STA1385ELAS2

IC MPU AEC-Q100 600MHZ 361LFBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC - 2 Core, 32-Bit 600MHz 361-LFBGA (16x16)

Quantity 786 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTA1385 (ADAS)
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time30 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M3, Multimedia; NEONCore ProcessorARM® Cortex®-A7Device Package361-LFBGA (16x16)
ECCNN/AEthernetGBE (2)GradeAutomotive
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 150°C (TJ)Package / Case361-LFBGAQualificationAEC-Q100
RAM ControllersDDR3L, LPDDR2, SRAMREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesAES, MD5, SHA-1/2, TRNGSpeed600MHzSupplier Device Package361-LFBGA (16×16)
USBUSB 2.0 + PHY (2)Voltage – I/O3.3V

Overview of STA1385ELAS2 – IC MPU AEC-Q100 600MHZ 361LFBGA

The STA1385ELAS2 is a dual-core ARM® Cortex®-A7 microprocessor IC clocked at 600 MHz in a 361-LFBGA (16×16) package from STMicroelectronics. Designed for embedded and automotive applications (STA1385 series, ADAS), it combines multicore processing, integrated memory controllers and vehicle-grade interfaces for robust in-vehicle and edge computing tasks.

With AEC-Q100 qualification, a wide operating temperature range and hardware security primitives, the device targets automotive and other demanding embedded segments where reliability, integration and secure processing are required.

Key Features

  • Processor Core  Dual ARM® Cortex®-A7 32-bit cores running at 600 MHz, providing multicore application processing.
  • Co-processor and Multimedia  Includes ARM® Cortex®-M3 co-processor and NEON multimedia capabilities for offloading control and media tasks.
  • Memory Interfaces  Integrated controllers for DDR3L, LPDDR2 and SRAM to support system memory and buffer requirements.
  • High-speed Networking  Two Gigabit Ethernet (GBE) interfaces for robust in-vehicle and network connectivity.
  • USB and PHY  Two USB 2.0 ports with PHY support for peripheral connectivity and device interfaces.
  • Vehicle Interfaces  CAN interface for automotive networking and sensor/bus integration.
  • Security Features  Hardware-accelerated AES, MD5, SHA-1/2 and a True Random Number Generator (TRNG) for secure processing and cryptographic operations.
  • Power and I/O  3.3 V I/O voltage for compatibility with common automotive and embedded I/O domains.
  • Package and Mounting  361-LFBGA (16×16) surface-mount package for compact system integration.
  • Automotive Qualification and Temperature Range  AEC-Q100 qualified and specified for operation from −40 °C to 150 °C.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Advanced Driver-Assistance Systems (ADAS)  Multi-core processing, secure engines and automotive interfaces support compute and sensor-fusion tasks in ADAS systems.
  • Automotive Infotainment & Telematics  Network interfaces (GBE, CAN) and USB support enable connectivity and data exchange for infotainment and telematics modules.
  • Vehicle Gateway and Networking  Dual Gigabit Ethernet and CAN interfaces make the device suitable for vehicle gateway, routing and domain-controller roles.
  • Secure Edge Processing  On-chip AES, hashing and TRNG provide hardware primitives for secure boot, encryption and trusted telemetry at the vehicle edge.

Unique Advantages

  • Automotive-qualified robustness: AEC-Q100 qualification and a −40 °C to 150 °C operating range support deployment in harsh automotive environments.
  • Integrated connectivity: Dual GBE, USB 2.0 with PHY and CAN reduce external interface components and simplify system design.
  • Balanced compute and control: Dual Cortex‑A7 application cores with an ARM Cortex‑M3 co-processor provide separation of real-time control and application workloads.
  • Built-in security primitives: AES, MD5, SHA‑1/2 and TRNG enable hardware-backed cryptography and entropy generation for secure communication and data protection.
  • Flexible memory support: DDR3L, LPDDR2 and SRAM controllers offer options for scalable system memory architectures.
  • Compact packaging: 361‑LFBGA (16×16) surface-mount package enables high-density board integration for space-constrained automotive modules.

Why Choose STA1385ELAS2?

The STA1385ELAS2 positions itself as a compact, automotive-grade microprocessor solution combining multicore application processing, a control co-processor and a broad set of in-vehicle interfaces. Its integrated memory controllers, dual Gigabit Ethernet, USB and CAN support deliver a highly connected platform for embedded and automotive systems.

With hardware security features, RoHS compliance and AEC-Q100 qualification across a wide temperature range, STA1385ELAS2 is suited to designs that require reliable, secure and integrated compute in demanding environments.

Request a quote or submit a pricing enquiry to evaluate STA1385ELAS2 for your next embedded or automotive design. Our team can provide availability and ordering information tailored to your project needs.

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