RT4G150L-CQG352R

RT4G150L-CQG352R
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 352-BFCQFP Exposed Pad and Tie Bar

Quantity 516 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Device Package352-QFP (48x48)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case352-BFCQFP Exposed Pad and Tie BarNumber of I/O166Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150L-CQG352R – RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 352-BFCQFP Exposed Pad and Tie Bar

The RT4G150L-CQG352R is a flash-based RTG4™ FPGA delivering a hardened, high-performance programmable fabric for demanding, radiation-prone environments. The device integrates a LUT-based logic fabric with embedded memory and DSP resources, high-speed SerDes, and support for high-speed external memory interfaces, targeting space, avionics, medical, and other high-reliability markets.

Designed for surface-mount deployment in a 352-BFCQFP package with exposed pad and tie bar, this military-grade FPGA combines resistance to radiation-induced configuration upsets with engineering-grade I/O and timing resources for complex digital signal processing and interface applications.

Key Features

  • High-density logic — 151,824 logic elements (registers) available for complex FPGA implementations.
  • On-chip memory — 5,325 bits of embedded RAM for small on-chip buffering and state storage.
  • High-performance fabric — 4-input LUT-based logic with fast carry chains and fabric performance up to 300 MHz as specified for RTG4 devices.
  • DSP and math support — Embedded multiply-accumulate blocks and DSP resources supporting signal processing up to 300 MHz.
  • High-speed serial interfaces — Native SerDes capability supporting 3.125 Gbps lanes for serial communication.
  • Memory controller support — Built-in support for DDR2/DDR3/LPDDR memory interfaces for high-throughput external memory connectivity.
  • Robust operating range — Supply voltage range of 1.14 V to 1.26 V and operating temperature range from −55 °C to 125 °C for military-grade environments.
  • Package and mounting — 352-BFCQFP exposed pad and tie bar (supplier package: 352-QFP 48×48) in a surface-mount form factor.
  • Radiation-hardened design — FPGA registers and configuration are hardened by design against radiation-induced single-event upsets (SEUs), suitable for space flight and other radiation-prone applications.
  • RoHS compliant — Conforms to RoHS environmental requirements.

Typical Applications

  • Space systems — Radiation-hardened configuration and SEU-resistant registers make the device suitable for Low Earth Orbit (LEO), Medium Earth Orbit (MEO), Geostationary Orbit (GEO), and deep-space payload electronics.
  • High-altitude avionics — The military-grade temperature range and radiation-tolerant design support avionics and high-altitude platforms where robustness is required.
  • Medical electronics — Deterministic logic, DSP resources, and hardened configuration support reliable operation in critical medical instrumentation.
  • Nuclear and power-plant control — Hardened configuration and broad temperature tolerance support control and monitoring systems in nuclear and other high-reliability facilities.

Unique Advantages

  • Radiation-tolerant architecture: Hardened registers and flash-based configuration reduce susceptibility to radiation-induced configuration upsets in harsh environments.
  • Large logic capacity: 151,824 logic elements provide headroom for complex control, processing, and interface tasks without external ASICs.
  • Integrated high-speed I/O: Native SerDes at 3.125 Gbps and support for DDR2/DDR3/LPDDR memory interfaces simplify high-throughput system designs.
  • Wide operating conditions: Operation from −55 °C to 125 °C and a defined core supply range enable use across demanding temperature and power environments.
  • Compact surface-mount package: 352-BFCQFP exposed pad package (352-QFP 48×48) provides thermal conduction and a robust mechanical footprint for board-level integration.
  • Regulated vendor documentation: Datasheet and technical references describe the RTG4 family’s fabric, I/O, and timing characteristics for engineering validation and qualification.

Why Choose RT4G150L-CQG352R?

The RT4G150L-CQG352R positions itself as a high-density, radiation-resistant FPGA for designs that demand both performance and reliability. With 151,824 logic elements, embedded DSP and memory resources, and hardened configuration, it addresses the needs of space, avionics, medical, and other mission-critical systems.

Engineers building systems that require deterministic fabric timing up to 300 MHz, high-speed SerDes links, and robust thermal and voltage operating windows will find this RTG4 FPGA suitable for long-term deployments where resilience and documented device characteristics matter.

If you would like pricing, availability, or to request a quote for RT4G150L-CQG352R, please submit an inquiry or request a quote through your usual procurement channel.

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