Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
UPD70F3366GJ(A)-GAE-AXUPD70F3366GJ(A)-GAE-AXRenesas32BIT MCU V850ES/SX3Microcontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
128
Program Memory Size:
640KB (640K x 8)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b SAR; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,045
UPD70F3368GJ(A)-GAE-AXUPD70F3368GJ(A)-GAE-AXRenesas32BIT MCU V850ES/SJ3 1M 2CANMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
128
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
60K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x10b SAR; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,192
UPD70F3368GJ(A)-GAE-E2-AXN/AUPD70F3368GJ(A)-GAE-E2-AXRenesasIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
128
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
60K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x10b SAR; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
574
UPD70F3370AM1GBA-GAH-AXUPD70F3370AM1GBA-GAH-AXRenesasIC MCU 32BIT 128KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
441
UPD70F3370AM1GBA-GAH-E2-QS-AXN/AUPD70F3370AM1GBA-GAH-E2-QS-AXRenesasIC MCU 32BIT 128MB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,606
UPD70F3370AM2GBA-GAH-AXUPD70F3370AM2GBA-GAH-AXRenesas32BIT MCU V850ES/FX3Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,736
UPD70F3370AM2GBA-GAH-E2-AXN/AUPD70F3370AM2GBA-GAH-E2-AXRenesasIC MCU 32BIT 128MB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,418
UPD70F3370AM2GBA-GAH-E3-QS-AXUPD70F3370AM2GBA-GAH-E3-QS-AXRenesas32BIT MCU V850ES/FE2 128KMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,081
UPD70F3370AM2GBA-GAH-QS-AXN/AUPD70F3370AM2GBA-GAH-QS-AXRenesasIC MCU 32BIT 128MB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
949
UPD70F3370AM2GBA1-GAH-E2-AXN/AUPD70F3370AM2GBA1-GAH-E2-AXRenesasIC MCU 32BIT 128MB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 110°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
121
UPD70F3370AM2GBA1-GAH-E2-QS-AXN/AUPD70F3370AM2GBA1-GAH-E2-QS-AXRenesasIC MCU 32BIT 128KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 110°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
238
UPD70F3370AM2GBA1-GAH-E3-QS-AXN/AUPD70F3370AM2GBA1-GAH-E3-QS-AXRenesasIC MCU 32BIT 128MB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 110°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,416
UPD70F3370AM2GBA2-GAH-AXN/AUPD70F3370AM2GBA2-GAH-AXRenesasIC MCU 32BIT 128MB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
24MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
324
UPD70F3370M2GBA-GAH-AXUPD70F3370M2GBA-GAH-AXRenesasIC MCU 32BIT 128MB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
826
UPD70F3371M2GBA-GAH-AXUPD70F3371M2GBA-GAH-AXRenesas32BIT MCU V850ES/FE3 128KBMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
508
UPD70F3371M2GBA-GAH-E2-AXN/AUPD70F3371M2GBA-GAH-E2-AXRenesasIC MCU 32BIT 256KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
513
UPD70F3371M2GBA-GAH-E3-QS-AXUPD70F3371M2GBA-GAH-E3-QS-AXRenesas32BIT MCU V850ES/FE3Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
715
UPD70F3371M2GBA-GAH-QS-AXN/AUPD70F3371M2GBA-GAH-QS-AXRenesasIC MCU 32BIT 256KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
106
UPD70F3371M2GBA1-GAH-AXUPD70F3371M2GBA1-GAH-AXRenesas32BIT MCU V850ES/FE3Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 110°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
544
UPD70F3371M2GBA1-GAH-E2-AXUPD70F3371M2GBA1-GAH-E2-AXRenesas32BIT MCU V850ES/FE3Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 110°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
353

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