U1AFS250-FG256

The U1AFS250-FG256 is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology, offered as a commercial-grade device in a compact 256-LBGA package. It combines moderate programmable logic capacity with a significant I/O complement and on-chip RAM to address a range of commercial embedded design requirements.

With 6,144 logic elements, approximately 0.037 Mbits of embedded memory, and 114 available I/O, the device targets designs that need customizable digital logic, flexible interfacing, and a small footprint while operating within a 1.425 V to 1.575 V supply window and a 0 °C to 85 °C temperature range.

Key Features

• Core FPGA Capacity  Provides 6,144 logic elements and approximately 250,000 gates to implement custom digital logic and control functions.
• Embedded Memory  Includes 36,864 bits of on-chip RAM (approximately 0.037 Mbits) for data buffering, state storage, and small lookup tables.
• I/O Density  Offers 114 I/O pins to support multiple interfaces and external peripherals without external multiplexing.
• Power  Operates from a defined supply range of 1.425 V to 1.575 V, enabling tight power-supply design and predictable power budgeting.
• Package & Mounting  Supplied in a 256-LBGA package (supplier device package: 256-FPBGA, 17×17) with surface-mount mounting for compact PCB implementations.
• Temperature & Compliance  Commercial-grade device rated for 0 °C to 85 °C operation and RoHS compliant.

Typical Applications

• Commercial embedded systems  Implement custom control logic and I/O interfacing where a balance of logic capacity and I/O count is required.
• Consumer device control  Integrate device control, user interface handling, or peripheral glue logic within a compact 256-LBGA footprint and commercial temperature range.
• Prototyping and feature integration  Validate and integrate custom digital functions using the on-chip RAM and available logic resources before final system integration.
• I/O bridging and interface consolidation  Consolidate multiple signals or protocol interfaces using the device’s 114 I/O and programmable logic resources.

Unique Advantages

• Highly integrated programmable logic: 6,144 logic elements and ~250,000 gates enable implementation of diverse custom digital functions without additional ASIC development.
• Compact board footprint: 256-LBGA / 256-FPBGA (17×17) packaging and surface-mount mounting reduce PCB area and support dense board layouts.
• Wide I/O capability: 114 I/O pins allow flexible interfacing to peripherals, sensors, and other system components.
• Predictable power requirements: Narrow supply range (1.425 V–1.575 V) simplifies power-supply design and distribution planning.
• Commercial-grade readiness: Rated for 0 °C–85 °C operation and RoHS compliant for general commercial deployments.

Why Choose U1AFS250-FG256?

The U1AFS250-FG256 is positioned as a compact, commercial-grade FPGA option from Microchip Technology for designers who need a balanced combination of logic density, I/O capacity, and on-chip memory in a small package. Its defined supply window, RoHS compliance, and surface-mount 256-LBGA packaging make it suitable for space-conscious commercial applications that require programmable digital logic.

Choose this part when you need a Microchip-backed FPGA solution that delivers moderate logic and memory resources, extensive I/O, and straightforward integration into commercial embedded systems.

Request a quote or contact sales to obtain pricing, lead times, and additional ordering information for the U1AFS250-FG256.