Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
TMS320F28374DZWTS
TMS320F28374DZWTSTexas InstrumentsIC MCU 32BIT 512KB FLSH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
86K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 24x12b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
269
TMS320F28374DZWTT
TMS320F28374DZWTTTexas InstrumentsIC MCU 32BIT 512KB FLSH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
86K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 24x12b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
519
TMS320F28374SPTPS
TMS320F28374SPTPSTexas InstrumentsIC MCU 32BIT 512KB FLSH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
66K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 20x12b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
346
TMS320F28374SPTPSR
TMS320F28374SPTPSRTexas InstrumentsIC MCU 32BIT 512KB FLSH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
66K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 20x12b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,208
TMS320F28374SPTPT
TMS320F28374SPTPTTexas InstrumentsIC MCU 32BIT 512KB FLSH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
66K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 20x12b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,136
TMS320F28374SPZPS
TMS320F28374SPZPSTexas InstrumentsIC MCU 32BIT 512KB FLSH 100HTQFPMicrocontrollers100-HTQFP (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
41
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
66K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 14x12b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HTQFP (14×14)
Package / Case:
100-TQFP Exposed Pad
219
TMS320F28374SPZPT
TMS320F28374SPZPTTexas InstrumentsIC MCU 32BIT 512KB FLSH 100HTQFPMicrocontrollers100-HTQFP (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
41
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
66K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 14x12b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HTQFP (14×14)
Package / Case:
100-TQFP Exposed Pad
1,474
TMS320F28374SZWTS
TMS320F28374SZWTSTexas InstrumentsIC MCU 32BIT 512KB FLSH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
66K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 24x12b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
639
TMS320F28374SZWTT
TMS320F28374SZWTTTexas InstrumentsIC MCU 32BIT 512KB FLSH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
66K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 24x12b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
942
TMS320F28374SZWTTR
TMS320F28374SZWTTRTexas InstrumentsIC MCU 32BIT 512KB FLSH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
66K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 24x12b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
1,465
TMS320F28375DPTPS
TMS320F28375DPTPSTexas InstrumentsIC MCU 32BIT 1MB FLASH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
102K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 20x12b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
983
TMS320F28375DPTPT
TMS320F28375DPTPTTexas InstrumentsIC MCU 32BIT 1MB FLASH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
102K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 20x12b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,069
TMS320F28375DPZPS
TMS320F28375DPZPSTexas InstrumentsIC MCU 32BIT 1MB FLASH 100HTQFPMicrocontrollers100-HTQFP (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
41
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
102K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 14x12b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HTQFP (14×14)
Package / Case:
100-TQFP Exposed Pad
242
TMS320F28375DZWTS
TMS320F28375DZWTSTexas InstrumentsIC MCU 32BIT 1MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
102K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 24x12b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
443
TMS320F28375DZWTT
TMS320F28375DZWTTTexas InstrumentsIC MCU 32BIT 1MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
102K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 24x12b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
366
TMS320F28375SPTPS
TMS320F28375SPTPSTexas InstrumentsIC MCU 32BIT 1MB FLASH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
82K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 20x12b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
362
TMS320F28375SPTPT
TMS320F28375SPTPTTexas InstrumentsIC MCU 32BIT 1MB FLASH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
82K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 20x12b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,551
TMS320F28375SPZPQ
TMS320F28375SPZPQTexas InstrumentsIC MCU 32BIT 1MB FLASH 100HTQFPMicrocontrollers100-HTQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
41
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
82K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 14x12b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-HTQFP (14×14)
Package / Case:
100-TQFP Exposed Pad
467
TMS320F28375SPZPQR
TMS320F28375SPZPQRTexas InstrumentsIC MCU 32BIT 1MB FLASH 100HTQFPMicrocontrollers100-HTQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
41
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
82K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 14x12b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-HTQFP (14×14)
Package / Case:
100-TQFP Exposed Pad
1,199
TMS320F28375SPZPS
TMS320F28375SPZPSTexas InstrumentsIC MCU 32BIT 1MB FLASH 100HTQFPMicrocontrollers100-HTQFP (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
41
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
82K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 14x12b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HTQFP (14×14)
Package / Case:
100-TQFP Exposed Pad
222

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