RT4G150L-LGG1657PROTO
| Part Description |
RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BCLGA |
|---|---|
| Quantity | 273 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 32 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1657-CLGA (42.5x42.5) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1657-BCLGA | Number of I/O | 720 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 151824 | Number of Logic Elements/Cells | 151824 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 5325 |
Overview of RT4G150L-LGG1657PROTO – RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BCLGA
The RT4G150L-LGG1657PROTO is a flash-based RTG4™ FPGA from Microchip Technology designed for demanding, radiation-prone environments. It combines a hardened FPGA fabric with high-performance serial and memory interfaces to serve aerospace, high-altitude aviation, medical electronics, and nuclear control applications.
Built for reliability and processing density, this device delivers 151,824 logic elements, multiple embedded memory options and DSP resources, high-speed SerDes, and a wide military-grade operating range, making it suitable for systems that require both computational capability and environmental resilience.
Key Features
- High logic density — 151,824 logic elements (registers) provide substantial programmable resources for complex logic and control functions.
- Embedded memory — Multiple embedded memory options with 5,325 bits of on-chip RAM for configuration and application data storage.
- DSP and timing — On-chip multiply-accumulate blocks and fabric timing capable of supporting DSP operations up to 300 MHz.
- High-speed serial interfaces — Native SerDes support up to 3.125 Gbps for board‑to‑board and high-speed data links.
- Memory controller support — Integrated DDR2/DDR3/LPDDR memory controller capability for high-bandwidth external memory interfaces.
- Extensive I/O — 720 user I/O pins to support a wide range of peripherals and board-level connectivity.
- Power and supply — Core voltage supply range from 1.14 V to 1.26 V for the device core domain.
- Packaging and mounting — 1657-BCLGA package; supplier device package 1657-CLGA (42.5 × 42.5 mm), surface-mount construction for compact board designs.
- Military-grade operating range — Rated for operation from −55 °C to 125 °C and specified as Grade: Military.
- Radiation-hardened architecture — FPGA fabric hardened by design against radiation-induced single-event upsets (SEUs) for use in harsh radiation environments.
Typical Applications
- Space systems — Flight electronics and payload controllers where radiation tolerance and reliable reconfigurable logic are required.
- High-altitude aviation — Avionics subsystems that need robust logic, high I/O count, and extended temperature operation.
- Medical electronics — Critical instrumentation and imaging control that benefit from FPGA-based flexibility and hardened configuration.
- Nuclear control systems — Control and monitoring applications operating in environments with elevated radiation levels and strict reliability needs.
Unique Advantages
- Radiation-hardened by design — Fabric-level hardening reduces susceptibility to configuration upsets, supporting deployment in radiation-prone environments.
- Substantial programmable capacity — 151,824 logic elements allow implementation of complex control, signal processing, and protocol functions on a single device.
- Integrated high-speed interfaces — 3.125 Gbps SerDes and DDR memory controller support enable high-throughput data paths without extensive external logic.
- Wide thermal tolerance — −55 °C to 125 °C operating range suits systems that experience extreme temperature conditions.
- High I/O availability — 720 I/O pins simplify integration with sensors, transceivers, and external memory, reducing board-level multiplexing or expansion needs.
- Compact, surface-mount package — 1657-BCLGA (42.5 × 42.5 mm) provides a high-density package option for space-constrained PCB layouts.
Why Choose RT4G150L-LGG1657PROTO?
The RT4G150L-LGG1657PROTO positions itself as a rugged, high-capacity FPGA solution for applications where radiation tolerance, broad temperature operation, and significant programmable resources are essential. Its combination of hardened FPGA fabric, DSP resources, high-speed SerDes, and extensive I/O makes it suitable for aerospace, avionics, medical, and nuclear system designs that require reliable reconfigurable logic.
Selecting this RTG4 device provides designers with a scalable, robust platform from Microchip’s RTG4 family, enabling consolidation of system functions into a single, military-grade FPGA with on-chip memory and high-performance interfaces—helping to reduce component count while meeting demanding environmental requirements.
Request a quote or submit an inquiry to obtain pricing, availability, and additional technical support for the RT4G150L-LGG1657PROTO.

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