STA1385EOAS1

IC MPU AEC-Q100 600MHZ 361LFBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC - 2 Core, 32-Bit 600MHz 361-LFBGA (16x16)

Quantity 175 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTA1385 (ADAS)
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time30 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M3, Multimedia; NEONCore ProcessorARM® Cortex®-A7Device Package361-LFBGA (16x16)
ECCNN/AEthernetGBE (2)GradeAutomotive
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 150°C (TJ)Package / Case361-LFBGAQualificationAEC-Q100
RAM ControllersDDR3L, LPDDR2, SRAMREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesAES, MD5, SHA-1/2, TRNGSpeed600MHzSupplier Device Package361-LFBGA (16×16)
USBUSB 2.0 + PHY (2)Voltage – I/O3.3V

Overview of STA1385EOAS1 – ARM Cortex-A7 2-Core 600 MHz Microprocessor

The STA1385EOAS1 is a dual-core ARM® Cortex®-A7 microprocessor IC running at 600 MHz in a 361-LFBGA (16×16) package. Part of the STA1385 (ADAS) series from STMicroelectronics, it is tailored for automotive applications requiring integrated processing, connectivity and on-chip security.

Designed for embedded automotive systems, the device combines a dual 32-bit application core with dedicated co-processing and multimedia capabilities, multi-standard memory controller support, and multiple high-speed interfaces for vehicle networking and system integration.

Key Features

  • Core  Dual ARM® Cortex®-A7 32-bit processor cores operating at 600 MHz for application-level processing.
  • Co-processors & Multimedia  Integrated co-processor functionality including ARM® Cortex®-M3 and NEON multimedia acceleration for offloading control tasks and SIMD media processing.
  • Memory  Flexible memory controller support for DDR3L, LPDDR2 and SRAM to match a range of embedded memory architectures.
  • Interfaces  Dual Gigabit Ethernet (GBE) ports, two USB 2.0 controllers with PHY, and CAN interface provide broad vehicle and system connectivity options.
  • Security  On-chip security features including AES, MD5, SHA-1/2 and a true random number generator (TRNG) to support secure communications and data protection.
  • Power & I/O  3.3 V I/O signaling to match common automotive and embedded interfaces.
  • Package & Mounting  361-LFBGA (16×16) surface-mount package for compact board-level integration.
  • Temperature & Qualification  Automotive-grade qualification (AEC-Q100) and operating temperature range from −40 °C to 150 °C for high-temperature automotive environments.
  • Compliance  RoHS-compliant construction.

Typical Applications

  • Advanced Driver Assistance Systems (ADAS)  Used as a processing node in ADAS electronic architectures to handle application-level control and secure communications.
  • In-vehicle Networking & Gateways  Dual Gigabit Ethernet, USB and CAN interfaces enable network bridging, data aggregation and gateway functions.
  • Telematics & Connectivity Modules  On-chip security and connectivity support secure vehicle telematics, data logging and over-the-air communication functions.

Unique Advantages

  • Automotive-qualified platform: AEC-Q100 qualification and −40 °C to 150 °C operating range provide a validated foundation for high-temperature automotive designs.
  • Balanced processing and offload: Dual Cortex-A7 cores plus an ARM Cortex-M3 co-processor and NEON multimedia acceleration allow workload partitioning for responsive systems.
  • Comprehensive connectivity: Dual GBE ports, dual USB 2.0 with PHYs and CAN support simplify integration into complex vehicle networks.
  • Integrated security primitives: Built-in AES, MD5, SHA-1/2 and TRNG enable hardware-supported cryptographic functions and secure key generation.
  • Flexible memory support: DDR3L, LPDDR2 and SRAM controller compatibility eases memory selection across performance and cost trade-offs.
  • Compact, surface-mount packaging: The 361-LFBGA (16×16) package supports dense PCB designs and automated assembly.

Why Choose STA1385EOAS1?

The STA1385EOAS1 positions itself as an integrated, automotive-grade microprocessor solution that combines dual 32-bit Cortex-A7 processing, co-processing and multimedia acceleration, broad I/O and on-chip security. Its qualification to AEC-Q100 and wide operating temperature range make it suitable for demanding in-vehicle environments where reliability and thermal tolerance are required.

This device is appropriate for designers developing ADAS functions, in-vehicle gateways, and telematics nodes who require an off-the-shelf silicon platform with connectivity, memory flexibility, and built-in security primitives from STMicroelectronics.

Request a quote or submit an inquiry to obtain pricing and availability for the STA1385EOAS1 and to discuss how it fits your design requirements.

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