RT4G150L-LGG1657PROTO

RT4G150L-LGG1657PROTO
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BCLGA

Quantity 273 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Device Package1657-CLGA (42.5x42.5)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case1657-BCLGANumber of I/O720Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150L-LGG1657PROTO – RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BCLGA

The RT4G150L-LGG1657PROTO is a flash-based RTG4™ FPGA from Microchip Technology designed for demanding, radiation-prone environments. It combines a hardened FPGA fabric with high-performance serial and memory interfaces to serve aerospace, high-altitude aviation, medical electronics, and nuclear control applications.

Built for reliability and processing density, this device delivers 151,824 logic elements, multiple embedded memory options and DSP resources, high-speed SerDes, and a wide military-grade operating range, making it suitable for systems that require both computational capability and environmental resilience.

Key Features

  • High logic density — 151,824 logic elements (registers) provide substantial programmable resources for complex logic and control functions.
  • Embedded memory — Multiple embedded memory options with 5,325 bits of on-chip RAM for configuration and application data storage.
  • DSP and timing — On-chip multiply-accumulate blocks and fabric timing capable of supporting DSP operations up to 300 MHz.
  • High-speed serial interfaces — Native SerDes support up to 3.125 Gbps for board‑to‑board and high-speed data links.
  • Memory controller support — Integrated DDR2/DDR3/LPDDR memory controller capability for high-bandwidth external memory interfaces.
  • Extensive I/O — 720 user I/O pins to support a wide range of peripherals and board-level connectivity.
  • Power and supply — Core voltage supply range from 1.14 V to 1.26 V for the device core domain.
  • Packaging and mounting — 1657-BCLGA package; supplier device package 1657-CLGA (42.5 × 42.5 mm), surface-mount construction for compact board designs.
  • Military-grade operating range — Rated for operation from −55 °C to 125 °C and specified as Grade: Military.
  • Radiation-hardened architecture — FPGA fabric hardened by design against radiation-induced single-event upsets (SEUs) for use in harsh radiation environments.

Typical Applications

  • Space systems — Flight electronics and payload controllers where radiation tolerance and reliable reconfigurable logic are required.
  • High-altitude aviation — Avionics subsystems that need robust logic, high I/O count, and extended temperature operation.
  • Medical electronics — Critical instrumentation and imaging control that benefit from FPGA-based flexibility and hardened configuration.
  • Nuclear control systems — Control and monitoring applications operating in environments with elevated radiation levels and strict reliability needs.

Unique Advantages

  • Radiation-hardened by design — Fabric-level hardening reduces susceptibility to configuration upsets, supporting deployment in radiation-prone environments.
  • Substantial programmable capacity — 151,824 logic elements allow implementation of complex control, signal processing, and protocol functions on a single device.
  • Integrated high-speed interfaces — 3.125 Gbps SerDes and DDR memory controller support enable high-throughput data paths without extensive external logic.
  • Wide thermal tolerance — −55 °C to 125 °C operating range suits systems that experience extreme temperature conditions.
  • High I/O availability — 720 I/O pins simplify integration with sensors, transceivers, and external memory, reducing board-level multiplexing or expansion needs.
  • Compact, surface-mount package — 1657-BCLGA (42.5 × 42.5 mm) provides a high-density package option for space-constrained PCB layouts.

Why Choose RT4G150L-LGG1657PROTO?

The RT4G150L-LGG1657PROTO positions itself as a rugged, high-capacity FPGA solution for applications where radiation tolerance, broad temperature operation, and significant programmable resources are essential. Its combination of hardened FPGA fabric, DSP resources, high-speed SerDes, and extensive I/O makes it suitable for aerospace, avionics, medical, and nuclear system designs that require reliable reconfigurable logic.

Selecting this RTG4 device provides designers with a scalable, robust platform from Microchip’s RTG4 family, enabling consolidation of system functions into a single, military-grade FPGA with on-chip memory and high-performance interfaces—helping to reduce component count while meeting demanding environmental requirements.

Request a quote or submit an inquiry to obtain pricing, availability, and additional technical support for the RT4G150L-LGG1657PROTO.

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