U1AFS1500-FGG256I

IC FPGA 119 I/O 256FBGA
Part Description

Fusion® Field Programmable Gate Array (FPGA) IC 119 276480 256-LBGA

Quantity 515 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O119Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs38400Number of Logic Elements/Cells38400
Number of Gates1500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits276480

Overview of U1AFS1500-FGG256I – Fusion FPGA, 119 I/O, 256-LBGA

The U1AFS1500-FGG256I is a Fusion® Field Programmable Gate Array (FPGA) in a 256-LBGA surface-mount package. It integrates 38,400 logic elements, approximately 0.276 Mbits of embedded memory, and 1,500,000 gates in an industrial-grade device qualified for operation from -40°C to 100°C.

With 119 available I/O and a supply voltage range of 1.425 V to 1.575 V, this device targets designs that require moderate logic density, on-chip memory, and robust temperature performance in a compact BGA footprint.

Key Features

  • Logic Capacity  38,400 logic elements (logic element cells) provide the programmable fabric for implementing custom digital functions and control logic.
  • Embedded Memory  Approximately 0.276 Mbits of on-chip RAM for buffering, small lookup tables, and state storage to support custom designs.
  • Gate Count  1,500,000 gates offering a measure of overall silicon complexity for combined logic and routing.
  • I/O  119 I/O pins available for interfacing to peripherals, sensors, and other system components.
  • Power  Nominal core supply voltage range of 1.425 V to 1.575 V to match system power rail constraints.
  • Package & Mounting  256-LBGA (supplier device package: 256-FPBGA 17×17) in a surface-mount format for compact PCB integration.
  • Industrial Temperature Range  Rated for operation from -40°C to 100°C for use in environments requiring extended temperature tolerance.
  • RoHS Compliant  Meets RoHS requirements for lead-free assembly and regulatory compliance considerations.

Unique Advantages

  • Balanced logic and memory  Combines 38,400 logic elements with on-chip RAM to implement control, glue logic, and moderate buffering without external memory.
  • Compact BGA footprint  256-LBGA (17×17) package reduces PCB area while maintaining a high pin count for flexible system integration.
  • Industrial robustness  Rated for -40°C to 100°C operation to support deployments in temperature-challenging environments.
  • Deterministic power requirements  A defined core voltage window (1.425 V–1.575 V) simplifies power-supply design and validation.
  • Regulatory readiness  RoHS compliance supports lead-free manufacturing and global market requirements.

Why Choose U1AFS1500-FGG256I?

The U1AFS1500-FGG256I positions itself as a mid-density Fusion FPGA that brings together a significant logic element count, embedded memory, and a high I/O count in a compact 256-LBGA package. Its industrial temperature rating and defined supply voltage make it suitable for designs that need stable operation across a wide thermal range and consistent power behavior.

This device is well suited for engineers seeking a reliable, compact FPGA platform that balances programmable logic capacity with on-chip memory and I/O flexibility, while maintaining RoHS compliance for streamlined manufacturing.

Request a quote or submit a sales inquiry to receive pricing and availability information for U1AFS1500-FGG256I.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up