U1AFS600-FGG256I

The U1AFS600-FGG256I is a Fusion® Field Programmable Gate Array (FPGA) IC optimized for industrial applications. It combines a mid-range logic fabric with embedded RAM and a substantial I/O complement to implement custom digital functions, glue logic, and control interfaces.

Key on-chip resources include 6,144 logic elements, approximately 36,864 bits of embedded memory, and 114 general-purpose I/O pins, all delivered in a 256-LBGA surface-mount package rated for industrial temperature operation.

Key Features

• Core Logic: 6,144 logic elements and approximately 250,000 gates to implement combinational and sequential logic blocks for custom designs.
• Embedded Memory: Approximately 36,864 bits of on-chip RAM for buffering, small lookup tables, and state storage within the FPGA fabric.
• I/O Capacity: 114 I/O pins support interfacing to sensors, peripherals, and external logic without additional expander devices.
• Package & Mounting: 256-LBGA (supplier package: 256-FPBGA, 17 × 17 mm) in a surface-mount form factor for compact PCB integration.
• Power: Single-core supply operation across a specified range of 1.425 V to 1.575 V to match system power rails.
• Industrial Temperature Range: Rated to operate from −40 °C to 100 °C for deployment in industrial environments.
• Regulatory & Materials: RoHS-compliant manufacturing to meet common environmental and materials requirements.

Typical Applications

• Industrial Control: Implement custom control logic, sequencing, and real-time interface functions within industrial automation systems.
• Sensor and I/O Aggregation: Aggregate and preprocess sensor signals or peripheral interfaces using the FPGA's logic and I/O resources.
• Embedded Logic and Glue: Replace discrete glue logic and CPLDs with a programmable solution to consolidate board-level functions.
• Prototyping and Custom IP: Validate and deploy custom IP cores and control algorithms in a compact, surface-mount package.

Unique Advantages

• Balanced Logic and Memory: 6,144 logic elements paired with approximately 36,864 bits of RAM provide flexible on-chip resources for a wide range of logic and buffering tasks.
• Generous I/O Count: 114 I/O pins reduce the need for external interface chips and simplify PCB routing for multi-signal designs.
• Industrial Temperature Rating: −40 °C to 100 °C capability supports reliable operation in demanding environmental conditions.
• Compact BGA Package: 256-LBGA (17 × 17 mm) enables high-density PCB layouts while preserving solderability for surface-mount assembly.
• Focused Power Range: Operation within a defined 1.425 V to 1.575 V supply window enables predictable integration with system power rails.
• RoHS Compliance: Materials and manufacturing compliant with RoHS to support regulatory and environmental requirements.

Why Choose U1AFS600-FGG256I?

The U1AFS600-FGG256I positions itself as a compact, industrial-grade FPGA suitable for designs that require a balance of logic density, on-chip RAM, and a large number of I/Os in a small surface-mount package. Its specified operating temperature range and RoHS compliance make it appropriate for long-lived industrial deployments.

This device is a practical choice for engineers building control systems, I/O aggregation modules, or custom embedded logic where predictable supply requirements, a defined resource set (logic elements, gates, RAM), and a compact BGA footprint are primary considerations.

Request a quote or contact sales to check availability, lead times, and pricing for the U1AFS600-FGG256I.