RT4G150L-LGG1657M
| Part Description |
RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BCLGA |
|---|---|
| Quantity | 1,060 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 32 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1657-CLGA (42.5x42.5) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1657-BCLGA | Number of I/O | 720 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 151824 | Number of Logic Elements/Cells | 151824 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 5325 |
Overview of RT4G150L-LGG1657M – RTG4™ Field Programmable Gate Array (FPGA) IC, 151,824 logic elements, 5,325 bits RAM, 720 I/Os, 1657-BCLGA, Military Grade
The RT4G150L-LGG1657M is a flash-based RTG4™ FPGA integrating radiation-hardened programmable fabric with high-performance interfaces and embedded DSP resources. It is designed for high-reliability, harsh-environment applications where resistance to radiation-induced configuration upsets is required.
Targeted use cases include space flight, high-altitude aviation, medical electronics and nuclear power plant control. The device combines up to 151,824 logic elements with embedded memory and high-speed serial interfaces to enable complex signal processing and interface consolidation in a single 1657-BCLGA surface-mount package.
Key Features
- FPGA Core Up to 151,824 logic elements (registers/LUT-based fabric) with 4-input LUTs and fast carry chains supporting fabric operation up to 300 MHz.
- Embedded Memory & DSP Multiple embedded memory options totaling 5,325 bits of on-chip RAM and embedded multiply-accumulate blocks for DSP workloads up to 300 MHz.
- High-speed Serial Interfaces Integrated high-speed serial interface providing native SerDes communication at 3.125 Gbps and DDR2/DDR3/LPDDR memory controller support.
- I/O Density Up to 720 user I/Os to support dense peripheral, sensor and high-speed interface connectivity.
- Voltage & Power Recommended supply range from 1.14 V to 1.26 V for core operation.
- Package & Mounting 1657-BCLGA (1657-CLGA, 42.5 × 42.5 mm) surface-mount package for high-pin-count system integration.
- Environmental & Grade Military-grade device with operating temperature range from −55 °C to 125 °C and RoHS compliant.
- System Reliability Fabric hardened by design against radiation-induced single-event upsets (SEUs) for use in radiation-prone environments.
Typical Applications
- Spaceflight and Satellite Systems Radiation-hardened FPGA fabric and SEU resistance make this device suitable for LEO/MEO/GEO and deep-space payload and platform logic.
- High-Altitude Aviation and Avionics High logic capacity, deterministic DSP performance and extended temperature range support avionics processing and control functions.
- Medical Electronics Hardened configuration stability and on-chip DSP resources enable reliable signal processing in medical instrumentation.
- Nuclear and Industrial Safety Systems Designed for harsh environments where radiation tolerance and wide-temperature operation are required for control and monitoring systems.
- High-Speed Communications and DSP Native SerDes, DDR memory controller support and MAC blocks enable high-throughput telemetry, data acquisition and processing subsystems.
Unique Advantages
- Radiation-hardened architecture: Hardened-by-design fabric reduces susceptibility to SEUs for mission-critical deployments.
- High logic capacity: 151,824 logic elements provide headroom for large logic, control and signal-processing designs.
- Dense system I/O: 720 I/Os enable integration of multiple interfaces and peripherals without extensive external glue logic.
- Integrated high-speed serial: Native 3.125 Gbps SerDes simplifies implementation of high-throughput links.
- Wide operating temperature and military grade: −55 °C to 125 °C rating and military-grade classification for harsh-environment reliability.
- Compact high-pin-count package: 1657-BCLGA (42.5 × 42.5 mm) surface-mount footprint balances pin density and board-level integration.
Why Choose RT4G150L-LGG1657M?
The RT4G150L-LGG1657M positions itself as a high-capacity, radiation-tolerant FPGA for applications that demand deterministic DSP performance, high-speed serial connectivity and broad I/O capability within a military-grade temperature envelope. Its combination of hardened FPGA fabric, embedded memory and MAC blocks enables consolidated system designs that reduce external components while addressing reliability requirements.
This device is well suited for engineering teams developing flight electronics, avionics, medical instrumentation and nuclear control systems that require robust configuration stability and on-chip resources for signal processing and high-speed interfaces.
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