U1AFS1500-FG256I

The U1AFS1500-FG256I is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology, delivering a mid-range mix of logic, embedded memory and I/O in a compact 256-LBGA package. Designed and specified for industrial environments, it provides configurable logic resources and on-chip memory suitable for applications that require programmable interfacing and control across a wide operating temperature range.

Key Features

• Logic Density  Approximately 38,400 logic elements (cells) and 1,500,000 gates provide programmable resources for implementing custom logic, control and glue logic functions.
• Embedded Memory  Approximately 0.276 Mbits of on-chip RAM (276,480 bits) for buffering, state storage and small data structures within user designs.
• I/O Capability  119 user I/O pins support diverse interfacing and signal routing requirements in mixed-signal and digital systems.
• Package and Mounting  256-LBGA package (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for compact board designs.
• Power Supply  Specified core supply range of 1.425 V to 1.575 V to match system power rails and design constraints.
• Industrial Temperature Grade  Rated for operation from −40°C to 100°C, enabling use in industrial and other temperature-challenging environments.
• Regulatory  RoHS compliant, supporting environmentally conscious manufacturing and assembly processes.

Typical Applications

• Industrial Control and Automation  Programmable logic and wide operating temperature support make the device suitable for control modules, I/O expansion and interface bridging in industrial systems.
• Data Acquisition and Signal Conditioning  On-chip RAM and configurable logic enable buffering, pre-processing and protocol conversion for sensor and measurement front ends.
• Custom Interface and Glue Logic  High I/O count and sizable logic fabric allow implementation of custom protocol adapters, bus bridges and peripheral controllers.
• Embedded System Integration  Compact 256-LBGA packaging and surface-mount mounting support space-constrained embedded boards requiring programmable functionality.

Unique Advantages

• Balanced Logic and Memory  A combination of ~38,400 logic elements and ~0.276 Mbits of embedded RAM supports a wide range of mid-complexity designs without external memory.
• Generous I/O  119 I/O pins provide flexible signal routing for interfacing with sensors, actuators, and peripherals, reducing the need for external glue logic.
• Industrial Reliability  Designed for −40°C to 100°C operation, enabling deployment in industrial environments with elevated temperature demands.
• Compact Surface-Mount Package  256-LBGA (256-FPBGA 17×17) delivers a small PCB footprint while supporting the device’s I/O and thermal requirements.
• RoHS Compliant  Facilitates environmentally compliant manufacturing and assembly processes.
• Manufacturer Backing  Produced by Microchip Technology, providing access to product documentation and support channels from the device vendor.

Why Choose U1AFS1500-FG256I?

The U1AFS1500-FG256I positions itself as a capable, industrial-grade FPGA for designs that require a balanced mix of logic resources, on-chip RAM and substantial I/O in a compact package. Its specified supply voltage range and wide operating temperature make it appropriate for embedded systems and industrial control applications where reliability and environmental tolerance matter.

Engineers and procurement teams seeking a mid-range programmable logic device with clear, verifiable specifications—logic capacity, RAM, I/O count, package details and industrial temperature rating—will find the U1AFS1500-FG256I suited for scalable prototypes and production deployments backed by Microchip Technology.

Request a quote or submit an RFQ for the U1AFS1500-FG256I to receive pricing and availability information tailored to your project requirements.