RT4G150L-LGG1657B

RT4G150L-LGG1657B
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BCLGA

Quantity 650 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Device Package1657-CLGA (42.5x42.5)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case1657-BCLGANumber of I/O720Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150L-LGG1657B – RTG4™ Field Programmable Gate Array (FPGA) IC

The RT4G150L-LGG1657B is a flash-based RTG4™ FPGA offering hardened logic and high-performance interfaces for demanding, harsh-environment applications. Its architecture combines radiation-resistant configuration, embedded DSP resources and high-speed serial I/O to support space, avionics, medical and nuclear control systems where reliability and deterministic performance are required.

Built with 151,824 logic elements, 720 user I/O and on-chip memory, this surface-mount device in a 1657-BCLGA package is specified for military-grade operating conditions and a wide temperature range to meet rigorous system requirements.

Key Features

  • Flash-based FPGA fabric — Non-volatile configuration memory with architecture designed for resistance to radiation-induced configuration upsets (SEUs), improving on-orbit and high-altitude reliability.
  • High logic capacity — 151,824 logic elements (cells) to implement complex control, signal processing and protocol functions on a single device.
  • Embedded memory — Total on-chip RAM of 5,325 bits (approximately 5.3 Kbits) for fabric storage and buffering needs.
  • DSP and math blocks — Integrated multiply-accumulate resources and DSP-capable fabric to support algorithm acceleration and digital signal processing workloads up to the device’s rated fabric speeds.
  • High-speed serial interfaces — On-chip SerDes and serialization/deserialization capabilities referenced in the RTG4 family for high-throughput link implementations and native serial communications.
  • Robust I/O and package — 720 user I/O, surface-mount 1657-BCLGA package (supplier device package 1657-CLGA, 42.5 × 42.5 mm) for dense board-level integration.
  • Tight supply and wide temperature range — Specified supply voltage range of 1.14 V to 1.26 V and operating temperature from −55 °C to 125 °C for military-grade deployments.
  • Compliance — RoHS compliant for environmental regulatory adherence.

Typical Applications

  • Space systems — Radiation-hardened configuration and hardened-by-design logic make the device suitable for low-, medium- and geostationary-orbit payloads and on-board processing.
  • High-altitude and avionics — Robust operating temperature range and radiation-resistant architecture support flight electronics and avionics subsystems.
  • Medical electronics — Deterministic processing and embedded DSP resources enable real-time signal conditioning and control in clinical equipment.
  • Nuclear and industrial control — Hardened FPGA fabric, wide temperature rating and high I/O density support control, monitoring and safety-critical processing in extreme environments.

Unique Advantages

  • Radiation-tolerant configuration: Fabric and configuration memory designed to resist radiation-induced upsets, reducing the need for frequent reconfiguration in harsh environments.
  • High integration reduces system complexity: Large logic capacity, embedded memory and DSP blocks consolidate multiple functions into one device, lowering BOM and board area.
  • High I/O count for system connectivity: 720 user I/O pins enable dense peripheral, sensor and high-speed interface routing without external multiplexing.
  • Military-grade environmental range: Specified for −55 °C to 125 °C operation and a narrow core supply window (1.14 V–1.26 V) for stable performance under harsh conditions.
  • Package designed for high-density boards: 1657-BCLGA (42.5 × 42.5 mm supplier package) allows compact integration of a high-capacity FPGA.

Why Choose RT4G150L-LGG1657B?

The RT4G150L-LGG1657B positions itself as a high-capacity, radiation-hardened FPGA solution tailored for systems that require a combination of reliable configuration, substantial logic resources and robust environmental performance. Its integrated DSP capabilities, substantial I/O and hardened fabric make it well suited for engineers building mission-critical designs in aerospace, defense, medical and nuclear markets.

For design teams seeking a single-device solution to consolidate control, signal processing and high-speed interfaces while maintaining resistance to radiation-induced upsets and wide-temperature operation, this RTG4 device offers a pragmatic balance of integration, reliability and deployment-ready specifications.

Request a quote or submit an inquiry to receive pricing and availability for the RT4G150L-LGG1657B to evaluate its fit for your next mission-critical design.

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