RT4G150L-LGG1657R

RT4G150L-LGG1657R
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BCLGA

Quantity 1,329 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Device Package1657-CLGA (42.5x42.5)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case1657-BCLGANumber of I/O720Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150L-LGG1657R – RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BCLGA

The RT4G150L-LGG1657R is a flash-based RTG4 FPGA from Microchip Technology designed for applications that require radiation-tolerant programmable logic and high-performance serial interfaces. The device integrates Microchip’s fourth‑generation FPGA fabric with hardened logic elements, on‑chip memory, DSP resources and high-speed SerDes to support demanding aerospace, avionics, medical and nuclear control use cases.

Key architectural highlights include 151,824 logic elements, multiple embedded memory and multiply‑accumulate resources for DSP, native SerDes capability and configuration resilience against radiation‑induced single‑event upsets. The part is delivered in a 1657‑BCLGA package (42.5 × 42.5 mm), RoHS compliant and specified for military temperature range operation.

Key Features

  • Logic Density  151,824 logic elements (registers/LEs) providing high logic capacity for complex FPGA designs.
  • Embedded Memory and DSP  Total on‑chip RAM of 5,325 bits combined with embedded multiply‑accumulate blocks for DSP tasks and algorithm acceleration.
  • High‑speed Serial Interfaces  Native SerDes support with 3.125 Gbps capability for high‑speed serial communication and link interfaces.
  • Radiation‑Tolerant Architecture  FPGA fabric and registers hardened to resist radiation‑induced configuration upsets and single‑event upsets (SEUs), suitable for space and other harsh environments.
  • I/O Capacity  720 user I/O pins to support extensive peripheral, memory and interface connectivity.
  • Power and Operating Range  Supply voltage specified from 1.14 V to 1.26 V with an operating temperature range of −55 °C to 125 °C for military‑grade deployments.
  • Package and Mounting  Supplied in a 1657‑BCLGA (1657‑CLGA, 42.5 × 42.5 mm) surface‑mount package for high‑density board designs.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Space and Satellite Systems  Radiation‑tolerant FPGA fabric and SEU‑hardened registers make this device suitable for payload processing, data routing and control in space flight environments.
  • High‑Altitude and Avionics  Military temperature range and hardened design support flight electronics, communication links and on‑board processing at high altitude.
  • Medical and Nuclear Control  Resilient configuration and robust operating range enable dependable signal processing and control in medical instrumentation and nuclear plant control systems.
  • High‑Speed Communications  Integrated SerDes (3.125 Gbps) and large I/O count support serial links, data concentrators and memory interface bridging.

Unique Advantages

  • Radiation‑hardened Configuration: Built to resist radiation‑induced configuration upsets and single‑event effects, reducing risk in harsh environments.
  • High Logic Capacity: 151,824 logic elements provide the resources to implement complex control, processing and interface logic on a single device.
  • Integrated DSP and Memory: Embedded multiply‑accumulate blocks alongside on‑chip RAM (5,325 bits) enable local signal processing and algorithm acceleration without external coprocessors.
  • Extensive I/O and High‑Speed Links: 720 user I/Os combined with native 3.125 Gbps SerDes support high‑bandwidth system architectures and flexible peripheral connectivity.
  • Military Temperature and Surface‑Mount Package: −55 °C to 125 °C rating and a 1657‑BCLGA (42.5 × 42.5 mm) surface‑mount package meet demanding mechanical and thermal design requirements.
  • Regulatory Compliance: RoHS compliant for environmental and procurement requirements.

Why Choose RT4G150L-LGG1657R?

The RT4G150L-LGG1657R positions itself for applications where programmable logic must operate reliably in radiation‑prone or extreme temperature environments while providing substantial logic capacity and high‑speed serial links. Its combination of 151,824 logic elements, DSP resources, SerDes capability and a 720‑pin I/O footprint delivers a compact, integrated platform for complex processing, communication and control tasks.

This device is suited to engineers and programs that require military‑grade environmental performance, on‑board signal processing and hardened configuration integrity. The package, supply voltage window and documented operating ranges facilitate system integration for long‑lifecycle, mission‑critical designs.

Request a quote or submit an inquiry to get pricing and availability for the RT4G150L-LGG1657R and to discuss volume, lead times and support for your project requirements.

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