RT4G150L-LGG1657E

The RT4G150L-LGG1657E is a flash-based RTG4™ FPGA from Microchip Technology that integrates fourth‑generation FPGA fabric with high-performance interfaces and memory subsystems. The device combines a high‑density logic fabric (151,824 logic elements) with hardened registers and embedded resources targeted at systems that require resistance to radiation‑induced configuration upsets.

Designed for demanding environments, the RT4G150L-LGG1657E supports high-speed serial and memory interfaces alongside DSP-capable mathblocks, enabling applications in space flight, high‑altitude aviation, medical electronics, nuclear control, and other radiation‑sensitive systems. The device is offered in a 1657‑BCLGA package with extended temperature and low‑voltage operation.

Key Features

• High-density logic fabric — 151,824 logic elements on‑chip, each including a 4‑input LUT and fast carry chains to support logic and control functions.
• Radiation‑resistant architecture — Registers and configuration are hardened by design against radiation‑induced single‑event upsets (SEUs), suitable for harsh radiation environments described in the RTG4 series datasheet.
• Embedded memory and DSP blocks — Approximately 5,325 bits of on‑chip RAM and embedded multiply‑accumulate blocks to support digital signal processing tasks up to 300 MHz.
• High‑performance serial and memory interfaces — Native SerDes capable of 3.125 Gbps and support for DDR2/DDR3/LPDDR memory controllers for high‑speed data movement.
• Rich I/O — 720 user I/Os enabling complex system interfacing and peripheral connectivity.
• Package and mounting — 1657‑BCLGA (supplier package: 1657‑CLGA, 42.5 × 42.5 mm) in a surface‑mount form factor for board integration.
• Low‑voltage operation — Recommended supply voltage range from 1.14 V to 1.26 V.
• Extended temperature grade — Rated for operation from −55 °C to 125 °C, suitable for temperature‑extreme deployments.
• RoHS compliant — Meets RoHS environmental requirements.

Typical Applications

• Space and satellite systems — Radiation‑hardened registers and configuration provide resilience for payload processing and on‑board data handling in space flight applications.
• High‑altitude and aerospace avionics — Extended temperature range and SEU‑hardened fabric support avionics control, sensor fusion, and telemetry tasks at altitude.
• Medical and nuclear control electronics — Hardened configuration and extended operating temperature make the device suitable for critical control and monitoring systems in harsh environments.
• High‑speed communications and memory interfaces — Built‑in SerDes and DDR2/DDR3/LPDDR controllers enable serial links and high‑bandwidth memory interfaces for data concentrators and link aggregation.

Unique Advantages

• Radiation‑hardened design: Hardened registers and configuration reduce the risk of SEU‑related upsets in radiation‑exposed systems.
• High logic density: 151,824 logic elements allow consolidation of complex functions into a single FPGA, reducing board-level component count.
• Integrated high‑speed I/O: 720 I/Os plus 3.125 Gbps SerDes simplify high‑bandwidth system architectures and interface implementation.
• DSP and memory capabilities: Embedded multiply‑accumulate blocks and on‑chip RAM support signal processing and buffering at frequencies up to 300 MHz.
• Robust environmental range: Extended −55 °C to 125 °C rating and RoHS compliance support deployment in temperature‑extreme and environmentally regulated applications.
• Compact, manufacturable package: 1657‑BCLGA surface‑mount package (42.5 × 42.5 mm) suitable for modern PCB assembly processes.

Why Choose RT4G150L-LGG1657E?

The RT4G150L-LGG1657E positions itself as a high‑density, radiation‑resistant FPGA optimized for systems that require both complex logic and dependable operation in challenging environments. With a large logic fabric, dedicated DSP resources, high‑speed serial and memory interfaces, and an extended temperature rating, this device is aimed at designers building avionics, space, medical, and industrial control solutions where configuration integrity and integration density are priorities.

Selecting this RTG4 device brings a combination of on‑chip resources and environmental resilience that can simplify system architecture, reduce external components, and support long‑life deployments backed by Microchip's RTG4 series documentation and device status information.

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