STA1095ELA3

IC MPU 450MHZ 361LFBGA
Part Description

ARM® Cortex®-R4 Microprocessor IC - 2 Core, 32-Bit 450MHz 361-LFBGA (16x16)

Quantity 1,485 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTA1095 (Telematics)
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time30 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M3Core ProcessorARM® Cortex®-R4Device Package361-LFBGA (16x16)
Display & Interface ControllersLCD, TouchscreenECCNN/AGradeAutomotive
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case361-LFBGARAM ControllersSDRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesBoot Security, Secure JTAG
Speed450MHzSupplier Device Package361-LFBGA (16×16)USBUSB 2.0 (2)
Voltage – I/O3.3V

Overview of STA1095ELA3 – IC MPU 450MHz 361-LFBGA

The STA1095ELA3 is a dual-core ARM® Cortex®-R4 microprocessor IC designed for telematics applications. It integrates two 32-bit Cortex-R4 cores running at 450 MHz, with an ARM® Cortex®-M3 coprocessor and a range of on-chip controllers and interfaces targeted at embedded automotive systems.

Built for automotive telematics and infotainment use, the device combines processing performance, on-chip graphics acceleration and multiple connectivity options to support display, USB and vehicle-bus functions while meeting AEC‑Q100 qualification for automotive grade deployments.

Key Features

  • Core and Coprocessor  Dual ARM® Cortex®-R4 32‑bit cores at 450 MHz, plus an ARM® Cortex®-M3 coprocessor for task partitioning and real-time control.
  • Memory and Controllers  Integrated SDRAM controller to support external memory for application and graphics workloads.
  • Display and Graphics  On-chip display interface controllers for LCD and touchscreen support, with graphics acceleration to drive rich HMIs.
  • Connectivity  Two USB 2.0 interfaces and CANbus support provide high-speed host/device connectivity and in-vehicle communications.
  • Security  Boot Security and Secure JTAG features enable protected boot and secure debug access for safety-conscious applications.
  • Power and I/O  I/O voltage specified at 3.3 V for common automotive signaling levels.
  • Package and Mounting  361‑LFBGA package (16×16) in a surface-mount form factor suitable for compact board designs.
  • Automotive Qualification and Temperature Range  Automotive grade with AEC‑Q100 qualification and an operating range from −40 °C to 85 °C for in-vehicle environments.
  • Environmental Compliance  RoHS compliant to meet regulatory environmental requirements.

Typical Applications

  • Automotive Telematics and Infotainment  Drive telematics control units and infotainment subsystems that require application processing, graphics acceleration and multiple I/O options.
  • Human‑Machine Interfaces (HMI)  Power LCD and touchscreen displays with on-chip display controllers and graphics acceleration for responsive user interfaces.
  • In‑Vehicle Connectivity and Gateways  Provide USB 2.0 and CANbus connectivity for device interfaces, media inputs and vehicle network bridging.
  • Secure Embedded Systems  Implement protected boot flows and secure debug using Boot Security and Secure JTAG for safety- and security-sensitive functions.

Unique Advantages

  • Dual high-performance cores: Two ARM® Cortex®-R4 cores at 450 MHz deliver deterministic processing capacity for real-time telematics tasks.
  • Integrated coprocessor: ARM® Cortex®-M3 coprocessor enables separation of control and application workloads to simplify system partitioning.
  • Comprehensive I/O set: Built-in USB 2.0 interfaces, CANbus and display controllers reduce external component count for streamlined designs.
  • Automotive-grade qualification: AEC‑Q100 qualification and an industrial temperature range support deployment in vehicle environments.
  • Security primitives on-chip: Boot Security and Secure JTAG support secure boot and protected debug for sensitive applications.
  • Compact package: 361‑LFBGA (16×16) surface-mount package enables high-density board integration.

Why Choose STA1095ELA3?

The STA1095ELA3 positions itself as a purpose-built telematics microprocessor that combines dual Cortex‑R4 performance with an ARM® Cortex®‑M3 coprocessor, on-chip graphics acceleration and a broad set of connectivity and security features. Its automotive grade qualification and extended operating temperature range make it suitable for in-vehicle designs requiring robustness and integration.

Designed and manufactured by STMicroelectronics, the STA1095ELA3 offers a compact package and integrated controllers that help reduce BOM complexity and accelerate development for automotive telematics, infotainment and secure embedded applications.

Request a quote or submit an inquiry to receive pricing, availability and lead‑time information for the STA1095ELA3.

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