Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
TMS320F28375SPZPT
TMS320F28375SPZPTTexas InstrumentsIC MCU 32BIT 1MB FLASH 100HTQFPMicrocontrollers100-HTQFP (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
41
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
82K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 14x12b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HTQFP (14×14)
Package / Case:
100-TQFP Exposed Pad
814
TMS320F28375SZWTS
TMS320F28375SZWTSTexas InstrumentsIC MCU 32BIT 1MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
82K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 24x12b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
706
TMS320F28375SZWTT
TMS320F28375SZWTTTexas InstrumentsIC MCU 32BIT 1MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
82K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 24x12b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
152
TMS320F28376DPTPS
TMS320F28376DPTPSTexas InstrumentsIC MCU 32BIT 512KB FLSH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
86K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 20x12b, 9x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
837
TMS320F28376DPTPT
TMS320F28376DPTPTTexas InstrumentsIC MCU 32BIT 512KB FLSH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
86K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 20x12b, 9x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
271
TMS320F28376DZWTS
TMS320F28376DZWTSTexas InstrumentsIC MCU 32BIT 512KB FLSH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
86K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 24x12b, 12x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
810
TMS320F28376DZWTT
TMS320F28376DZWTTTexas InstrumentsIC MCU 32BIT 512KB FLSH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
86K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 24x12b, 12x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
959
TMS320F28376SPTPS
TMS320F28376SPTPSTexas InstrumentsIC MCU 32BIT 512KB FLSH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
66K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 20x12b, 20x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
797
TMS320F28376SPTPT
TMS320F28376SPTPTTexas InstrumentsIC MCU 32BIT 512KB FLSH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
66K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 20x12b, 20x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
96
TMS320F28376SPZPS
TMS320F28376SPZPSTexas InstrumentsIC MCU 32BIT 512KB FLSH 100HTQFPMicrocontrollers100-HTQFP (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
41
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
66K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 14x12b, 14x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HTQFP (14×14)
Package / Case:
100-TQFP Exposed Pad
230
TMS320F28376SPZPT
TMS320F28376SPZPTTexas InstrumentsIC MCU 32BIT 512KB FLSH 100HTQFPMicrocontrollers100-HTQFP (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
66K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 20x12b, 20x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HTQFP (14×14)
Package / Case:
100-TQFP Exposed Pad
527
TMS320F28376SZWTS
TMS320F28376SZWTSTexas InstrumentsIC MCU 32BIT 512KB FLSH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
66K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 24x12b, 12x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
990
TMS320F28376SZWTT
TMS320F28376SZWTTTexas InstrumentsIC MCU 32BIT 512KB FLSH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
66K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 24x12b, 12x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
297
TMS320F28377DGWTEP
TMS320F28377DGWTEPTexas InstrumentsNPI SOPRANO IHR4 RTM 12/31Microcontrollers337-NFBGA (16x16)N/A-55°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
102K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 24x12b, 12x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
961
TMS320F28377DPTPEP
TMS320F28377DPTPEPTexas InstrumentsIC MCU 32BIT 1MB FLASH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-55°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
102K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 20x12b, 9x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
941
TMS320F28377DPTPQ
TMS320F28377DPTPQTexas InstrumentsIC MCU 32BIT 1MB FLASH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
102K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 20x12b, 9x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
956
TMS320F28377DPTPS
TMS320F28377DPTPSTexas InstrumentsIC MCU 32BIT 1MB FLASH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
102K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 20x12b, 9x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
628
TMS320F28377DPTPT
TMS320F28377DPTPTTexas InstrumentsIC MCU 32BIT 1MB FLASH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
102K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 20x12b, 9x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
815
TMS320F28377DZWTQ
TMS320F28377DZWTQTexas InstrumentsIC MCU 32BIT 1MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
102K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 24x12b, 12x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
650
TMS320F28377DZWTQR
TMS320F28377DZWTQRTexas InstrumentsIC MCU 32BIT 1MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
102K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 24x12b, 12x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
267

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