U1AFS600-FG256I

The U1AFS600-FG256I is a Fusion® Field Programmable Gate Array (FPGA) offered in a 256-LBGA package. It combines a mid-range logic fabric with on-chip RAM and a sizable number of I/O to support embedded control, signal interfacing and general-purpose programmable logic tasks for industrial applications.

This device targets designers who need a programmable, surface-mount FPGA with defined logic capacity, embedded memory, and industrial operating range, delivering integration and flexibility in a compact 256-pin BGA footprint.

Key Features

• Core Logic — Contains 6,144 logic elements and is specified with approximately 250,000 equivalent gates to implement custom digital logic and control functions.
• Embedded Memory — Approximately 36 kbits of on-chip RAM (36,864 bits) for data buffering, FIFOs or small lookup tables.
• I/O Density — 114 user I/O pins to support signal interfacing, peripheral control, and protocol bridging requirements.
• Power Supply — Operates from a core voltage range of 1.425 V to 1.575 V to match target board power domains.
• Package & Mounting — Supplied in a 256-LBGA package (supplier device package: 256-FPBGA, 17×17 mm) optimized for surface-mount PCB assembly.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Compliance — RoHS compliant for global electronics manufacturing requirements.

Typical Applications

• Industrial Automation — Implement custom control logic, sequencing, and I/O aggregation for factory and process automation equipment.
• Sensor Interfacing — Use the device’s 114 I/O pins and embedded memory for sensor data capture, preprocessing, and routing to host systems.
• Communication & Protocol Bridging — Deploy the FPGA for protocol conversion and deterministic interface handling where fixed-function controllers are insufficient.
• Test and Measurement — Integrate programmable logic and memory for signal conditioning, timing, and data buffering in benchtop or inline measurement systems.

Unique Advantages

• Balanced Logic Capacity: 6,144 logic elements and ~250,000 gates provide sufficient density for mid-range custom logic without excessive board-level complexity.
• On-chip Memory for Data Handling: Approximately 36 kbits of embedded RAM enables local buffering and low-latency data operations without external SRAM.
• High I/O Count: 114 I/O pins let you consolidate multiple signals and interfaces onto a single programmable device, reducing component count.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in industrial environments with wider temperature variability.
• Compact BGA Package: 256-LBGA (256-FPBGA, 17×17 mm) provides a dense, surface-mount footprint suitable for modern PCB layouts.
• Regulatory Compliance: RoHS compliance helps meet environmental and manufacturing requirements.

Why Choose U1AFS600-FG256I?

The U1AFS600-FG256I positions itself as a practical, industrial-rated Fusion® FPGA option for designs requiring mid-range logic, embedded memory, and a substantial I/O complement in a compact BGA package. Its combination of 6,144 logic elements, approximately 36 kbits of RAM, and 114 I/Os makes it well suited to embedded control, interface consolidation, and signal processing tasks where integration and reliability are important.

For engineers and procurement teams pursuing scalable, programmable solutions, this device offers a clear balance of logic resources, on-chip memory, and industrial operating range, backed by RoHS compliance and a standardized 256-pin BGA form factor.

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