XA2S300E-6FT256I

The XA2S300E-6FT256I is a Spartan®-IIE XA Field Programmable Gate Array (FPGA) from AMD designed for embedded control and signal processing applications that require a balance of logic capacity, I/O density, and rugged operating conditions. Architected around 1536 CLBs and 6912 logic elements, it provides an integrated platform for custom digital function implementation.

Key strengths include approximately 65 kbits of on‑chip RAM, up to 182 user I/O, a 300,000‑gate equivalent capacity, and qualification to AEC‑Q100. The device operates across a wide temperature range and a narrow core supply window, making it suitable for systems with demanding environmental and reliability requirements.

Key Features

• Core Logic  1536 CLBs (configurable logic blocks) delivering 6912 logic elements and a 300,000‑gate equivalent capacity for implementing custom digital logic.
• Embedded Memory  Approximately 65 kbits of on‑chip RAM (65,536 bits) for buffering, state storage, and small data structures without external memory.
• I/O Density  Up to 182 user I/O pins to support multi‑signal interfaces and complex peripheral connectivity.
• Package & Mounting  256‑LBGA package (supplier package: 256‑FTBGA, 17×17) optimized for surface mount assembly.
• Power  Core supply voltage range of 1.71 V to 1.89 V for defined power budgeting in system designs.
• Temperature & Qualification  Operating temperature range from −40 °C to 100 °C and AEC‑Q100 qualification, supporting use in automotive applications and other temperature‑challenging environments.
• Environmental Compliance  RoHS compliant to meet common regulatory requirements for hazardous substances.

Typical Applications

• Automotive control modules  Suitable for automotive electronics that benefit from AEC‑Q100 qualification and a wide operating temperature range.
• Embedded and industrial control  Well suited for control logic, state machines, and I/O‑intensive embedded systems operating in harsh environments.
• Custom digital processing  Implement application‑specific processing blocks and glue logic using the device’s CLBs and on‑chip RAM.

Unique Advantages

• Balanced logic and memory resources: 1536 CLBs with 6912 logic elements plus approximately 65 kbits of on‑chip RAM provide a compact platform for integrated digital functions without immediate reliance on external memory.
• High I/O count: 182 I/O pins enable connection to multiple peripherals and sensors directly, reducing the need for external multiplexing.
• Automotive‑grade qualification: AEC‑Q100 qualification and −40 °C to 100 °C operating range support deployment in automotive and other temperature‑sensitive applications.
• Compact BGA package: 256‑LBGA (256‑FTBGA, 17×17) offers a small footprint and surface‑mount compatibility for space‑constrained boards.
• Tight core voltage window: Defined supply range (1.71 V to 1.89 V) aids in predictable power design and regulation selection.
• Regulatory compliance: RoHS compliance simplifies environmental qualification and supply chain acceptance.

Why Choose XA2S300E-6FT256I?

The XA2S300E-6FT256I positions itself as a reliable, mid‑capacity FPGA option for designs requiring a combination of moderate logic density, substantial I/O, and automotive‑grade qualification. Its CLB count, embedded memory, and 182 I/O make it a practical choice for embedded control, custom logic, and I/O‑heavy applications where environmental robustness and compliance are important.

Engineers and procurement teams looking for a surface‑mount FPGA with AEC‑Q100 qualification, a compact 256‑LBGA footprint, and clear power and temperature specifications will find the XA2S300E-6FT256I a strong candidate for production and long‑lifecycle deployments.

Request a quote or contact sales to discuss availability, pricing, and lead times for the XA2S300E-6FT256I.