 | | AM2432BKEGHIALXR | Texas Instruments | IC MCU 32BIT 256KB TCM 293VFBGA | Microcontrollers | 293-FC/CSP (11x11) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, TRNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 293-FC/CSP (11×11) Package / Case: 293-VFBGA, FCCSPBGA | 1,351 | |
 | | AM2432BKFGHIALXR | Texas Instruments | IC MCU 32BIT 256KB TCM 293VFBGA | Microcontrollers | 293-FC/CSP (11x11) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, TRNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 293-FC/CSP (11×11) Package / Case: 293-VFBGA, FCCSPBGA | 1,845 | |
 | | AM2432BSDFHIALVR | Texas Instruments | IC MCU 32BIT 256KB TCM 441FCBGA | Microcontrollers | 441-FCBGA (17.2x17.2) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, TRNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 441-FCBGA (17.2×17.2) Package / Case: 441-BFBGA, FCBGA | 271 | |
 | | AM2432BSDFHIALXR | Texas Instruments | IC MCU 32BIT 256KB TCM 293VFBGA | Microcontrollers | 293-FC/CSP (11x11) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, TRNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 293-FC/CSP (11×11) Package / Case: 293-VFBGA, FCCSPBGA | 1,381 | |
 | | AM2432BSDGHIALV | Texas Instruments | IC MCU 32BIT 256KB TCM 441FCBGA | Microcontrollers | 441-FCBGA (17.2x17.2) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Core Size: 32-Bit Quad-Core Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 441-FCBGA (17.2×17.2) Package / Case: 441-BFBGA, FCBGA | 1,526 | |
 | | AM2432BSDGHIALVR | Texas Instruments | IC MCU 32BIT 256KB TCM 441FCBGA | Microcontrollers | 441-FCBGA (17.2x17.2) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 441-FCBGA (17.2×17.2) Package / Case: 441-BFBGA, FCBGA | 70 | |
 | | AM2432BSDGHIALXR | Texas Instruments | IC MCU 32BIT 256KB TCM 293VFBGA | Microcontrollers | 293-FC/CSP (11x11) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, TRNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 293-FC/CSP (11×11) Package / Case: 293-VFBGA, FCCSPBGA | 147 | |
 | | AM2432BSEFHIALVR | Texas Instruments | IC MCU 32BIT 256KB TCM 441FCBGA | Microcontrollers | 441-FCBGA (17.2x17.2) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, TRNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 441-FCBGA (17.2×17.2) Package / Case: 441-BFBGA, FCBGA | 756 | |
 | | AM2432BSEFHIALXR | Texas Instruments | IC MCU 32BIT 256KB TCM 293VFBGA | Microcontrollers | 293-FC/CSP (11x11) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, TRNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 293-FC/CSP (11×11) Package / Case: 293-VFBGA, FCCSPBGA | 1,439 | |
 | | AM2432BSFFHIALV | Texas Instruments | IC MCU 32BIT 256KB TCM 441FCBGA | Microcontrollers | 441-FCBGA (17.2x17.2) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Core Size: 32-Bit Quad-Core Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 441-FCBGA (17.2×17.2) Package / Case: 441-BFBGA, FCBGA | 581 | |
 | | AM2432BSFFHIALVR | Texas Instruments | IC MCU 32BIT 256KB TCM 441FCBGA | Microcontrollers | 441-FCBGA (17.2x17.2) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Core Size: 32-Bit Quad-Core Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 441-FCBGA (17.2×17.2) Package / Case: 441-BFBGA, FCBGA | 582 | |
 | | AM2432BSFFHIALXR | Texas Instruments | IC MCU 32BIT 256KB TCM 293VFBGA | Microcontrollers | 293-FC/CSP (11x11) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, TRNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 293-FC/CSP (11×11) Package / Case: 293-VFBGA, FCCSPBGA | 495 | |
 | | AM2434BSDFHIALVR | Texas Instruments | QUAD-CORE ARM CORTEX-R5F-BASED M | Microcontrollers | 441-FCBGA (17.2x17.2) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, TRNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 441-FCBGA (17.2×17.2) Package / Case: 441-BFBGA, FCBGA | 329 | |
 | | AM2434BSDFHIALXR | Texas Instruments | QUAD-CORE ARM CORTEX-R5F-BASED M | Microcontrollers | 293-FC/CSP (11x11) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, TRNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 293-FC/CSP (11×11) Package / Case: 293-VFBGA, FCCSPBGA | 788 | |
 | | AM2434BSDGHIALVR | Texas Instruments | QUAD-CORE ARM CORTEX-R5F-BASED M | Microcontrollers | 441-FCBGA (17.2x17.2) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, TRNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 441-FCBGA (17.2×17.2) Package / Case: 441-BFBGA, FCBGA | 1,437 | |
 | | AM2434BSDGHIALXR | Texas Instruments | QUAD-CORE ARM CORTEX-R5F-BASED M | Microcontrollers | 293-FC/CSP (11x11) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, TRNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 293-FC/CSP (11×11) Package / Case: 293-VFBGA, FCCSPBGA | 56 | |
 | | AM2434BSEFHIALVR | Texas Instruments | QUAD-CORE ARM CORTEX-R5F-BASED M | Microcontrollers | 441-FCBGA (17.2x17.2) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, TRNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 441-FCBGA (17.2×17.2) Package / Case: 441-BFBGA, FCBGA | 579 | |
 | | AM2434BSEFHIALXR | Texas Instruments | QUAD-CORE ARM CORTEX-R5F-BASED M | Microcontrollers | 293-FC/CSP (11x11) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, TRNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 293-FC/CSP (11×11) Package / Case: 293-VFBGA, FCCSPBGA | 1,439 | |
 | | AM2434BSFFHIALV | Texas Instruments | IC MCU 32BIT 256KB TCM 441FCBGA | Microcontrollers | 441-FCBGA (17.2x17.2) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 441-FCBGA (17.2×17.2) Package / Case: 441-BFBGA, FCBGA | 90 | |
 | | AM2434BSFFHIALVR | Texas Instruments | IC MCU 32BIT 256KB TCM 441FCBGA | Microcontrollers | 441-FCBGA (17.2x17.2) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 441-FCBGA (17.2×17.2) Package / Case: 441-BFBGA, FCBGA | 5 | |