U1AFS1500-FGG256I
| Part Description |
Fusion® Field Programmable Gate Array (FPGA) IC 119 276480 256-LBGA |
|---|---|
| Quantity | 515 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 119 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 38400 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of U1AFS1500-FGG256I – Fusion FPGA, 119 I/O, 256-LBGA
The U1AFS1500-FGG256I is a Fusion® Field Programmable Gate Array (FPGA) in a 256-LBGA surface-mount package. It integrates 38,400 logic elements, approximately 0.276 Mbits of embedded memory, and 1,500,000 gates in an industrial-grade device qualified for operation from -40°C to 100°C.
With 119 available I/O and a supply voltage range of 1.425 V to 1.575 V, this device targets designs that require moderate logic density, on-chip memory, and robust temperature performance in a compact BGA footprint.
Key Features
- Logic Capacity 38,400 logic elements (logic element cells) provide the programmable fabric for implementing custom digital functions and control logic.
- Embedded Memory Approximately 0.276 Mbits of on-chip RAM for buffering, small lookup tables, and state storage to support custom designs.
- Gate Count 1,500,000 gates offering a measure of overall silicon complexity for combined logic and routing.
- I/O 119 I/O pins available for interfacing to peripherals, sensors, and other system components.
- Power Nominal core supply voltage range of 1.425 V to 1.575 V to match system power rail constraints.
- Package & Mounting 256-LBGA (supplier device package: 256-FPBGA 17×17) in a surface-mount format for compact PCB integration.
- Industrial Temperature Range Rated for operation from -40°C to 100°C for use in environments requiring extended temperature tolerance.
- RoHS Compliant Meets RoHS requirements for lead-free assembly and regulatory compliance considerations.
Unique Advantages
- Balanced logic and memory Combines 38,400 logic elements with on-chip RAM to implement control, glue logic, and moderate buffering without external memory.
- Compact BGA footprint 256-LBGA (17×17) package reduces PCB area while maintaining a high pin count for flexible system integration.
- Industrial robustness Rated for -40°C to 100°C operation to support deployments in temperature-challenging environments.
- Deterministic power requirements A defined core voltage window (1.425 V–1.575 V) simplifies power-supply design and validation.
- Regulatory readiness RoHS compliance supports lead-free manufacturing and global market requirements.
Why Choose U1AFS1500-FGG256I?
The U1AFS1500-FGG256I positions itself as a mid-density Fusion FPGA that brings together a significant logic element count, embedded memory, and a high I/O count in a compact 256-LBGA package. Its industrial temperature rating and defined supply voltage make it suitable for designs that need stable operation across a wide thermal range and consistent power behavior.
This device is well suited for engineers seeking a reliable, compact FPGA platform that balances programmable logic capacity with on-chip memory and I/O flexibility, while maintaining RoHS compliance for streamlined manufacturing.
Request a quote or submit a sales inquiry to receive pricing and availability information for U1AFS1500-FGG256I.

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