STA1385EOAS2
| Part Description |
ARM® Cortex®-A7 Microprocessor IC - 2 Core, 32-Bit 600MHz 361-LFBGA (16x16) |
|---|---|
| Quantity | 607 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | STA1385 (ADAS) |
| Manufacturer | STMicroelectronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 30 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M3, Multimedia; NEON | Core Processor | ARM® Cortex®-A7 | Device Package | 361-LFBGA (16x16) | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | GBE (2) | Grade | Automotive | ||
| Graphics Acceleration | No | HTS Code | N/A | Moisture Sensitivity Level | N/A | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 150°C (TJ) | Package / Case | 361-LFBGA | Qualification | AEC-Q100 | ||
| RAM Controllers | DDR3L, LPDDR2, SRAM | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | AES, MD5, SHA-1/2, TRNG | Speed | 600MHz | Supplier Device Package | 361-LFBGA (16×16) | ||
| USB | USB 2.0 + PHY (2) | Voltage – I/O | 3.3V |
Overview of STA1385EOAS2 – IC MPU AEC-Q100 600MHz 361-LFBGA
The STA1385EOAS2 is an automotive-grade microprocessor IC featuring a dual-core ARM® Cortex®-A7 architecture running at 600 MHz. It is part of the STA1385 (ADAS) series and integrates processing, communications, and security capabilities targeted at embedded automotive applications.
Designed for use in automotive systems, the device combines dual 32-bit cores with dedicated co-processors and a range of on-chip interfaces to deliver a compact, qualified building block for ADAS, infotainment and telematics designs that require broad connectivity and extended temperature operation.
Key Features
- Core and Co-processors Dual ARM® Cortex®-A7 32-bit cores at 600 MHz, with additional co-processors including an ARM® Cortex®-M3 and multimedia/NEON capabilities for specialized processing tasks.
- Memory Interfaces Integrated controllers for DDR3L, LPDDR2 and SRAM to support flexible system memory architectures.
- Interfaces & Connectivity Dual Gigabit Ethernet (GBE) ports, two USB 2.0 ports with PHY, and CAN interface support common automotive network topologies.
- Security Features On-chip security primitives including AES, MD5, SHA-1/2 and a True Random Number Generator (TRNG) for cryptographic and integrity functions.
- Power & I/O 3.3 V I/O voltage compatibility for common automotive peripheral interfacing.
- Package & Mounting 361-LFBGA surface-mount package (16 × 16 mm) for compact PCB integration.
- Qualification & Temperature Range AEC-Q100 qualified with an operating temperature range from -40 °C to 150 °C suitable for demanding automotive environments.
- Graphics Acceleration No graphics acceleration included, focusing silicon resources on compute, connectivity and security functions.
Typical Applications
- Advanced Driver Assistance Systems (ADAS) Dual Cortex-A7 cores with co-processors and automotive qualification make it suitable for ADAS processing and sensor-domain tasks.
- Automotive Infotainment & Telematics Ethernet, USB and CAN interfaces combined with memory controller options support infotainment and telematics modules.
- Vehicle Gateway and Network Controllers Multiple network interfaces and security features enable secure data routing and domain connectivity in vehicle networks.
Unique Advantages
- AEC-Q100 Automotive Qualification: Provides the explicit automotive grade qualification required for automotive system design and validation.
- Integrated Connectivity: Dual Gigabit Ethernet, USB 2.0 with PHY and CAN support reduce external interface components and simplify board design.
- On-chip Security Primitives: AES, MD5, SHA-1/2 and TRNG accelerate implementation of secure communication and data integrity features.
- Flexible Memory Support: Controllers for DDR3L, LPDDR2 and SRAM allow designers to tailor system memory to performance and cost targets.
- Wide Operating Temperature: Rated from -40 °C to 150 °C for use in harsh automotive environments and extended-temperature applications.
- Compact BGA Package: 361-LFBGA (16 × 16 mm) enables high-density PCB layouts in space-constrained automotive modules.
Why Choose STA1385EOAS2?
The STA1385EOAS2 positions itself as a purpose-built automotive microprocessor IC that balances multicore compute, connectivity and on-chip security within an AEC-Q100 qualified package. Its dual ARM® Cortex®-A7 cores, co-processor resources, and broad interface set make it a practical choice for embedded automotive systems where integration, qualification and operating range matter.
Engineers building ADAS, infotainment, telematics or gateway modules will find a compact, qualified MPU with flexible memory options and hardened security primitives that support long-term platform robustness and system-level integration.
Request a quote or submit a product inquiry to receive pricing and availability information for the STA1385EOAS2.

Date Founded: 1987
Headquarters: Plan-les-Ouates, Geneva, Switzerland
Employees: 50,000+
Revenue: $17.24 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO45001:2018, IATF16949:2016, ISO50001:2018