RT4G150L-CQG352M
| Part Description |
RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 352-BFCQFP Exposed Pad and Tie Bar |
|---|---|
| Quantity | 509 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 32 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 352-QFP (48x48) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 352-BFCQFP Exposed Pad and Tie Bar | Number of I/O | 166 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 151824 | Number of Logic Elements/Cells | 151824 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 5325 |
Overview of RT4G150L-CQG352M – RTG4™ Field Programmable Gate Array (FPGA)
The RT4G150L-CQG352M is a military-grade RTG4™ Flash-based FPGA offering a high-density, radiation-tolerant architecture for demanding embedded systems. This device combines a large programmable fabric with hardened registers, native high-speed serial interfaces, and embedded DSP/memory resources targeted at space, avionics, medical electronics, and other harsh-environment applications.
Key architectural elements include 151,824 logic elements, approximately 5,325 bits of embedded memory, 166 user I/Os, and native SerDes support — all in a 352‑BFCQFP exposed pad package designed for surface-mount assembly and extended temperature operation.
Key Features
- High-density logic — 151,824 logic elements for complex control, processing and I/O consolidation in a single device.
- Embedded memory and DSP — Approximately 5,325 bits of on-chip RAM plus embedded multiply-accumulate blocks supporting DSP functions up to 300 MHz.
- Radiation-tolerant architecture — Fabric and registers are hardened against single-event upsets (SEUs) for use in radiation-prone environments such as space and high-altitude platforms.
- High-speed serial interfaces — Native SerDes supporting 3.125 Gbps serial communication for high-throughput links.
- Memory controller support — Integrated DDR2/DDR3/LPDDR memory controller capability for high-speed external memory interfaces.
- Logic performance — Each logic element includes a 4-input LUT (LUT4) with fast carry chains and fabric performance up to 300 MHz.
- Package and mounting — 352‑BFCQFP with exposed pad and tie bar; supplier device package: 352‑QFP (48×48). Surface-mount mounting type.
- Operating range and supply — Voltage supply 1.14 V to 1.26 V; operating temperature range −55 °C to 125 °C. Grade: Military.
- Standards and compliance — RoHS compliant for regulated material requirements.
Typical Applications
- Space systems — Radiation-tolerant FPGA fabric and SEU-hardened registers for use in low-, medium- and geostationary-orbit payloads and spacecraft subsystems.
- High-altitude and avionics — Deterministic logic performance and wide temperature range for flight electronics and high-altitude platforms.
- Medical and industrial control — Embedded DSP blocks and abundant logic density for real-time signal processing, imaging, and control systems operating in demanding environments.
- Nuclear and safety-critical instrumentation — Hardened configuration and military-grade temperature specs suitable for control and monitoring systems in nuclear facilities.
Unique Advantages
- Radiation-hardened configuration: Registers and fabric hardened against SEUs to maintain reliable operation in radiation-prone environments.
- Extensive logic resources: 151,824 logic elements enable consolidation of multiple subsystems into a single FPGA, reducing board-level complexity.
- Integrated high-speed I/O: 166 user I/Os and native 3.125 Gbps SerDes simplify high-throughput interface design.
- DSP-capable fabric: Embedded multiply-accumulate blocks and DSP performance up to 300 MHz support signal processing and real-time algorithms on-chip.
- Wide operating range: Military-grade temperature rating (−55 °C to 125 °C) and precise supply window (1.14–1.26 V) for harsh-environment deployments.
- Surface-mount, robust package: 352‑BFCQFP exposed pad with tie bar supports thermal management and reliable PCB assembly.
Why Choose RT4G150L-CQG352M?
The RT4G150L-CQG352M combines high logic density, hardened configuration, and integrated high-speed serial and memory interfaces in a military-grade FPGA package. It is well suited for system designers who require radiation tolerance, deterministic DSP performance, and a wide operating temperature range for space, avionics, medical, and nuclear applications.
Choosing this device enables consolidation of complex functions into a single programmable device, reducing system bill-of-materials and simplifying routing for high-performance embedded designs while leveraging Microchip's RTG4 architecture and support materials.
Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the RT4G150L-CQG352M.

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