U1AFS1500-FGG256

The U1AFS1500-FGG256 is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for commercial applications. It integrates 38,400 logic elements (approximately 1,500,000 gates) and roughly 0.276 Mbits of on-chip RAM to deliver programmable logic capacity in a compact 256-LBGA package.

With a supply voltage range of 1.425 V to 1.575 V, 119 I/Os, and surface-mount packaging, this device is suited for designers needing moderate logic density and flexible I/O in a commercial-temperature FPGA solution.

Key Features

• Core Logic 38,400 logic elements providing approximately 1,500,000 gates of programmable logic capacity for implementing custom digital functions.
• Embedded Memory Approximately 0.276 Mbits of on-chip RAM to support data buffering, state machines, and small lookup tables directly in the FPGA fabric.
• I/O Count 119 user I/O pins to connect sensors, peripherals, and external interfaces while enabling flexible board-level integration.
• Power Operates from a 1.425 V to 1.575 V supply range to match system power rails and support stable device operation.
• Package and Mounting 256-LBGA (supplier device package: 256-FPBGA, 17 × 17) in a surface-mount form factor for compact PCB designs.
• Temperature and Grade Commercial grade device specified for 0 °C to 85 °C operation, suitable for standard commercial environments.
• Regulatory Compliance RoHS compliant for adherence to common environmental standards.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic and state machines using 38,400 logic elements and on-chip RAM for compact system integration.
• Interface and I/O Expansion — Use 119 I/Os to bridge peripheral interfaces or expand board-level connectivity in space-constrained designs.
• Prototyping and Development — Employ the programmable fabric and moderate memory footprint to prototype custom digital functions prior to production.
• Moderate Throughput Signal Processing — Leverage embedded RAM and dense logic resources for signal conditioning, finite-state processing, and buffering tasks.

Unique Advantages

• High Logic Density: 38,400 logic elements and approximately 1,500,000 gates provide substantial programmable resources for complex logic implementations.
• On-Die Memory: Approximately 0.276 Mbits of embedded RAM reduces reliance on external memory for small buffers and lookup tables.
• Ample I/O: 119 I/O pins support diverse peripheral connections and flexible interfacing options on a single device.
• Compact, Surface-Mount Package: 256-LBGA (256-FPBGA, 17 × 17) minimizes PCB footprint while supporting automated assembly.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation to meet typical commercial deployment requirements.
• RoHS Compliance: Environmentally compliant for easier supply-chain integration.

Why Choose U1AFS1500-FGG256?

The U1AFS1500-FGG256 delivers a balanced combination of logic density, on-chip memory, and I/O capacity in a compact 256-LBGA package, making it a practical choice for commercial embedded designs that require programmable logic and moderate memory resources. Its defined supply voltage range and commercial temperature rating simplify system-level power and thermal planning.

Designed for engineers and procurement teams seeking a reliable FPGA solution from Microchip Technology, this device fits projects that demand flexible logic implementation in a surface-mount form factor while meeting RoHS requirements.

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