XA3S1000-4FGG456Q

The XA3S1000-4FGG456Q is a Spartan®-3 XA field programmable gate array (FPGA) from AMD, delivering a balance of logic density, on-chip memory, and I/O capacity in a compact BGA package. It targets embedded and control applications that require substantial programmable logic (17,280 logic elements), approximately 0.44 Mbits of embedded memory and up to 333 I/O pins.

Qualified to AEC-Q100 and rated for operation from −40°C to 125°C with a 1.14 V to 1.26 V core supply, this device is suitable for designs that need extended temperature range and automotive-grade qualification while maintaining a surface-mount, high-density package footprint.

Key Features

• Core Logic — 17,280 logic elements providing flexible programmable logic capacity for custom digital functions and system glue logic.
• Embedded Memory — Approximately 0.44 Mbits of on-chip RAM (442,368 total RAM bits) to support buffering, FIFOs and small-data storage without external memory.
• I/O and Gate Count — Up to 333 I/O pins and approximately 1,000,000 gates to support complex interfacing and system partitioning.
• Package & Mounting — 456-BBGA package; supplier device package listed as 456-FBGA (23×23), with surface-mount mounting for compact PCB integration.
• Power — Core supply voltage range of 1.14 V to 1.26 V for integration with low-voltage system domains.
• Temperature & Qualification — Operating temperature range −40°C to 125°C and AEC-Q100 qualification suitable for automotive-grade designs.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Automotive control systems — Leverages AEC-Q100 qualification and extended temperature range for in-vehicle control, sensor interfacing and subsystem control functions.
• Industrial automation — Provides programmable logic and ample I/O for machine control, I/O aggregation and custom protocol handling in harsh temperature environments.
• Embedded system glue logic — Acts as a high-density interface and control hub where multiple peripherals and buses must be orchestrated through programmable logic.
• Communications and bridging — Suitable for protocol translation and interface bridging tasks that require significant I/O and logic resources.

Unique Advantages

• High logic density: 17,280 logic elements enable complex custom logic implementations without external ASIC development.
• On-chip memory for buffering: Approximately 0.44 Mbits of embedded RAM reduces reliance on external memory for small buffers and data paths.
• Extensive I/O: 333 I/O pins support a broad set of peripheral connections and parallel interfaces.
• Automotive-grade qualification: AEC-Q100 qualification and −40°C to 125°C range make the device suitable for temperature-demanding applications.
• Compact BGA footprint: 456-BBGA / 456-FBGA (23×23) packaging provides a high-density mounting option for space-constrained PCBs.
• RoHS compliant: Meets environmental compliance requirements for modern electronics manufacturing.

Why Choose XA3S1000-4FGG456Q?

The XA3S1000-4FGG456Q combines substantial programmable logic, on-chip memory and a high I/O count in a compact BGA package, making it a practical choice for embedded and control designs that require integration, reliability and an automotive-grade qualification. Its operating voltage and temperature range align with demanding system environments where robust electrical and thermal performance are required.

This device is well suited for engineers building systems that need significant custom logic capacity, reliable operation across extended temperatures, and a compact board-level footprint.

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