WPIXP2350ACT

The WPIXP2350ACT is a microprocessor IC designed for embedded network processing. It integrates an Xscale core running at 1.2 GHz with a dedicated microengine DSP co-processor to address real-time packet and data processing tasks.

Configured for embedded and industrial applications, the device provides on-chip support for DDR and SDRAM memory controllers, two Gigabit Ethernet interfaces, hardware 3DES security, and GPIO connectivity, packaged in a 1752-FCBGA surface-mount form factor.

Key Features

• Core and Processing Xscale core at 1.2 GHz with a single 32-bit processing core and an integrated microengine DSP co-processor to offload specialized signal and packet processing tasks.
• Memory On-chip controllers for DDR and SDRAM to support external memory configurations for buffering and runtime code/data storage.
• Networking Interfaces Two Gigabit Ethernet interfaces provide high-speed wired network connectivity for embedded networking applications.
• Security Built-in 3DES hardware support for cryptographic operations.
• System I/O General-purpose I/O (GPIO) for control and peripheral interfacing.
• Package and Mounting 1752-FCBGA supplier device package (42.5 × 42.5) in a surface-mount configuration for dense board-level integration.
• Industrial Grade and Temperature Range Rated for industrial use with an operating temperature range of 0 °C to 105 °C.
• Environmental Compliance RoHS compliant for regulatory and manufacturing considerations.
• Graphics No graphics acceleration—focus on network and DSP processing functions.

Typical Applications

• Embedded Networking Appliances — Acts as the primary processor in routers, switches, or gateway appliances that require integrated Gigabit Ethernet connectivity and packet processing.
• Industrial Communication Nodes — Suited for industrial embedded systems that need an industrial-grade temperature range and robust I/O for field interfacing.
• Security Appliances — Hardware 3DES support enables encrypted communications and secure data handling in networked devices.

Unique Advantages

• Integrated Processing and DSP: Single 32-bit Xscale core paired with a microengine DSP co-processor reduces the need for external acceleration components.
• Built-in High-Speed Networking: Two Gigabit Ethernet interfaces provide ready-made connectivity for network-focused designs, simplifying board-level integration.
• Flexible Memory Support: DDR and SDRAM controllers offer designers options for external memory configurations to match performance and cost targets.
• Industrial Temperature Rating: 0 °C to 105 °C operating range supports deployment in industrial environments.
• Hardware Security: On-chip 3DES capability enables cryptographic functions without additional security ICs.
• Compact Surface-Mount BGA Package: 1752-FCBGA (42.5 × 42.5) supports high-density PCB layouts for space-constrained systems.

Why Choose WPIXP2350ACT?

The WPIXP2350ACT combines a 1.2 GHz Xscale core with a microengine DSP co-processor, integrated memory controllers, and dual Gigabit Ethernet interfaces to deliver a compact, network-focused processing platform. Its industrial grade specification and on-chip 3DES security make it suitable for embedded systems that require durable operation and secure data handling.

This device is well suited for designers building network appliances, industrial communication nodes, or security-focused embedded equipment who need a single-chip solution that balances processing, I/O, and security in a surface-mount BGA package.

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