U1AFS250-FGG256I

The U1AFS250-FGG256I is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology, delivering programmable logic, embedded memory and a substantial I/O complement in a compact BGA package. With 6,144 logic elements and 36,864 bits of on-chip RAM, it is designed for designs that require moderate logic density, on-chip memory and flexible I/O integration.

This industrial-grade, surface-mount device supports supply voltages from 1.425 V to 1.575 V and an operating temperature range of −40 °C to 100 °C, providing a stable platform for applications that must operate across extended temperature ranges.

Key Features

• Core Logic — 6,144 logic elements (cells) provide approximately 250,000 gates of programmable logic capacity for custom digital functions.
• Embedded Memory — 36,864 bits of on-chip RAM, suitable for small buffers, FIFOs and control state storage; approximately 0.037 Mbits of embedded memory.
• I/O Density — 114 general-purpose I/O pins to support multiple peripheral interfaces and board-level connectivity.
• Package and Mounting — 256-LBGA package (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for compact PCB implementation.
• Power — Specified core supply voltage range of 1.425 V to 1.575 V for consistent power planning and margining.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet industrial temperature requirements.
• Environmental Compliance — RoHS compliant, supporting lead-free manufacturing and regulatory needs.

Typical Applications

• Industrial Control — Programmable logic and extended temperature range make the device suitable for control systems, motor drives and factory automation modules.
• Embedded Interface Bridging — High I/O count supports protocol conversion and custom interface bridging between multiple subsystems.
• Signal Processing and Control — On-chip RAM and logic resources enable compact implementations of control loops, buffering and light-weight signal processing tasks.

Unique Advantages

• Balanced Logic and Memory — 6,144 logic elements paired with 36,864 bits of embedded RAM enables efficient mapping of control logic and modest data buffering without external memory.
• Generous I/O for Integration — 114 I/O pins allow direct interfacing to sensors, actuators and peripheral devices, reducing the need for additional interface ICs.
• Compact, Industry-Ready Package — 256-LBGA (256-FPBGA, 17×17) provides a space-efficient footprint for compact system designs.
• Industrial Temperature Operation — −40 °C to 100 °C rating supports deployments in demanding environments where thermal range is critical.
• Predictable Power Envelope — Narrow supply range (1.425 V to 1.575 V) simplifies power-supply design and margining for stable operation.
• Regulatory-Friendly — RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose U1AFS250-FGG256I?

The U1AFS250-FGG256I combines a moderate logic footprint, embedded RAM and a high I/O count in a compact 256-LBGA package from Microchip Technology. Its industrial temperature rating and surface-mount form factor make it well suited for embedded systems and industrial applications that require reliable programmable logic and direct I/O integration.

This device is appropriate for designers targeting scalable, cost-aware implementations that need on-chip memory and flexible interfacing, while retaining RoHS compliance and clear supply and temperature specifications for reliable system deployment.

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