U1AFS250-FGG256

The U1AFS250-FGG256 is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a balance of programmable logic, on-chip memory, and I/O density for commercial embedded designs.

Built in a 256-LBGA surface-mount package with a 1.425 V to 1.575 V supply range, the device targets mainstream applications that require up to 250,000 gates of user logic and 114 general-purpose I/O connections.

Key Features

• Logic Capacity Provides 6,144 logic elements supporting up to 250,000 gates of user-configurable logic for implementing custom digital functions.
• Embedded Memory Includes 36,864 bits of on-chip RAM (approximately 36.9 kbits) for small buffers, FIFOs, register file storage, and state machines.
• I/O Resources 114 general-purpose I/O pins suitable for interfacing with peripherals, sensors, and control signals.
• Package & Mounting Available in a 256-LBGA package (supplier device package: 256-FPBGA, 17 × 17) designed for surface-mount PCB assembly.
• Power and Thermal Operates from a 1.425 V to 1.575 V supply voltage and is specified for commercial operating temperatures from 0 °C to 85 °C.
• Compliance RoHS compliant to support regulatory requirements for lead-free manufacturing.

Unique Advantages

• Compact, high-density logic: 6,144 logic elements and 250,000 gates enable substantial functionality in a single FPGA package, reducing board-level complexity.
• On-chip memory for control and buffering: 36,864 bits of RAM support common embedded needs such as FIFOs, small data stores, and state retention without external memory.
• Generous I/O count: 114 I/O pins allow multiple peripheral interfaces and signal connections while keeping the design footprint small.
• Surface-mount 256-LBGA packaging: Compact 17 × 17 package format helps minimize PCB area and supports automated assembly processes.
• Commercial-grade specification: Specified operating temperature and RoHS compliance make the device suitable for mainstream electronics and consumer product development.

Why Choose U1AFS250-FGG256?

The U1AFS250-FGG256 positions itself as a practical, integrated FPGA option for commercial embedded designs that require mid-range logic density, modest on-chip memory, and a flexible I/O complement. Its combination of 6,144 logic elements, 36,864 bits of RAM, and 114 I/O pins provides designers with the resources to implement custom digital functions while keeping BOM and board area under control.

With a standard surface-mount 256-LBGA package, narrow supply voltage window, and RoHS compliance, this Fusion® FPGA is well suited to teams focused on scalable, reliable designs for consumer and industrial-commercial applications that operate within a 0 °C to 85 °C range.

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