STA1095POA3

IC MPU 450MHZ 361LFBGA
Part Description

ARM® Cortex®-R4 Microprocessor IC - 2 Core, 32-Bit 450MHz 361-LFBGA (16x16)

Quantity 317 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTA1095 (Telematics)
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time30 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M3Core ProcessorARM® Cortex®-R4Device Package361-LFBGA (16x16)
Display & Interface ControllersLCD, TouchscreenECCNN/AGradeAutomotive
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case361-LFBGARAM ControllersSDRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesJTAG
Speed450MHzSupplier Device Package361-LFBGA (16×16)USBUSB 2.0 (2)
Voltage – I/O3.3V

Overview of STA1095POA3 – IC MPU 450MHZ 361LFBGA

The STA1095POA3 is an ARM® Cortex®-R4 microprocessor IC in the STA1095 telematics series from STMicroelectronics. It integrates two 32‑bit cores running at 450 MHz in a 361‑LFBGA (16×16) package for embedded system applications.

Designed for telematics and automotive embedded use, the device combines multi‑core processing, graphics acceleration and multiple peripheral interfaces to support infotainment, display and connectivity subsystems while meeting automotive AEC‑Q100 qualification and industry environmental requirements.

Key Features

  • Core: Dual ARM® Cortex®‑R4 32‑bit cores operating at 450 MHz for high‑performance embedded processing.
  • Co‑processor: ARM® Cortex®‑M3 listed as a DSP co‑processor to complement main core processing tasks.
  • Memory and Controllers: Integrated SDRAM controller to interface with external SDRAM memory.
  • Display and Graphics: LCD and touchscreen display interface controllers plus graphics acceleration to support visual user interfaces.
  • Connectivity: CANbus interface for in‑vehicle networks and other serial connectivity needs.
  • USB: Two USB 2.0 interfaces for peripheral connectivity and data transfer.
  • Security & Debug: JTAG support for device debugging and development workflows.
  • Power and I/O: 3.3 V I/O signaling for common automotive and embedded voltage domains.
  • Package & Mounting: 361‑LFBGA (16×16) surface‑mount package suitable for compact board designs.
  • Automotive Qualification & Temperature Range: AEC‑Q100 qualification and an operating temperature range of −40 °C to 85 °C.
  • Environmental Compliance: RoHS compliant to meet environmental material restrictions.

Typical Applications

  • Telematics Modules: Dual‑core processing and peripheral integration make this device suitable for telematics control units and communication hubs.
  • Automotive Infotainment: LCD/touchscreen controllers, graphics acceleration and USB interfaces support in‑vehicle infotainment subsystems.
  • In‑Vehicle Displays: Integrated display interfaces and graphics acceleration are useful for instrument clusters and center displays.
  • Connectivity Gateways: CANbus and multiple USB 2.0 interfaces enable gateway and data‑bridging functions in vehicle networks.

Unique Advantages

  • Dual‑core performance: Two 32‑bit Cortex‑R4 cores at 450 MHz deliver parallel processing capability for compute‑intensive embedded tasks.
  • Integrated peripheral set: On‑chip SDRAM controller, display controllers, USB and CANbus reduce external component count and simplify board design.
  • Automotive readiness: AEC‑Q100 qualification and a −40 °C to 85 °C operating range support deployment in automotive environments.
  • Compact footprint: 361‑LFBGA (16×16) surface‑mount package enables high‑density PCB layouts.
  • Development and debug support: JTAG availability facilitates firmware development and system bring‑up.
  • Regulatory compliance: RoHS compliance addresses environmental material requirements.

Why Choose STA1095POA3?

The STA1095POA3 positions itself as a high‑performance, highly integrated microprocessor for telematics and automotive embedded systems. With dual ARM® Cortex®‑R4 cores at 450 MHz, an ARM® Cortex®‑M3 co‑processor, rich display and connectivity interfaces, and automotive AEC‑Q100 qualification, it targets designs that require balanced compute power, display capability and vehicle network integration.

Manufactured by STMicroelectronics and delivered in a compact 361‑LFBGA package with 3.3 V I/O and RoHS compliance, the STA1095POA3 is suited for engineers specifying robust, production‑grade components for telematics, infotainment and in‑vehicle gateway applications.

Request a quote or submit an inquiry to receive pricing and availability information for the STA1095POA3. Our team can provide lead‑time details and support for your design evaluation and sourcing needs.

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