RT4G150L-LGG1657V

The RT4G150L-LGG1657V is a flash-based Field Programmable Gate Array (FPGA) IC from Microchip Technology, supplied in a 1657‑BCLGA package (42.5×42.5 mm). Its architecture combines Microchip’s fourth‑generation flash FPGA fabric with high‑performance interfaces and design hardening to resist radiation‑induced configuration upsets for demanding environments.

Targeted at high‑reliability markets, this device provides a high logic capacity, significant I/O density and on‑chip DSP and memory resources, while supporting extended operating temperatures and a narrow core supply range for controlled power design.

Key Features

• Flash-based FPGA fabric — Fourth‑generation Microchip flash architecture with logic elements built around 4‑input LUTs and fast carry chains for deterministic combinational and sequential logic.
• High logic capacity — 151,824 logic elements (cells) to implement complex digital functions and state machines.
• Embedded memory and DSP — Total embedded RAM of 5,325 bits and integrated multiply‑accumulate blocks for DSP tasks and algorithm acceleration.
• High‑speed serial and memory interfaces — Native SerDes capability (3.125 Gbps documented in the family) and support for DDR2/DDR3/LPDDR memory controller interfaces as described in the RTG4 family datasheet.
• Radiation‑resistant design — Fabric and configuration hardened against single‑event upsets (SEUs) to maintain configuration integrity in radiation‑exposed environments.
• Large I/O count — 720 user I/O pins for broad system connectivity and parallel interface support.
• Package and mounting — 1657‑BCLGA surface‑mount package (supplier device package: 1657‑CLGA, 42.5×42.5 mm) for high‑density board integration.
• Voltage and temperature range — Core supply range 1.14 V to 1.26 V; qualified operating temperature from −55 °C to 125 °C for use in extreme environments.
• Qualification and compliance — Military grade designation and RoHS compliant.

Typical Applications

• Space systems (LEO/MEO/GEO/deep space) — Radiation‑hardened configuration and hardened fabric support FPGA functions in space flight applications exposed to ionizing environments.
• High‑altitude aviation — Suitable for avionics and flight‑test instrumentation where resistance to radiation‑induced upsets is required.
• Medical electronics — Use in systems that demand reliable, long‑lived programmable logic with robust configuration integrity.
• Nuclear power plant control — Applicable for control and monitoring logic in environments with elevated radiation risk and strict reliability needs.

Unique Advantages

• Radiation‑resistant architecture: Fabric and configuration hardened against SEUs, reducing mitigation complexity in radiation‑prone applications.
• High logic and I/O density: 151,824 logic elements combined with 720 I/Os enables consolidation of multiple functions onto a single device, reducing board area and BOM.
• Integrated DSP and memory resources: On‑chip multiply‑accumulate blocks and embedded RAM support signal processing tasks without relying solely on external processors.
• Wide operating temperature range: −55 °C to 125 °C rating supports deployment in harsh thermal environments common to military, aerospace and industrial facilities.
• Controlled power domain: Narrow core voltage range (1.14–1.26 V) simplifies power supply design and consistency across system builds.
• Package for dense integration: 1657‑BCLGA 42.5×42.5 mm package provides a high pin count in a compact footprint for complex board layouts.

Why Choose RT4G150L-LGG1657V?

The RT4G150L-LGG1657V positions itself as a high‑capacity, robust FPGA option for designers who need programmable logic that endures in radiation‑exposed and temperature‑extreme environments. With 151,824 logic elements, abundant I/O, embedded DSP and memory resources, and a package suitable for dense system integration, it enables consolidation of complex digital subsystems while addressing reliability requirements.

This device is well suited for teams in aerospace, defense, medical and energy sectors seeking a vendor‑backed FPGA with radiation‑resistant configuration, predictable power domain characteristics and qualification for military‑grade applications.

Request a quote or submit a parts inquiry for RT4G150L-LGG1657V to receive pricing and availability information for your program needs.