XA2S100E-6FT256Q

The XA2S100E-6FT256Q is a Spartan®-IIE XA Field Programmable Gate Array (FPGA) IC from AMD supplied in a 256-ball LBGA package. It integrates approximately 2,700 logic elements, roughly 40,960 bits of on-chip RAM, and 182 I/O pins to support embedded control and I/O‑dense designs.

With a supply voltage range of 1.71 V to 1.89 V, surface-mount packaging, and AEC‑Q100 qualification for automotive applications, this device targets embedded systems and environments that require compact, qualified programmable logic with a wide operating temperature range.

Key Features

• Core Logic  Approximately 2,700 logic elements (≈100,000 gates) for implementing custom logic, state machines, and glue logic in a single FPGA.
• Embedded Memory  Approximately 40,960 bits (≈0.041 Mbits) of on‑chip RAM for small data buffering, state storage, and local lookup tables.
• I/O Capacity  182 general-purpose I/O pins to connect sensors, actuators, peripherals, and external interfaces directly to the FPGA fabric.
• Power  Specified single-core supply range from 1.71 V to 1.89 V to match system power rails and enable predictable power integration.
• Package & Mounting  256-ball L‑BGA (supplier package: 256‑FTBGA, 17×17) in a surface-mount form factor for compact board layouts.
• Automotive Qualification & Temperature Range  AEC‑Q100 qualification and an operating temperature range of −40 °C to 125 °C suitable for automotive-grade system requirements.
• Regulatory  RoHS compliant, supporting lead‑free manufacturing and environmental requirements.

Typical Applications

• Automotive Control Modules  AEC‑Q100 qualification and −40 °C to 125 °C operation make this FPGA suitable for in-vehicle control, signal handling, and interfacing tasks.
• Embedded System Control  Use the logic elements and on‑chip memory for custom control logic, protocol bridging, and real‑time decision functions in compact designs.
• Sensor and Actuator Interfaces  High I/O count supports direct connection to multiple sensors and actuators for data aggregation and preprocessing close to the source.
• Prototyping and Integration  Compact LBGA packaging and programmable logic density allow designers to consolidate discrete components and test custom functions early in development.

Unique Advantages

• Consolidated Logic in a Single Device:  Approximately 2,700 logic elements and ~100,000 gates enable integration of multiple functions without adding discrete logic ICs.
• I/O-Rich Connectivity:  182 I/O pins provide flexibility for interfacing to many peripherals and mixed-signal front ends directly.
• Automotive-Ready Qualification:  AEC‑Q100 qualification and a wide operating temperature range support deployment in automotive and similarly demanding environments.
• Compact Surface-Mount Package:  256-LBGA (256‑FTBGA, 17×17) balances pin density and PCB area for space-constrained designs.
• Predictable Power Requirements:  Narrow supply range (1.71 V–1.89 V) simplifies power‑rail design and integration into regulated systems.
• RoHS Compliance:  Lead‑free compliance aligns with modern manufacturing and environmental policies.

Why Choose XA2S100E-6FT256Q?

The XA2S100E-6FT256Q offers a practical balance of logic density, on‑chip memory, and high I/O count within a compact 256‑ball LBGA package, backed by AEC‑Q100 qualification for automotive use. Its supply and temperature specifications make it suitable for designers who need a qualified, programmable logic device for embedded control, interface consolidation, and I/O-intensive applications.

This FPGA is well suited for engineering teams building space-conscious, qualification‑driven systems that require programmable flexibility, direct peripheral connectivity, and a small-footprint solution that integrates into surface-mount manufacturing flows.

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