RT4G150L-CQG352V

RT4G150L-CQG352V
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 352-BFCQFP Exposed Pad and Tie Bar

Quantity 1,001 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package352-QFP (48x48)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case352-BFCQFP Exposed Pad and Tie BarNumber of I/O166Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150L-CQG352V – RTG4™ Field Programmable Gate Array, 151,824 Logic Elements, 352-BFCQFP

The RT4G150L-CQG352V is a Microchip RTG4™ flash-based FPGA designed for applications that require radiation-hardened configuration and high-performance serial and memory interfaces. It combines hardened logic fabric with embedded DSP resources and high-speed SerDes to address demanding environments such as space flight, high-altitude aviation, medical electronics and nuclear power plant control.

Built for robustness, this military-grade device provides 151,824 logic elements and architecture features described in the RTG4 family datasheet, delivering deterministic fabric behavior and integration of memory controllers and SerDes for system-level consolidation.

Key Features

  • High-density logic — 151,824 logic elements (registers) to implement complex control, signal processing and protocol functions.
  • Radiation-hardened design — Fabric and registers hardened by design against radiation-induced single-event upsets (SEUs), aligning the device to use in harsh radiation environments described in the RTG4 family documentation.
  • 4-input LUTs and fast carry chains — Each logic element includes a 4-input LUT (LUT4) with fast carry chains, supporting fabric operation up to 300 MHz as specified for the RTG4 family.
  • Embedded DSP capability — Embedded multiply-accumulate mathblocks for DSP workloads, with mathblock timing described for operation up to 300 MHz.
  • High-speed serial and memory interfaces — Native SerDes capability at 3.125 Gbps and integrated DDR2/DDR3/LPDDR memory controller support as provided by the RTG4 architecture.
  • On-chip memory — Approximately 5,325 bits of embedded RAM for fabric storage and buffering.
  • I/O and packaging — 166 user I/Os in a surface-mount 352-BFCQFP exposed pad package (supplier package: 352-QFP, 48×48 mm) with tie-bar for board-level integration.
  • Power and temperature — Recommended supply range of 1.14 V to 1.26 V and operating temperature range from −55 °C to 125 °C; manufactured to military grade.
  • RoHS compliant — Conforms to RoHS requirements for lead-free assembly.

Typical Applications

  • Space systems — Radiation-hardened configuration and SerDes support for data links in LEO, MEO, GEO, HEO and deep-space missions, as described in the RTG4 documentation.
  • High-altitude aviation — Hardened logic fabric and wide temperature range suitable for avionics subsystems that operate in elevated radiation environments.
  • Medical electronics — Deterministic FPGA fabric and embedded DSP mathblocks for medical signal processing and control functions where robustness is required.
  • Nuclear power plant control — Radiation-tolerant architecture and military-grade thermal range for control and monitoring subsystems in nuclear environments.

Unique Advantages

  • Radiation-tolerant FPGA fabric: Hardened registers and design mitigations reduce susceptibility to SEUs, supporting reliable operation in radiation-prone environments.
  • High integration of interfaces: Native SerDes at 3.125 Gbps plus DDR2/DDR3/LPDDR controller integration lower system complexity and reduce discrete interface components.
  • Deterministic compute and DSP: LUT4-based logic with fast carry chains and embedded multiply-accumulate blocks enable real-time signal processing at the RTG4-specified fabric rates.
  • Deployment-ready thermal and electrical envelope: Operation from −55 °C to 125 °C and a defined supply range (1.14–1.26 V) simplify qualification for harsh-environment applications.
  • Form-factor and mounting: Surface-mount 352-BFCQFP package with exposed pad supports thermal dissipation and board-level assembly for high-reliability systems.
  • Compliance and lifecycle support: RoHS compliance and Microchip’s RTG4 family documentation and support channels provide the information needed for long-term deployment and qualification.

Why Choose RT4G150L-CQG352V?

The RT4G150L-CQG352V positions itself as a high-density, radiation-hardened FPGA option for systems requiring reliable logic and high-speed interfaces in harsh environments. With 151,824 logic elements, embedded DSP resources, native SerDes and supported memory controller interfaces, it enables consolidation of functions that would otherwise require multiple components.

This military-grade RTG4 device is suitable for design teams and programs focused on space, aviation, medical and nuclear applications that need deterministic FPGA behavior, documented performance up to RTG4 family specifications, and access to Microchip’s technical documentation and product change/support services.

Request a quote or submit an inquiry for pricing and availability to begin integrating the RT4G150L-CQG352V into your next high-reliability design.

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