XA2S150E-6FT256I

The XA2S150E-6FT256I is a Spartan®-IIE XA family FPGA from AMD, supplied in a 256-LBGA package. It offers programmable logic resources and a broad I/O set in a surface-mount form factor designed for applications requiring qualification to AEC-Q100.

With 3,888 logic elements, approximately 0.049 Mbits (49,152 bits) of on-chip RAM, and 182 user I/O, this device targets automotive and embedded designs that require moderate logic capacity, extensive I/O, and defined voltage and temperature operating ranges.

Key Features

• Core Logic  3,888 logic elements providing the programmable fabric for custom digital functions; approximately 150,000 equivalent gates for capacity planning.
• On‑Chip Memory  Approximately 0.049 Mbits (49,152 bits) of embedded RAM to support local buffering, state machines, and small data storage needs.
• I/O Density  182 user I/O pins to enable multiple peripheral interfaces and signal routing directly to the FPGA.
• Package & Mounting  256-LBGA (supplier package: 256-FTBGA, 17×17) in a surface-mount configuration for compact board layouts.
• Power  Core voltage supply range of 1.71 V to 1.89 V for device power planning and compatibility with low-voltage domains.
• Operating Range & Qualification  Rated for operation from −40°C to 100°C and qualified to AEC-Q100, indicating suitability for automotive-grade environments.
• Regulatory  RoHS compliant for restricted substances considerations in manufacturing and supply chains.

Typical Applications

• Automotive Systems  Automotive-grade qualification (AEC-Q100) and −40°C to 100°C range make it suitable for in-vehicle control and signal-processing tasks that require reliable programmable logic and multiple I/O.
• Embedded Control Platforms  3,888 logic elements and 182 I/O support implementation of customized control logic and peripheral interfacing in embedded products.
• Industrial Electronics  The device’s temperature range, robust qualification, and surface-mount 256-LBGA package fit industrial modules needing compact, qualified programmable logic.
• Custom I/O and Glue Logic  High I/O count enables board-level consolidation of glue logic and interface adaptation where moderate logic capacity and on-chip RAM are sufficient.

Unique Advantages

• Automotive-Qualified Reliability: AEC-Q100 qualification and a −40°C to 100°C operating window support deployment in automotive environments.
• Balanced Logic and Memory: 3,888 logic elements paired with 49,152 bits of on-chip RAM provide a compact combination for many control and data-path tasks.
• Extensive I/O for Integration: 182 user I/O pins allow direct connections to peripherals and sensors, reducing the need for external interface components.
• Compact Surface-Mount Package: 256-LBGA (256-FTBGA, 17×17) enables dense PCB layouts and space-constrained designs.
• Low-Voltage Core Support: Narrow supply range (1.71 V to 1.89 V) simplifies power-rail planning for low-voltage systems.
• RoHS Compliant: Conforms to RoHS requirements for restricted substances in manufacturing.

Why Choose XA2S150E-6FT256I?

The XA2S150E-6FT256I positions itself as a capable, automotive-qualified FPGA that balances programmable logic capacity, on-chip memory, and a large I/O set in a compact 256-LBGA package. It is appropriate for designers who need moderate logic resources, high I/O density, and qualification to AEC-Q100 within well-defined voltage and temperature constraints.

Manufactured by AMD and built on the Spartan-IIE XA family, this device provides a pragmatic option for engineers developing automotive, embedded, and industrial applications that require reliable programmable logic with clear, verifiable specifications.

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