U1AFS1500-FG256

The U1AFS1500-FG256 is a Fusion® field-programmable gate array (FPGA) from Microchip Technology. It integrates 38,400 logic elements and approximately 0.276 Mbits of embedded memory (276,480 total RAM bits) with 1,500,000 gates and 119 user I/O in a 256-LBGA package.

Designed as a surface-mount, commercial-grade FPGA, the device operates from a 1.425 V to 1.575 V supply and is specified for use across a 0 °C to 85 °C temperature range. The compact 256-FPBGA (17×17) package balances I/O density and board-level integration for space-conscious designs.

Key Features

• Logic Core — 38,400 logic elements providing programmable logic capacity for implementing custom digital functions.
• Gate Count — 1,500,000 gates to support complex logic structures and combinational/sequential designs.
• Embedded Memory — Approximately 0.276 Mbits (276,480 total RAM bits) of on-chip RAM for buffering, state storage, and local data handling.
• I/O Density — 119 user I/O pins to accommodate multiple external interfaces and parallel connections.
• Power Supply — Operates from a tightly specified 1.425 V to 1.575 V supply for predictable power design and margining.
• Package & Mounting — 256-LBGA (256-FPBGA, 17×17) surface-mount package for compact board integration and high pin count in a small footprint.
• Temperature & Grade — Commercial grade device specified for 0 °C to 85 °C operation.
• Environmental Compliance — RoHS compliant.

Unique Advantages

• Balanced Logic and Memory: 38,400 logic elements combined with 276,480 bits of RAM provide a midpoint of programmable logic and embedded storage for control, data-path, and buffering tasks.
• High Gate Count for Complex Designs: 1,500,000 gates enable implementation of sophisticated logic architectures without external gate arrays.
• Ample I/O Capacity: 119 I/O pins support multiple peripheral connections and parallel interfaces while minimizing the need for external expanders.
• Compact LBGA Footprint: 256-LBGA (17×17) packaging offers high pin density in a board-friendly surface-mount form factor.
• Tight Supply Range: The specified 1.425 V–1.575 V supply window provides clear power requirements for system-level design and regulation.
• RoHS Compliance: Meets environmental regulations for lead-free assembly and global deployment.

Why Choose U1AFS1500-FG256?

The U1AFS1500-FG256 positions itself as a commercially graded FPGA that combines moderate-to-high logic capacity, embedded memory, and a substantial I/O count in a compact 256-LBGA package. Its defined supply-voltage range and temperature rating make it suitable for commercial embedded applications that require predictable power and thermal characteristics.

Backed by Microchip Technology, this Fusion® FPGA is appropriate for designers seeking a programmable solution with integrated memory and a dense I/O complement, offering a balance of integration and board-level efficiency for medium-complexity digital designs.

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