STA1095POA3
| Part Description |
ARM® Cortex®-R4 Microprocessor IC - 2 Core, 32-Bit 450MHz 361-LFBGA (16x16) |
|---|---|
| Quantity | 317 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | STA1095 (Telematics) |
| Manufacturer | STMicroelectronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 30 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M3 | Core Processor | ARM® Cortex®-R4 | Device Package | 361-LFBGA (16x16) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD, Touchscreen | ECCN | N/A | Grade | Automotive | ||
| Graphics Acceleration | Yes | HTS Code | N/A | Moisture Sensitivity Level | N/A | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Package / Case | 361-LFBGA | RAM Controllers | SDRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | JTAG | ||
| Speed | 450MHz | Supplier Device Package | 361-LFBGA (16×16) | USB | USB 2.0 (2) | ||
| Voltage – I/O | 3.3V |
Overview of STA1095POA3 – IC MPU 450MHZ 361LFBGA
The STA1095POA3 is an ARM® Cortex®-R4 microprocessor IC in the STA1095 telematics series from STMicroelectronics. It integrates two 32‑bit cores running at 450 MHz in a 361‑LFBGA (16×16) package for embedded system applications.
Designed for telematics and automotive embedded use, the device combines multi‑core processing, graphics acceleration and multiple peripheral interfaces to support infotainment, display and connectivity subsystems while meeting automotive AEC‑Q100 qualification and industry environmental requirements.
Key Features
- Core: Dual ARM® Cortex®‑R4 32‑bit cores operating at 450 MHz for high‑performance embedded processing.
- Co‑processor: ARM® Cortex®‑M3 listed as a DSP co‑processor to complement main core processing tasks.
- Memory and Controllers: Integrated SDRAM controller to interface with external SDRAM memory.
- Display and Graphics: LCD and touchscreen display interface controllers plus graphics acceleration to support visual user interfaces.
- Connectivity: CANbus interface for in‑vehicle networks and other serial connectivity needs.
- USB: Two USB 2.0 interfaces for peripheral connectivity and data transfer.
- Security & Debug: JTAG support for device debugging and development workflows.
- Power and I/O: 3.3 V I/O signaling for common automotive and embedded voltage domains.
- Package & Mounting: 361‑LFBGA (16×16) surface‑mount package suitable for compact board designs.
- Automotive Qualification & Temperature Range: AEC‑Q100 qualification and an operating temperature range of −40 °C to 85 °C.
- Environmental Compliance: RoHS compliant to meet environmental material restrictions.
Typical Applications
- Telematics Modules: Dual‑core processing and peripheral integration make this device suitable for telematics control units and communication hubs.
- Automotive Infotainment: LCD/touchscreen controllers, graphics acceleration and USB interfaces support in‑vehicle infotainment subsystems.
- In‑Vehicle Displays: Integrated display interfaces and graphics acceleration are useful for instrument clusters and center displays.
- Connectivity Gateways: CANbus and multiple USB 2.0 interfaces enable gateway and data‑bridging functions in vehicle networks.
Unique Advantages
- Dual‑core performance: Two 32‑bit Cortex‑R4 cores at 450 MHz deliver parallel processing capability for compute‑intensive embedded tasks.
- Integrated peripheral set: On‑chip SDRAM controller, display controllers, USB and CANbus reduce external component count and simplify board design.
- Automotive readiness: AEC‑Q100 qualification and a −40 °C to 85 °C operating range support deployment in automotive environments.
- Compact footprint: 361‑LFBGA (16×16) surface‑mount package enables high‑density PCB layouts.
- Development and debug support: JTAG availability facilitates firmware development and system bring‑up.
- Regulatory compliance: RoHS compliance addresses environmental material requirements.
Why Choose STA1095POA3?
The STA1095POA3 positions itself as a high‑performance, highly integrated microprocessor for telematics and automotive embedded systems. With dual ARM® Cortex®‑R4 cores at 450 MHz, an ARM® Cortex®‑M3 co‑processor, rich display and connectivity interfaces, and automotive AEC‑Q100 qualification, it targets designs that require balanced compute power, display capability and vehicle network integration.
Manufactured by STMicroelectronics and delivered in a compact 361‑LFBGA package with 3.3 V I/O and RoHS compliance, the STA1095POA3 is suited for engineers specifying robust, production‑grade components for telematics, infotainment and in‑vehicle gateway applications.
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