XA3S1000-4FGG456I

The XA3S1000-4FGG456I is a Spartan®-3 XA field programmable gate array (FPGA) IC from AMD, delivered in a 456-ball BGA package. It combines a substantial logic capacity and I/O density with on-chip embedded memory and a low-voltage core supply, making it suitable for compact, high-functionality electronic systems.

With AEC-Q100 qualification and an operating range of −40 °C to 100 °C, this device is positioned for automotive-grade applications and other environments requiring temperature robustness and board-level surface-mount integration.

Key Features

• Logic Capacity — 17,280 logic elements, supporting complex custom logic and control functions.
• Configurable Logic Blocks — Logical resources sized to accommodate a wide range of combinational and sequential designs.
• Embedded Memory — Approximately 0.44 Mbits of on-chip RAM (442,368 bits) for buffering, state storage, and small data tables.
• I/O Density — 333 user I/O pins to connect sensors, actuators, high-speed interfaces, and peripheral devices.
• Gate Density — Approximately 1,000,000 gates for implementing sizeable logic networks and control algorithms.
• Power — Core voltage supply range of 1.14 V to 1.26 V to match low-voltage FPGA power domains.
• Package & Mounting — 456-ball BGA package (supplier device package: 456-FBGA, 23 × 23 mm), surface-mount for compact board designs.
• Automotive Qualification & Temperature Range — AEC-Q100 qualified and rated for −40 °C to 100 °C operation for automotive-grade deployment.
• RoHS Compliant — Meets RoHS requirements for hazardous-substance restrictions in electronic assemblies.

Typical Applications

• Automotive Electronic Control Units (ECUs) — Use the device’s AEC-Q100 qualification, temperature range, and robust logic resources for vehicle control and subsystem processing.
• High-Density I/O Interfaces — Leverage 333 I/O pins for systems requiring multiple sensor inputs, communication links, or peripheral interfaces.
• Embedded Logic and Control — Deploy the 17,280 logic elements and on-chip RAM for real-time control, state machines, and protocol handling in embedded designs.

Unique Advantages

• Automotive-Ready Qualification — AEC-Q100 qualification and a −40 °C to 100 °C operating range support deployment in automotive environments.
• Balanced Integration — A combination of logic elements, embedded RAM, and high I/O count reduces external component needs and simplifies board-level integration.
• Compact BGA Packaging — 456-ball BGA (23 × 23 mm) and surface-mount compatibility allow high-density PCB layouts for space-constrained applications.
• Low-Voltage Core — Narrow core supply range (1.14 V–1.26 V) enables integration with modern low-voltage power architectures.
• Regulatory Compliance — RoHS compliance supports environmentally-conscious product design and global market acceptance.

Why Choose XA3S1000-4FGG456I?

The XA3S1000-4FGG456I delivers a practical balance of logic capacity, embedded memory, and I/O density in an automotive-qualified FPGA package. Its combination of approximately 17,280 logic elements, roughly 0.44 Mbits of on-chip RAM, and 333 I/Os makes it suitable for embedded control and interface-rich designs where board space and reliability under temperature stress are important.

This device is appropriate for engineers and teams designing automotive systems or other temperature-challenged embedded applications who need a surface-mount FPGA with verified qualification, compact packaging, and measurable resource counts for planning and BOM decisions.

Request a quote or submit an RFQ to obtain pricing and lead-time information for XA3S1000-4FGG456I. Our team will respond with availability and ordering details specific to your project needs.