U1AFS600-FG256

The U1AFS600-FG256 is a Fusion® field programmable gate array (FPGA) from Microchip Technology designed for commercial electronic applications. It provides a mid-range logic fabric with 6,144 logic elements, approximately 36,864 bits of on-chip RAM, and 114 I/O pins to address a variety of embedded system interfacing and control tasks.

Packaged in a compact 256-LBGA (supplier package: 256-FPBGA, 17×17) surface-mount package and operating from a 1.425 V to 1.575 V supply, this FPGA targets designs that require programmable logic capacity, moderate on-chip memory, and a high I/O count within a commercial temperature range.

Key Features

• Logic Capacity 6,144 logic elements and 250,000 gates provide mid-range programmable logic resources suitable for control, glue-logic, and custom datapath implementations.
• Embedded Memory 36,864 bits of on-chip RAM (approximately 0.037 Mbits) for buffering, small lookup tables, and state storage.
• I/O Resources 114 general-purpose I/O pins to support multiple peripheral interfaces and board-level connectivity.
• Package and Mounting 256-LBGA package (supplier: 256-FPBGA, 17×17) in a surface-mount form factor for compact PCB integration.
• Power Operates from a 1.425 V to 1.575 V supply window compatible with low-voltage system domains.
• Temperature and Grade Commercial-grade device with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
• Environmental Compliance RoHS compliant.

Typical Applications

• Embedded Control Use the FPGA’s logic and I/O capacity for custom control functions, protocol translation, and glue logic in embedded systems.
• Consumer Electronics Implement user-interface control, peripheral aggregation, and custom timing functions within consumer product designs.
• Communications and Networking Deploy as a protocol bridge or packet-processing assistant where moderate logic density and flexible I/O are required.
• Test and Measurement Provide configurable signal conditioning, I/O routing, and protocol handling in bench instruments and test fixtures.

Unique Advantages

• Balanced Integration: Combines 6,144 logic elements with on-chip RAM and 114 I/Os to provide a versatile platform for mid-range programmable designs, reducing the need for multiple discrete devices.
• Compact Footprint: The 256-LBGA (256-FPBGA, 17×17) package enables a small PCB area while preserving substantial I/O and logic capacity.
• Low-Voltage Operation: Narrow supply window (1.425 V–1.575 V) aligns with modern low-voltage system domains to simplify power-supply design.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation to meet typical commercial application thermal requirements.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements for many commercial products.

Why Choose U1AFS600-FG256?

The U1AFS600-FG256 offers a practical combination of logic density, embedded memory, and I/O capacity in a compact surface-mount 256-LBGA package, making it a strong choice for engineers building commercial embedded systems that need flexible programmable logic. Its commercial temperature rating and RoHS compliance align it with mainstream consumer and equipment designs.

Designed for customers who require scalable, mid-range programmability with straightforward power and packaging requirements, this Fusion® FPGA supports designs that benefit from on-chip logic and memory integration while keeping board area and component count under control.

Request a quote or submit a purchase inquiry to receive pricing and availability information for the U1AFS600-FG256.