Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
AM2434BSFFHIALXR
AM2434BSFFHIALXRTexas InstrumentsQUAD-CORE ARM CORTEX-R5F-BASED MMicrocontrollers293-FC/CSP (11x11)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-M4F, ARM® Cortex®-R5F
Core Size:
32-Bit 5-Core
Speed:
400MHz, 800MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
148
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 8x10b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
293-FC/CSP (11×11)
Package / Case:
293-VFBGA, FCCSPBGA
1,118
AM2614FM
AM2614FMAdvanced Micro DevicesIC DRIVER 4/0 16CFLATPACKDrivers, Receivers, Transceivers16-CFlatPack4.5V ~ 5.5V-55°C ~ 125°C (TA)
Type:
Driver
Number of Drivers/Receivers:
4/0
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
16-CFlatPack
Supplier Device Package:
16-CFlatPack
439
AM2631CNDGHAZCZR
AM2631CNDGHAZCZRTexas InstrumentsIC MCU 64BIT 256KB TCM 324NFBGAMicrocontrollers324-NFBGA (15x15)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit Single-Core
Speed:
400MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
140
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
2M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 6x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
324-NFBGA (15×15)
Package / Case:
324-LFBGA
527
AM2631CNDGHMZCZRQ1
AM2631CNDGHMZCZRQ1Texas InstrumentsIC MCU 32BIT 256KB TCM 324LFBGAMicrocontrollers324-NFBGA (15x15)N/A-40°C ~ 150°C (TJ)
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit
Speed:
400MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
140
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
2M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 6x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
324-NFBGA (15×15)
Package / Case:
324-LFBGA
1,030
AM2631CODGHMZCZRQ1
AM2631CODGHMZCZRQ1Texas InstrumentsIC MCU 64BIT 256KB TCM 324NFBGAMicrocontrollers324-NFBGA (15x15)N/A-40°C ~ 150°C (TJ)
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit Single-Core
Speed:
400MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
140
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
2M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 6x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
324-NFBGA (15×15)
Package / Case:
324-LFBGA
773
AM2632CNDFHAZCZR
AM2632CNDFHAZCZRTexas InstrumentsIC MCU 32BIT 256KB TCM 324LFBGAMicrocontrollers324-NFBGA (15x15)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit Dual-Core
Speed:
400MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
140
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
2M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 6x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
324-NFBGA (15×15)
Package / Case:
324-LFBGA
1,199
AM2632CNEFHAZCZR
AM2632CNEFHAZCZRTexas InstrumentsIC MCU 32BIT 256KB TCM 324LFBGAMicrocontrollers324-NFBGA (15x15)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit Dual-Core
Speed:
400MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
140
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
2M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 6x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
324-NFBGA (15×15)
Package / Case:
324-LFBGA
149
AM2632CODFHMZCZRQ1
AM2632CODFHMZCZRQ1Texas InstrumentsIC MCU 32BIT 256KB TCM 324LFBGAMicrocontrollers324-NFBGA (15x15)N/A-40°C ~ 150°C (TJ)
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit Dual-Core
Speed:
400MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
140
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
2M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 6x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
324-NFBGA (15×15)
Package / Case:
324-LFBGA
1,080
AM2632COKFHAZCZR
AM2632COKFHAZCZRTexas InstrumentsIC MCU 32BIT 256KB TCM 324LFBGAMicrocontrollers324-NFBGA (15x15)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit Dual-Core
Speed:
400MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
140
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
2M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 6x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
324-NFBGA (15×15)
Package / Case:
324-LFBGA
677
AM2632COKFHMZCZRQ1
AM2632COKFHMZCZRQ1Texas InstrumentsIC MCU 64BIT 256KB TCM 324NFBGAMicrocontrollers324-NFBGA (15x15)N/A-40°C ~ 150°C (TJ)
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit Dual-Core
Speed:
400MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
140
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
2M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 6x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
324-NFBGA (15×15)
Package / Case:
324-LFBGA
61
AM2632COLFHAZCZR
AM2632COLFHAZCZRTexas InstrumentsIC MCU 64BIT 256KB TCM 324NFBGAMicrocontrollers324-NFBGA (15x15)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit Dual-Core
Speed:
400MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
140
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
2M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 6x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
324-NFBGA (15×15)
Package / Case:
324-LFBGA
594
AM2632COMFHAZCZR
AM2632COMFHAZCZRTexas InstrumentsIC MCU 32BIT 256KB TCM 324LFBGAMicrocontrollers324-NFBGA (15x15)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit Dual-Core
Speed:
400MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
140
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
2M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 6x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
324-NFBGA (15×15)
Package / Case:
324-LFBGA
738
AM2632CPDFHMZCZRQ1
AM2632CPDFHMZCZRQ1Texas InstrumentsIC MCU 32BIT 256KB TCM 324LFBGAMicrocontrollers324-NFBGA (15x15)N/A-40°C ~ 150°C (TJ)
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
140
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
2M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 6x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
324-NFBGA (15×15)
Package / Case:
324-LFBGA
16
AM2634CODFHAZCZR
AM2634CODFHAZCZRTexas InstrumentsQUAD-CORE ARM CORTEX-R5F MCU UPMicrocontrollers324-NFBGA (15x15)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit Quad-Core
Speed:
400MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
140
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
2M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 6x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
324-NFBGA (15×15)
Package / Case:
324-LFBGA
55
AM2634CODFHMZCZRQ1
AM2634CODFHMZCZRQ1Texas InstrumentsIC MCU 32BIT 256KB TCM 324LFBGAMicrocontrollers324-NFBGA (15x15)N/A-40°C ~ 150°C (TJ)
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit Quad-Core
Speed:
400MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
140
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
2M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 6x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
324-NFBGA (15×15)
Package / Case:
324-LFBGA
158
AM2634COEFHAZCZR
AM2634COEFHAZCZRTexas InstrumentsQUAD-CORE ARM CORTEX-R5F MCU UPMicrocontrollers324-NFBGA (15x15)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit Quad-Core
Speed:
400MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
140
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
2M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 6x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
324-NFBGA (15×15)
Package / Case:
324-LFBGA
1,296
AM2634COKFHAZCZR
AM2634COKFHAZCZRTexas InstrumentsQUAD-CORE ARM CORTEX-R5F MCU UPMicrocontrollers324-NFBGA (15x15)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit Quad-Core
Speed:
400MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
140
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
2M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 6x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
324-NFBGA (15×15)
Package / Case:
324-LFBGA
1,018
AM2634COKFHMZCZRQ1
AM2634COKFHMZCZRQ1Texas InstrumentsIC MCU 64BIT 256KB TCM 324NFBGAMicrocontrollers324-NFBGA (15x15)N/A-40°C ~ 150°C (TJ)
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit Quad-Core
Speed:
400MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
140
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
2M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 6x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
324-NFBGA (15×15)
Package / Case:
324-LFBGA
35
AM2634COLFHAZCZR
AM2634COLFHAZCZRTexas InstrumentsQUAD-CORE ARM CORTEX-R5F MCU UPMicrocontrollers324-NFBGA (15x15)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit Quad-Core
Speed:
400MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
140
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
2M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 6x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
324-NFBGA (15×15)
Package / Case:
324-LFBGA
675
AM2634COMFHAZCZR
AM2634COMFHAZCZRTexas InstrumentsIC MCU 64BIT 256KB TCM 324NFBGAMicrocontrollers324-NFBGA (15x15)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit Quad-Core
Speed:
400MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
140
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
2M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 6x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
324-NFBGA (15×15)
Package / Case:
324-LFBGA
231

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