U1AFS600-FGG256

The U1AFS600-FGG256 is a Fusion® Field Programmable Gate Array (FPGA) targeted for commercial-grade embedded designs. It delivers a balance of programmable logic, embedded memory, and I/O capacity in a compact 256-LBGA package.

With 6,144 logic elements, approximately 36,864 bits of on-chip RAM, 114 I/O pins and an operating supply range of 1.425 V to 1.575 V, this device is suitable for implementations that require moderate logic density, dedicated embedded memory, and a dense ball-grid package for surface-mount assembly.

Key Features

• Programmable Logic Capacity — 6,144 logic elements and approximately 250,000 gates provide the resources needed for medium-complexity programmable logic designs.
• On-Chip Memory — Approximately 36,864 bits of embedded RAM for buffering, small data structures, or control-state storage without external memory.
• I/O Resources — 114 general-purpose I/O pins to support multiple interfaces, sensor connections, or peripheral control in a single device.
• Package and Mounting — 256-LBGA (supplier package: 256-FPBGA, 17×17) surface-mount package for high-density board designs and compact system layouts.
• Power — Nominal core voltage range of 1.425 V to 1.575 V to match system power-rail design constraints.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for commercial applications.
• RoHS Compliant — Meets RoHS environmental requirements for reduced hazardous substances.

Typical Applications

• Embedded Control Systems — Implement custom control logic and finite-state machines using the device's 6,144 logic elements and on-chip RAM for local state and buffering.
• Interface Bridging — Leverage 114 I/O pins to connect multiple peripherals or translate between different digital interfaces in commercial equipment.
• Prototyping and Development — Use the reprogrammable FPGA logic and compact 256-LBGA package for iterative hardware validation and proof-of-concept implementations.

Unique Advantages

• Balanced Logic and Memory: 6,144 logic elements combined with approximately 36,864 bits of RAM let you implement control, glue logic and modest data buffering without external memory.
• High I/O Count in a Compact Package: 114 I/O pins in a 256-LBGA (17×17) footprint simplify dense board layouts while keeping external connectivity flexible.
• Commercial Temperature and RoHS Compliance: Designed for commercial environments (0 °C to 85 °C) and RoHS-compliant, supporting standard regulatory and deployment requirements.
• Surface-Mount Package for Modern PCBs: The 256-LBGA surface-mount package supports automated assembly and compact system designs.
• Tightly Specified Power Envelope: A defined core voltage range (1.425 V–1.575 V) helps streamline power supply design and integration.

Why Choose U1AFS600-FGG256?

The U1AFS600-FGG256 positions itself as a practical, commercial-grade FPGA choice for designs that require a moderate level of programmable logic, embedded memory and a high I/O count in a compact 256-LBGA package. Its combination of 6,144 logic elements, approximately 36,864 bits of on-chip RAM and 114 I/Os makes it suitable for a wide range of commercial embedded applications where board space and integration matter.

Choose this device if you need a RoHS-compliant, surface-mount FPGA solution with clearly defined electrical and thermal operating limits (1.425 V–1.575 V, 0 °C–85 °C) and a package footprint that supports dense, modern PCB designs.

Request a quote or submit an inquiry to obtain pricing and availability for the U1AFS600-FGG256. Our team can provide lead-time information and assist with volume or design-specific questions.