| N/A | | TSC87251G2D-24IC | Microchip Technology | IC MCU 8/16BIT 32KB OTP 44CQPJ | Microcontrollers | 44-CQPJ | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, I2C, Microwire, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 32KB (32K x 8) Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-CQPJ | 1,267 | |
| N/A | | TSC87251G2D-24IJ | Microchip Technology | IC MCU 8/16BIT 32KB OTP 44CDIL | Microcontrollers | 44-CDIL | N/A | -40°C ~ 85°C (TA) | Connectivity: EBI/EMI, I2C, Microwire, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 32KB (32K x 8) Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 44-CDIL | 1,242 | |
 | | TSC87251G2D-L16CB | Microchip Technology | IC MCU 8/16BIT 32KB OTP 44PLCC | Microcontrollers | 44-PLCC (16.6x16.6) | N/A | 0°C ~ 70°C (TA) | Connectivity: EBI/EMI, I2C, Microwire, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 32KB (32K x 8) Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-PLCC (16.6×16.6) Package / Case: 44-LCC (J-Lead) | 547 | |
| N/A | | TSPC106AVGU66CG | Microchip Technology | IC PCI MEM CTRLR 66MHZ 303CBGA | Controllers | 303-CBGA (25x21) | 3.135V ~ 3.465V | -55°C ~ 125°C | Voltage – Supply: 3.135V ~ 3.465V Operating Temperature: -55°C ~ 125°C Supplier Device Package: 303-CBGA (25×21) | 754 | |
 | | TSPC603RVA8LC | Microchip Technology | IC MPU 200MHZ 240CERQUAD | Microprocessors | 240-CERQUAD (31x31) | N/A | -40°C ~ 110°C (TC) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Package / Case: 240-BFCQFP Supplier Device Package: 240-CERQUAD (31×31) | 793 | |
| N/A | | TSPC603RVGH10LC | Microchip Technology | IC MPU 603E 233MHZ 255CBGA | Microprocessors | 255-HiTCE-CBGA (21x21) | N/A | -40°C ~ 110°C (TC) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Package / Case: 255-BCBGA Exposed Pad Supplier Device Package: 255-HiTCE-CBGA (21×21) | 1,291 | |
| N/A | | TSPC603RVGH12LC | Microchip Technology | IC MPU 603E 266MHZ 255CBGA | Microprocessors | 255-HiTCE-CBGA (21x21) | N/A | -40°C ~ 110°C (TC) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Package / Case: 255-BCBGA Exposed Pad Supplier Device Package: 255-HiTCE-CBGA (21×21) | 10 | |
| N/A | | TSPC603RVGH8LC | Microchip Technology | IC MPU 603E 200MHZ 255CBGA | Microprocessors | 255-HiTCE-CBGA (21x21) | N/A | -40°C ~ 110°C (TC) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Package / Case: 255-BCBGA Exposed Pad Supplier Device Package: 255-HiTCE-CBGA (21×21) | 1,151 | |
| N/A | | TSPC603RVGS10LC | Microchip Technology | IC MPU 603E 233MHZ 255CICBGA | Microprocessors | 255-CI-CBGA (21x21) | N/A | -40°C ~ 110°C (TC) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Package / Case: 255-BCBGA Exposed Pad Supplier Device Package: 255-CI-CBGA (21×21) | 57 | |
| N/A | | TSPC603RVGS12LC | Microchip Technology | IC MPU 603E 266MHZ 255CICBGA | Microprocessors | 255-CI-CGA (21x21) | N/A | -40°C ~ 110°C (TC) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Supplier Device Package: 255-CI-CGA (21×21) | 505 | |
| N/A | | TSPC603RVGS6LC | Microchip Technology | IC MPU 603E 166MHZ 255CICBGA | Microprocessors | 255-CI-CBGA (21x21) | N/A | -40°C ~ 110°C (TC) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Package / Case: 255-BCBGA Exposed Pad Supplier Device Package: 255-CI-CBGA (21×21) | 1,703 | |
| N/A | | TSPC603RVGS8LC | Microchip Technology | IC MPU 603E 200MHZ 255CICBGA | Microprocessors | 255-CI-CBGA (21x21) | N/A | -40°C ~ 110°C (TC) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Package / Case: 255-BCBGA Exposed Pad Supplier Device Package: 255-CI-CBGA (21×21) | 190 | |
| N/A | | TSPC603RVGU10LC | Microchip Technology | IC MPU 233MHZ 255CBGA | Microprocessors | 255-CBGA (21x21) | N/A | -40°C ~ 110°C (TC) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Package / Case: 255-BCBGA Exposed Pad Supplier Device Package: 255-CBGA (21×21) | 132 | |
| N/A | | TSPC603RVGU12LC | Microchip Technology | IC MPU 266MHZ 255CBGA | Microprocessors | 255-CBGA (21x21) | N/A | -40°C ~ 110°C (TC) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Package / Case: 255-BCBGA Exposed Pad Supplier Device Package: 255-CBGA (21×21) | 1,234 | |
| N/A | | TSPC603RVGU8LC | Microchip Technology | IC MPU 200MHZ 255CBGA | Microprocessors | 255-CBGA (21x21) | N/A | -40°C ~ 110°C (TC) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Surface Mount Package / Case: 255-BCBGA Exposed Pad Supplier Device Package: 255-CBGA (21×21) | 608 | |
 | | TSS521D | Texas Instruments | IC TRANSCEIVER HALF 1/1 16SOIC | Drivers, Receivers, Transceivers | 16-SOIC | 3.3V | -25°C ~ 85°C | Number of Drivers/Receivers: 1/1 Operating Temperature: -25°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154″”, 3.90mm Width) Supplier Device Package: 16-SOIC | 1,844 | |
 | | TSS521DR | Texas Instruments | IC TRANSCEIVER HALF 1/1 16SOIC | Drivers, Receivers, Transceivers | 16-SOIC | 3.3V | -25°C ~ 85°C | Number of Drivers/Receivers: 1/1 Operating Temperature: -25°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154″”, 3.90mm Width) Supplier Device Package: 16-SOIC | 1,560 | |
 | | TSS721AD | Texas Instruments | IC TRANSCEIVER HALF 1/1 16SOIC | Drivers, Receivers, Transceivers | 16-SOIC | 3.3V | 0°C ~ 70°C | Number of Drivers/Receivers: 1/1 Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154″”, 3.90mm Width) Supplier Device Package: 16-SOIC | 1,311 | |
 | | TSS721ADR | Texas Instruments | IC TRANSCEIVER HALF 1/1 16SOIC | Drivers, Receivers, Transceivers | 16-SOIC | 3.3V | 0°C ~ 70°C | Number of Drivers/Receivers: 1/1 Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154″”, 3.90mm Width) Supplier Device Package: 16-SOIC | 816 | |
| N/A | N/A | TST200A-32LQXI | Infineon Technologies | IC MCU TRUETOUCH | Microcontrollers | - | N/A | – | N/A | 1,289 | |