (CS(off), CD(off)):
6pF
Current – Leakage (IS(off)) (Max):
20nA
Crosstalk:
-80dB @ 100kHz
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
6-UFDFN
Supplier Device Package:
6-DFN (1.2×1)
772
STG3220QTRSTG3220QTRSTMicroelectronicsIC SWITCH SPDT X 2 5.4OHM 10QFNAnalog Switches, Multiplexers, Demultiplexers10-QFN (1.8x1.4)N/A-40°C ~ 85°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
2
On-State Resistance (Max):
5.4Ohm
Channel-to-Channel Matching (ΔRon):
100mOhm
Voltage – Supply, Single (V+):
1.65V ~ 4.3V
Switch Time (Ton, Toff) (Max):
15ns, 13ns
-3db Bandwidth:
800MHz
Charge Injection:
6.4pC
Channel Capacitance (CS(off), CD(off)):
2pF
Current – Leakage (IS(off)) (Max):
20nA
Crosstalk:
-78dB @ 1MHz
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
10-UFQFN
Supplier Device Package:
10-QFN (1.8×1.4)
1,377
N/ASTG3384DTRSTMicroelectronicsIC SW SPST-NOX2 700MOHM 10TDFNAnalog Switches, Multiplexers, Demultiplexers10-TDFN (2.5x1.3)N/A-55°C ~ 125°C (TA)
Switch Circuit:
SPST – NO
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
2
On-State Resistance (Max):
700mOhm
Channel-to-Channel Matching (ΔRon):
600mOhm
Voltage – Supply, Single (V+):
1.65V ~ 4.3V
Switch Time (Ton, Toff) (Max):
50ns, 30ns
-3db Bandwidth:
85MHz
Charge Injection:
44pC
Channel Capacitance (CS(off), CD(off)):
5pF
Current – Leakage (IS(off)) (Max):
10nA
Crosstalk:
-76dB @ 100kHz
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
10-UFDFN
Supplier Device Package:
10-TDFN (2.5×1.3)
81
STG3482QTRN/ASTG3482QTRSTMicroelectronicsIC SWITCH SP4T X 2 5.2OHM 16QFNAnalog Switches, Multiplexers, Demultiplexers16-QFN (2.6x1.8)N/A-40°C ~ 85°C
Switch Circuit:
SP4T
Multiplexer/Demultiplexer Circuit:
4:1
Number of Circuits:
2
On-State Resistance (Max):
5.2Ohm
Channel-to-Channel Matching (ΔRon):
300mOhm
Voltage – Supply, Single (V+):
1.65V ~ 4.3V
Switch Time (Ton, Toff) (Max):
18ns, 15ns
-3db Bandwidth:
300MHz
Charge Injection:
11pC
Current – Leakage (IS(off)) (Max):
20nA
Crosstalk:
-77dB @ 1MHz
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
16-UFQFN Exposed Pad
Supplier Device Package:
16-QFN (2.6×1.8)
657
STG3680QTRSTG3680QTRSTMicroelectronicsIC SWITCH SPDT X 2 800MOHM 16QFNAnalog Switches, Multiplexers, Demultiplexers16-QFN (3x3)N/A-55°C ~ 125°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
2
On-State Resistance (Max):
800mOhm
Channel-to-Channel Matching (ΔRon):
60mOhm
Voltage – Supply, Single (V+):
1.65V ~ 4.3V
Switch Time (Ton, Toff) (Max):
50ns, 30ns
-3db Bandwidth:
50MHz
Charge Injection:
35pC
Channel Capacitance (CS(off), CD(off)):
5pF
Current – Leakage (IS(off)) (Max):
10nA
Crosstalk:
-54dB @ 100kHz
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
16-VFQFN Exposed Pad
Supplier Device Package:
16-QFN (3×3)
631
STG3682QTRSTG3682QTRSTMicroelectronicsIC SWITCH SPDT X 2 5.2OHM 10QFNAnalog Switches, Multiplexers, Demultiplexers10-QFN (1.8x1.4)N/A-40°C ~ 85°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
2
On-State Resistance (Max):
5.2Ohm
Channel-to-Channel Matching (ΔRon):
300mOhm
Voltage – Supply, Single (V+):
1.65V ~ 4.3V
Switch Time (Ton, Toff) (Max):
15ns, 13ns
-3db Bandwidth:
800MHz
Charge Injection:
5pC
Channel Capacitance (CS(off), CD(off)):
5pF
Current – Leakage (IS(off)) (Max):
20nA
Crosstalk:
-78dB @ 1MHz
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
10-UFQFN
Supplier Device Package:
10-QFN (1.8×1.4)
1,828

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up