| N/A | | W9864G6KT-6 | Winbond Electronics | IC DRAM 64MBIT LVTTL 54TFBGA | DRAM Memory | 54-TFBGA (8x8) | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Memory Organization: 4M x 16 Write Cycle Time Word Page: N/A | 675 | |
 | | W9864G6KT-6 TR | Winbond Electronics | IC DRAM 64MBIT LVTTL 54TFBGA | DRAM Memory | 54-TFBGA (8x8) | 3V ~ 3.6V | 0°C ~ 70°C (TC) | Memory Organization: 4M x 16 Write Cycle Time Word Page: N/A | 785 | |
 | | W9864G6KT-6I | Winbond Electronics | IC DRAM 64MBIT LVTTL 54TFBGA | DRAM Memory | 54-TFBGA (8x8) | 3V ~ 3.6V | -40°C ~ 85°C (TC) | Memory Organization: 8M x 8 Write Cycle Time Word Page: N/A | 303 | |
 | | W9864G6KT-6I TR | Winbond Electronics | IC DRAM 64MBIT LVTTL 54TFBGA | DRAM Memory | 54-TFBGA (8x8) | 3V ~ 3.6V | -40°C ~ 85°C (TC) | Memory Organization: 8M x 8 Write Cycle Time Word Page: N/A | 1,247 | |
 | | WG82552V | Intel | INTEL 82552V FAST ETHERNET PHY | Controllers | 32-QFN (5x5) | 3V ~ 3.6V | 0°C ~ 85°C | Standards: IEEE 802.3, 10/100 Base-T/TX PHY Voltage – Supply: 3V ~ 3.6V Operating Temperature: 0°C ~ 85°C Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN (5×5) | 432 | |
| N/A | N/A | WP3392D4NFEI-320B2 | Microchip Technology | WinPath3 Network Processor, MIPS 34Kc, 896-FCBGA | Microprocessors | 896-FCBGA | N/A | N/A | Speed: 650 MHz (MIPS 34Kc) Core Processor: MIPS32 34Kc Number of Cores/Bus Width: 2 control cores + up to 12 data-path processors RAM Controllers: 3x DDR2/DDR3 (16/32-bit) Ethernet: Up to 16x GbE / 2x 10GbE (XAUI) Co-Processors/DSP: 12 RISC data-path processors | 1,138 | |
| N/A | | WP413808 | Intel | INTEL IOC340 I/O CONTROLLER | Controllers | 1357-FCBGA (37.5x37.5) | 1.164V ~ 1.236V, 1.71V ~ 1.89V, 3V ~ 3.6V | 0°C ~ 100°C (TC) | Voltage – Supply: 1.164V ~ 1.236V, 1.71V ~ 1.89V, 3V ~ 3.6V Operating Temperature: 0°C ~ 100°C (TC) Package / Case: 1357-BGA, FCBGA Supplier Device Package: 1357-FCBGA (37.5×37.5) | 1,594 | |
| N/A | | WP413812 | Intel | INTEL 413812 I/O CONTROLLER | Controllers | 1357-FCBGA (37.5x37.5) | 1.164V ~ 1.236V, 1.71V ~ 1.89V, 3V ~ 3.6V | 0°C ~ 100°C (TC) | Voltage – Supply: 1.164V ~ 1.236V, 1.71V ~ 1.89V, 3V ~ 3.6V Operating Temperature: 0°C ~ 100°C (TC) Package / Case: 1357-BGA, FCBGA Supplier Device Package: 1357-FCBGA (37.5×37.5) | 1,084 | |
| N/A | | WP81341M0820 | Intel | IC MPU INTEL 1.2GHZ 1357BGA | Microprocessors | 1357-FCBGA (37.5x37.5) | N/A | 0°C ~ 100°C (TC) | Core Processor: Intel® IOP341 I/O Processor Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 100°C (TC) Mounting Type: Surface Mount Package / Case: 1357-BBGA, FCBGA Supplier Device Package: 1357-FCBGA (37.5×37.5) | 173 | |
| N/A | | WP81348M0618 | Intel | IC MPU IOP348 667MHZ 1357FCBGA | Microprocessors | 1357-FCBGA (37.5x37.5) | N/A | 100°C (TC) | Core Processor: Intel® IOP348 I/O Processor Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 100°C (TC) Mounting Type: Surface Mount Package / Case: 1357-BGA, FCBGA Supplier Device Package: 1357-FCBGA (37.5×37.5) | 528 | |
| N/A | | WP81348M0818 | Intel | IC MPU IOP348 1.2GHZ 1357FCBGA | Microprocessors | 1357-FCBGA (37.5x37.5) | N/A | 100°C (TC) | Core Processor: Intel® IOP348 I/O Processor Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 100°C (TC) Mounting Type: Surface Mount Package / Case: 1357-BGA, FCBGA Supplier Device Package: 1357-FCBGA (37.5×37.5) | 668 | |
| N/A | | WP81348M0828 | Intel | IC MPU IOP348 667MHZ 1357FCBGA | Microprocessors | 1357-FCBGA (37.5x37.5) | N/A | 100°C (TC) | Core Processor: Intel® IOP348 I/O Processor Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 100°C (TC) Mounting Type: Surface Mount Package / Case: 1357-BGA, FCBGA Supplier Device Package: 1357-FCBGA (37.5×37.5) | 127 | |
| N/A | | WPIXP2350ACT | Intel | WESTPORT NETWORK PROCESSOR | Microprocessors | 1752-FCBGA (42.5x42.5) | N/A | 0 °C – 105 °C | Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, SDRAM Co-Processors/DSP: Microengine SATA: Gigabit Ethernet (2) | 160 | |
| N/A | | WPIXP2350ADT | Intel | IXP -WESTPORT NETWORK PROCESSOR | Microprocessors | 1752-FCBGA (42.5x42.5) | N/A | 0 °C – 105 °C | Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, SDRAM Co-Processors/DSP: Microengine SATA: Gigabit Ethernet (2) | 331 | |
 | | X4MF03107SPZQQ1 | Texas Instruments | IC MCU 16/32B 320KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M3 Connectivity: CANbus, LINbus, MibSPI, SCI, UART/USART Program Memory Size: 320KB (320K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.7V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 541 | |
 | | X4MF04207SPZQQ1 | Texas Instruments | IC MCU 16/32B 448KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M3 Connectivity: CANbus, LINbus, MibSPI, SCI, UART/USART Program Memory Size: 448KB (448K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.7V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,502 | |
 | N/A | X5LS20216ASZWTQQ1 | Texas Instruments | IC MCU 16/32B 2MB FLASH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 1,571 | |
 | N/A | X5LS20216SPGEQQ1 | Texas Instruments | IC MCU 16/32BIT 2MB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 20x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,191 | |
 | N/A | XA2S100E-6FT256Q | Advanced Micro Devices | IC FPGA 182 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.71 V - 1.89 V | -40°C – 125°C | Number of Logic Elements/Cells: 2700 | 709 | |
 | N/A | XA2S100E-6TQ144I | Advanced Micro Devices | IC FPGA 102 I/O 144TQFP | FPGAs | 144-TQFP (20x20) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 2700 | 1,152 | |