U1AFS250-FG256I

The U1AFS250-FG256I is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a programmable logic fabric with 6,144 logic elements and approximately 36,864 bits of embedded RAM, intended for industrial applications that require configurable digital logic and robust operating conditions.

With 114 user I/Os, a 256-ball LFBGA package, and an industrial temperature rating, this device targets embedded and control designs that need moderate logic density, a substantial I/O count, and predictable power and thermal behavior.

Key Features

• Logic Density  6,144 logic elements (equivalent to 250,000 gates) providing programmable logic capacity for mid-range FPGA designs.
• On-Chip Memory  Approximately 36,864 bits of embedded RAM to support buffering, small data tables, and control state storage.
• I/O Count  114 user I/O pins to support multiple interfaces, sensor and actuator connections, or parallel control signals.
• Package & Mounting  256-ball FPBGA package (17 × 17) in a surface-mount format suitable for compact PCB designs.
• Power  Operates from a core supply range of 1.425 V to 1.575 V for predictable power planning.
• Industrial Temperature Rating  Rated for operation from -40 °C to 100 °C to meet extended-temperature deployment requirements.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing requirements.

Typical Applications

• Industrial Control & Automation  Use as programmable control logic, I/O aggregation, or custom protocol handling in industrial equipment operating across extended temperatures.
• Embedded System Glue Logic  Implement custom interfacing, timing, and protocol conversion between discrete components in compact embedded designs.
• Sensor and Actuator Interfaces  Aggregate and condition multiple sensor inputs and actuator outputs using the device's 114 I/Os and on-chip memory for buffering.
• Prototyping and Development  Evaluate mid-density FPGA implementations and validate system-level logic before scaling to other form factors or densities.

Unique Advantages

• Balanced Logic and Memory:  6,144 logic elements combined with 36,864 bits of RAM delivers a balanced resource mix for control-oriented designs that need both logic and small embedded memory.
• High I/O Count:  114 user I/Os simplify integration with multiple peripherals and parallel interfaces, reducing the need for external I/O expanders.
• Industrial Readiness:  Rated for -40 °C to 100 °C and specified as industrial grade for deployment in temperature-challenging environments.
• Compact, Surface-Mount Package:  256-ball FPBGA (17 × 17) supports compact PCB layouts while maintaining robust soldered connections for volume production.
• Predictable Power Envelope:  A defined core supply range of 1.425 V to 1.575 V aids power-supply design and thermal planning.
• Regulatory Compliance:  RoHS compliance supports modern manufacturing and regulatory requirements.

Why Choose U1AFS250-FG256I?

The U1AFS250-FG256I offers a practical combination of mid-range logic density, substantial I/O capability, and on-chip RAM in a compact 256-ball FPBGA package. Its industrial temperature rating and RoHS compliance make it suitable for embedded and control systems that require reliable, configurable logic across a wide temperature range.

Designed for engineers and procurement teams seeking an industrial-grade FPGA from Microchip Technology, this device fits designs that need moderate programmable logic, multiple I/Os, and clear power and packaging specifications for production deployment.

Request a quote or submit a pricing request to receive availability and lead-time information for the U1AFS250-FG256I.