RT4G150L-CQG352M

RT4G150L-CQG352M
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 352-BFCQFP Exposed Pad and Tie Bar

Quantity 509 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Device Package352-QFP (48x48)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case352-BFCQFP Exposed Pad and Tie BarNumber of I/O166Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150L-CQG352M – RTG4™ Field Programmable Gate Array (FPGA)

The RT4G150L-CQG352M is a military-grade RTG4™ Flash-based FPGA offering a high-density, radiation-tolerant architecture for demanding embedded systems. This device combines a large programmable fabric with hardened registers, native high-speed serial interfaces, and embedded DSP/memory resources targeted at space, avionics, medical electronics, and other harsh-environment applications.

Key architectural elements include 151,824 logic elements, approximately 5,325 bits of embedded memory, 166 user I/Os, and native SerDes support — all in a 352‑BFCQFP exposed pad package designed for surface-mount assembly and extended temperature operation.

Key Features

  • High-density logic — 151,824 logic elements for complex control, processing and I/O consolidation in a single device.
  • Embedded memory and DSP — Approximately 5,325 bits of on-chip RAM plus embedded multiply-accumulate blocks supporting DSP functions up to 300 MHz.
  • Radiation-tolerant architecture — Fabric and registers are hardened against single-event upsets (SEUs) for use in radiation-prone environments such as space and high-altitude platforms.
  • High-speed serial interfaces — Native SerDes supporting 3.125 Gbps serial communication for high-throughput links.
  • Memory controller support — Integrated DDR2/DDR3/LPDDR memory controller capability for high-speed external memory interfaces.
  • Logic performance — Each logic element includes a 4-input LUT (LUT4) with fast carry chains and fabric performance up to 300 MHz.
  • Package and mounting — 352‑BFCQFP with exposed pad and tie bar; supplier device package: 352‑QFP (48×48). Surface-mount mounting type.
  • Operating range and supply — Voltage supply 1.14 V to 1.26 V; operating temperature range −55 °C to 125 °C. Grade: Military.
  • Standards and compliance — RoHS compliant for regulated material requirements.

Typical Applications

  • Space systems — Radiation-tolerant FPGA fabric and SEU-hardened registers for use in low-, medium- and geostationary-orbit payloads and spacecraft subsystems.
  • High-altitude and avionics — Deterministic logic performance and wide temperature range for flight electronics and high-altitude platforms.
  • Medical and industrial control — Embedded DSP blocks and abundant logic density for real-time signal processing, imaging, and control systems operating in demanding environments.
  • Nuclear and safety-critical instrumentation — Hardened configuration and military-grade temperature specs suitable for control and monitoring systems in nuclear facilities.

Unique Advantages

  • Radiation-hardened configuration: Registers and fabric hardened against SEUs to maintain reliable operation in radiation-prone environments.
  • Extensive logic resources: 151,824 logic elements enable consolidation of multiple subsystems into a single FPGA, reducing board-level complexity.
  • Integrated high-speed I/O: 166 user I/Os and native 3.125 Gbps SerDes simplify high-throughput interface design.
  • DSP-capable fabric: Embedded multiply-accumulate blocks and DSP performance up to 300 MHz support signal processing and real-time algorithms on-chip.
  • Wide operating range: Military-grade temperature rating (−55 °C to 125 °C) and precise supply window (1.14–1.26 V) for harsh-environment deployments.
  • Surface-mount, robust package: 352‑BFCQFP exposed pad with tie bar supports thermal management and reliable PCB assembly.

Why Choose RT4G150L-CQG352M?

The RT4G150L-CQG352M combines high logic density, hardened configuration, and integrated high-speed serial and memory interfaces in a military-grade FPGA package. It is well suited for system designers who require radiation tolerance, deterministic DSP performance, and a wide operating temperature range for space, avionics, medical, and nuclear applications.

Choosing this device enables consolidation of complex functions into a single programmable device, reducing system bill-of-materials and simplifying routing for high-performance embedded designs while leveraging Microchip's RTG4 architecture and support materials.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the RT4G150L-CQG352M.

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